PHOCAM

Photopolymer based customized additive manufacturing technologies

 Coordinatore TECHNISCHE UNIVERSITAET WIEN 

 Organization address address: Karlsplatz 13
city: WIEN
postcode: 1040

contact info
Titolo: Prof.
Nome: Jürgen
Cognome: Stampfl
Email: send email
Telefono: +43 1 58801 30862
Fax: +43 1 5880130895

 Nazionalità Coordinatore Austria [AT]
 Sito del progetto http://www.phocam.eu
 Totale costo 3˙609˙446 €
 EC contributo 2˙455˙362 €
 Programma FP7-NMP
Specific Programme "Cooperation": Nanosciences, Nanotechnologies, Materials and new Production Technologies
 Code Call FP7-2010-NMP-ICT-FoF
 Funding Scheme CP
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-06-01   -   2013-05-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    TECHNISCHE UNIVERSITAET WIEN

 Organization address address: Karlsplatz 13
city: WIEN
postcode: 1040

contact info
Titolo: Prof.
Nome: Jürgen
Cognome: Stampfl
Email: send email
Telefono: +43 1 58801 30862
Fax: +43 1 5880130895

AT (WIEN) coordinator 667˙125.00
2    IN-VISION DIGITAL IMAGING OPTICS GMBH

 Organization address address: INDUSTRIESTRASSE 9/6
city: GUNTRAMSDORF
postcode: 2353

contact info
Titolo: Mr.
Nome: Wolfgang
Cognome: Pferscher
Email: send email
Telefono: +43 2236 304344
Fax: +43 223630434433

AT (GUNTRAMSDORF) participant 443˙310.00
3    LZH LASERZENTRUM HANNOVER E.V.

 Organization address address: HOLLERITHALLEE 8
city: HANNOVER
postcode: 30419

contact info
Titolo: Prof.
Nome: Boris
Cognome: Chichkov
Email: send email
Telefono: 495113000000
Fax: 495113000000

DE (HANNOVER) participant 398˙880.00
4    SIEMENS AKTIENGESELLSCHAFT

 Organization address address: Wittelsbacherplatz 2
city: MUNCHEN
postcode: 80333

contact info
Titolo: Mr.
Nome: Martin
Cognome: Schaefer
Email: send email
Telefono: +49 30 386 23087
Fax: +49 30 386 23441

DE (MUNCHEN) participant 276˙147.00
5    VISITECH AS

 Organization address address: KJELLSTADVEIEN 5
city: LIER
postcode: 3400

contact info
Titolo: Mr.
Nome: Roy
Cognome: Almedal
Email: send email
Telefono: 4732227700
Fax: 4732227701

NO (LIER) participant 262˙250.00
6    DESKARTES OY

 Organization address address: OLARINLUOMA 7
city: ESPOO
postcode: 2200

contact info
Titolo: Mr.
Nome: Ismo
Cognome: Mäkelä
Email: send email
Telefono: -707084

FI (ESPOO) participant 239˙450.00
7    EMIL BROLL GMBH & CO

 Organization address address: RHOMBERG S FABRIK - SCHWARZ 7
city: DORNBIRN
postcode: 6850

contact info
Titolo: Dr.
Nome: Eckhard
Cognome: Sonntag
Email: send email
Telefono: +43 5572 24546
Fax: +43 5572 24546 5

AT (DORNBIRN) participant 168˙200.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

performance    quality    chain    sources    ceramic    photopolymers    lithography    parts    additive    time    resolution    light    technologies    supply    first    manufacturing   

 Obiettivo del progetto (Objective)

'Lithography based additive manufacturing technologies (AMT) are capable of fabricating parts with excellent surface quality, good feature resolution and precision. With recent developments in the field of ultra-short-pulse lasers and light engines based on light emitting diodes, robust and economical light sources have become available. This project aims at developing integrated lithography-based additive manufacturing systems which will, for the first time, facilitate the processing of photopolymer-based materials for the factory of the future. The focus of the project is to unite industrial know-how in the field of supply chain management, software development, photopolymers and ceramics, high-performance light-sources, system integration and end-users in order to provide a fully integrated process chain at the end of the project. The consortium will rely on two core-technologies: (1) Digital light processing (DLP) based processes will be used to process ceramic-filled photopolymers, leading to fully dense ceramic parts at the end of the process chain. (2) Two photon polymerization (2PP) will be used to fabricate high-resolution structures with features in the range of 100-200nm. Both processes will be tuned to reduce system cost, and significantly increase throughput and reliability at the same time. Goal is to deliver 'first-time-right' strategies for the involved end-users. This necessitates the development of supply chains with integrated quality sensors. Targeted applications include thread guides for textile machinery, ceramic moulds for the fabrication of high-performance turbine blades and microstructures for computer tomography equipment.'

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