TOP HIT project deliverables
The page lists 2 deliverables related to the research project "TOP HIT".
List of Deliverables
| title and desprition | type | last update |
|---|---|---|
Plan for access to technologyDuring the second phase a business plan will be drawn up to explore the different options by which the technology can be made widely available through foundry-like processes. This report will address the supply of transferrable components, the foundries to perform the transfer print and the foundries to perform the interconnections and device singulation. The wafer size (75mm-200mm) and compatibility (eg Au, topography issues) of the needed processes will be addressed. Programme: H2020-EU.2.1.1.1. - Topic(s): ICT-02-2014 |
Documents, reports | 2019-07-23 |
NewsletterA newsletter explaining and promoting and TOP HIT technology and its objectives will written and circulated to all interested parties. Programme: H2020-EU.2.1.1.1. - Topic(s): ICT-02-2014 |
Documents, reports | 2019-07-23 |