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MaMs2

Platform for Heterogeneous Integration of NEMS on ICs

Total Cost €

EC-Contrib. €

Partnership

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MaMs2 project word cloud

Explore the words cloud of the MaMs2 project. It provides you a very rough idea of what is the project "MaMs2" about.

ir ic device 3d volume realized usa within starting foundry standard ics nm micro acute detector international markets dimensions competing respect invensense billion miniaturized taiwan contrast heterogeneous paradigm platform moore infrared roadmap fpgas circuits small accuracies performance microphones variety electromechanical ultra nano wafer gyroscopes grant nems arrays itrs exploring extremely m combination placement suitable tsmc semiconductors proof mu first mcube mirror cmos depicted 277879 erc sized world components s2 nem sub limitations platforms form manufacture innovative market mems power commercialized manufacturing switches accelerometers 1 integration technologies

Project "MaMs2" data sheet

The following table provides information about the project.

Coordinator	KUNGLIGA TEKNISKA HOEGSKOLAN Organization address address: BRINELLVAGEN 8 city: STOCKHOLM postcode: 100 44 website: www.kth.se contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Sweden [SE]
Total cost	150˙000 €
EC max contribution	150˙000 € (100%)
Programme	1. H2020-EU.1.1. (EXCELLENT SCIENCE - European Research Council (ERC))
Code Call	ERC-2015-PoC
Funding Scheme	ERC-POC
Starting year	2015
Duration (year-month-day)	from 2015-07-01 to 2016-12-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	KUNGLIGA TEKNISKA HOEGSKOLAN KUNGLIGA TEKNISKA HOEGSKOLAN Organization address address: BRINELLVAGEN 8 city: STOCKHOLM postcode: 100 44 website: www.kth.se contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	SE (STOCKHOLM)	coordinator	150˙000.00

Map

Project objective

Within the ERC-M&M´s Starting Grant project (No.277879) we are exploring an innovative platform technology for wafer-level heterogeneous integration of integrated circuits (ICs) with micro/nano-electromechanical systems (MEMS/NEMS). This type of heterogeneous 3D integration technology is part of the More-than-Moore paradigm depicted in the International Technology Roadmap for Semiconductors (ITRS) and allows the combination of standard CMOS-based integrated circuits and high-performance MEMS devices to form complex and highly integrated systems that are not possible to manufacture with other micro-manufacturing approaches. First heterogeneous integration platforms for IC-integrated MEMS products have already been commercialized with great success by InvenSense (USA) and by mCube (USA) in collaboration with TSMC (Taiwan), the world’s largest CMOS foundry. However, the established heterogeneous integration technologies have limitations with respect to the type of MEMS devices that can be realized and the extent to which the MEMS-ICs system component can be miniaturized. The heterogeneous integration platform developed in this ERC-M&M’s2 Proof of Concept proposal is suitable for a variety of small-sized MEMS components with large-volume markets, including infrared (IR) detector arrays, micro-mirror arrays, ultra-low power circuits based on NEM switches (a specific target application are low-power FPGAs), gyroscopes, accelerometers, microphones, etc. Thus, the heterogeneous integration platform is addressing a potential multi-billion € market. In contrast to the competing technologies, our heterogeneous integration platform is enabling the integration of ICs and MEMS/NEMS devices with extremely small device dimensions in the nm-range, very small via dimensions in the sub-1μm-range and placement accuracies of the MEMS/NEMS components on the target ICs in the nm-range.

Publications

List of publications.
year	authors and title	journal	last update
2017	X Wang, SJ Bleiker, M Antelius, G Stemme, F Niklaus Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint published pages: 1-9, ISSN: 1057-7157, DOI: 10.1109/JMEMS.2017.2654510	Journal of Microelectromechanical Systems PP, 99	2019-07-25

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The information about "MAMS2" are provided by the European Opendata Portal: CORDIS opendata.