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INSTET SIGNED

Securing the Internet of Things with a unique microchip fingerprinting technology

Total Cost €

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EC-Contrib. €

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Partnership

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Project "INSTET" data sheet

The following table provides information about the project.

Coordinator
INTRINSIC ID B.V. 

Organization address
address: HIGH TECH CAMPUS 9
city: EINDHOVEN
postcode: 5656 AE
website: www.intrinsic-id.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Project website https://www.intrinsic-id.com/sram-puf/collaborative-research-projects/instet-research-project/
 Total cost 2˙496˙362 €
 EC max contribution 1˙747˙453 € (70%)
 Programme 1. H2020-EU.3. (PRIORITY 'Societal challenges)
2. H2020-EU.2.3. (INDUSTRIAL LEADERSHIP - Innovation In SMEs)
3. H2020-EU.2.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies)
 Code Call H2020-SMEInst-2018-2020-2
 Funding Scheme SME-2
 Starting year 2018
 Duration (year-month-day) from 2018-06-01   to  2020-05-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTRINSIC ID B.V. NL (EINDHOVEN) coordinator 1˙747˙453.00

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 Project objective

Intrinsic ID is a Dutch SME, a spin-off from Philips Research, a world leader in security solutions for chips, with 25 patents. Intrinsic ID has created a technology to uniquely identify & authenticate chips based on the inherent characteristics of their memory component (SRAM). This technology called Physical Unclonable Function (PUF) is a digital equivalent of a fingerprint. Intrinsic ID is working on INSTET—a fully-fledged security solution on top of PUF that will protect low-end chips that are omnipresent in IoT devices everywhere by making them physically & cryptographically secure and very resilient to advanced attacks. INSTET will work as a Root of Trust—a set of core software components that are always trusted by the chip, and provide a trust foundation for the IoT device & distributed IoT systems. INSTET addresses the core problem of semiconductor vendors and OEMs—lack of security. INSTET can be deployed on almost any chip, including the ones that are already in the field, without costly redesigns or additional hardware, generating savings of up to 90% per chip. Intrinsic ID has successfully completed an SME Instrument Phase 1 feasibility study & validated business opportunities in wearables, medical electronics & critical infrastructure verticals. In this 2-year Phase 2 project Intrinsic ID will complete industrialization of INSTET, validate it in 3 trial cases & start commercialization. The total requested EC contribution is €1,75m. Intrinsic ID is the sole benefactor & the party responsible for implementation of this Phase 2 project.

 Deliverables

List of deliverables.
Marketing material for each vertical Websites, patent fillings, videos etc. 2020-03-06 16:02:27
Additional promotional material Websites, patent fillings, videos etc. 2019-08-29 13:29:33

Take a look to the deliverables list in detail:  detailed list of INSTET deliverables.

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The information about "INSTET" are provided by the European Opendata Portal: CORDIS opendata.

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