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3DAM SIGNED

3D Advanced Metrology and materials for advanced devices

Total Cost €

EC-Contrib. €

Partnership

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Outcomes and
results

3DAM project word cloud

Explore the words cloud of the 3DAM project. It provides you a very rough idea of what is the project "3DAM" about.

link moving defect interfaces combining companies industry linked demonstrators front semiconductor fit 3dam defects faster compositional ensured line ic full met manufacturers electronics generate cycle 3d ecsel imec back supports nm ramp strain electrical enabled 2d moore architectures device leti characterization finfets competitiveness strained technologies area benefit closely special complements subsection accelerated pilot evaluation critical nodes crystal manufacturing metrology innovative participation techniques cd structural workflows themes boundaries connected masp limits generation alloys planar silicon materials tools pushing nano correlated

Project "3DAM" data sheet

The following table provides information about the project.

Coordinator	FEI ELECTRON OPTICS BV Organization address address: ACHTSEWEG NOORD GEBOUW AAE 5 city: EINDHOVEN postcode: 5651 GG website: www.fei.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Netherlands [NL]
Project website	https://www.ecsel.eu/projects/3dam
Total cost	23˙055˙897 €
EC max contribution	6˙463˙826 € (28%)
Programme	1. H2020-EU.2.1.1.7. (ECSEL)
Code Call	H2020-ECSEL-2015-1-RIA-two-stage
Funding Scheme	ECSEL-RIA
Starting year	2016
Duration (year-month-day)	from 2016-04-01 to 2019-03-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	FEI ELECTRON OPTICS BV FEI ELECTRON OPTICS BV Organization address address: ACHTSEWEG NOORD GEBOUW AAE 5 city: EINDHOVEN postcode: 5651 GG website: www.fei.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	coordinator	1˙110˙812.00
2	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	873˙666.00
3	APPLIED MATERIALS ISRAEL LTD APPLIED MATERIALS ISRAEL LTD Organization address address: OPPENHEIMER STREET 9 city: REHOVOT postcode: 76705 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (REHOVOT)	participant	740˙625.00
4	NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO Organization address address: ANNA VAN BUERENPLEIN 1 city: DEN HAAG postcode: 2595 DA website: www.tno.nl contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (DEN HAAG)	participant	628˙813.00
5	NOVA MEASURING INSTRUMENTS LTD NOVA MEASURING INSTRUMENTS LTD Organization address address: WEIZMANN SCIENCE PARK BUILDING 22 city: REHOVOT postcode: 76100 website: www.nova.co.il contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (REHOVOT)	participant	600˙000.00
6	SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG Organization address address: PRIELLE KORNELIA UTCA 4/A. city: BUDAPEST postcode: 1117 website: www.semilab.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	HU (BUDAPEST)	participant	531˙250.00
7	COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES Organization address address: RUE LEBLANC 25 city: PARIS 15 postcode: 75015 website: www.cea.fr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (PARIS 15)	participant	525˙062.00
8	BRUKER JV ISRAEL LTD BRUKER JV ISRAEL LTD Organization address address: 6 HAMECHKAR STREET RAMAT GAVRIEL INDUSTRIAL ZONE city: MIGDAL HAEMEK postcode: 2306990 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (MIGDAL HAEMEK)	participant	381˙093.00
9	CAMECA CAMECA Organization address address: Quai de Gresillons 29 city: Gennevilliers postcode: 92622 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (Gennevilliers)	participant	344˙562.00
10	FEI SAS FEI SAS Organization address address: IMPASSE RUDOLF DIESEL 3 city: MERIGNAC postcode: 33700 website: www.vsg3d.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (MERIGNAC)	participant	207˙500.00
11	DANMARKS TEKNISKE UNIVERSITET DANMARKS TEKNISKE UNIVERSITET Organization address address: ANKER ENGELUNDSVEJ 1 BYGNING 101 A city: KGS LYNGBY postcode: 2800 website: www.dtu.dk contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DK (KGS LYNGBY)	participant	191˙258.00
12	TECHNISCHE UNIVERSITEIT EINDHOVEN TECHNISCHE UNIVERSITEIT EINDHOVEN Organization address address: GROENE LOPER 3 city: EINDHOVEN postcode: 5612 AE website: www.tue.nl/en contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	participant	145˙179.00
13	ADAMA INNOVATIONS LIMITED ADAMA INNOVATIONS LIMITED Organization address address: CRANN TRINITY COLLEGE DUBLIN city: DUBLIN postcode: 2 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (DUBLIN)	participant	90˙810.00
14	CAPRES AS CAPRES AS Organization address address: DIPLOMVEJ 373 city: KGS. LYNGBY postcode: 2800 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DK (KGS. LYNGBY)	participant	77˙474.00
15	APPLIED MATERIALS FRANCE APPLIED MATERIALS FRANCE Organization address address: 864 CHEMIN DES FONTAINES city: BERNIN postcode: 38190 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (BERNIN)	participant	15˙718.00
16	ATTOLIGHT SA ATTOLIGHT SA Organization address address: EPFL INNOVATION PARK BUILDING D city: LAUSANNE postcode: 1015 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	CH (LAUSANNE)	participant	0.00
17	STMICROELECTRONICS CROLLES 2 SAS STMICROELECTRONICS CROLLES 2 SAS Organization address address: RUE JEAN MONNET 850 city: CROLLES postcode: 38920 website: www.st.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (CROLLES)	participant	0.00

Map

Project objective

The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM will be a path-finding project which supports and complements several existing and future ECSEL pilot-line projects and is linked to the MASP area 7.1 (subsection More Moore). Innovative demonstrators and methodologies will be built and evaluated within the themes of metrology and characterization of 3D device architectures and new materials, across the full IC manufacturing cycle from Front to Back-End-Of-Line. 3D structural metrology and defect analysis techniques will be developed and correlated to address challenges around 3D CD, strain and crystal defects at the nm scale. 3D compositional analysis and electrical properties will be investigated with special attention to interfaces, alloys and 2D materials. The project will develop new workflows combining different technologies for more reliable and faster results; fit for use in future semiconductor processes.

The consortium includes major European semiconductor equipment companies in the area of metrology and characterization. The link to future needs of the industry, as well as critical evaluation of concepts and demonstrators, is ensured by the participation of IMEC and LETI. The project will directly increase the competitiveness of the strong Europe-based semiconductor Equipment industry. Closely connected European IC manufacturers will benefit by accelerated R&D and process ramp-up. The project will generate technologies essential for future semiconductor processes and for the applications enabled by the new technology nodes.

Deliverables

List of deliverables.
Workshops year 3 and publication of presented material	Websites, patent fillings, videos etc.	2020-04-23 03:10:52
Workshops year 2 and publication of presented material	Websites, patent fillings, videos etc.	2020-04-23 03:10:52
Workshops year 1 and publication of presented material	Websites, patent fillings, videos etc.	2020-04-23 03:10:52

Take a look to the deliverables list in detail: detailed list of 3DAM deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2018	Patrick R. Whelan, Vishal Panchal, Dirch H. Petersen, David M. A. Mackenzie, Christos Melios, Iwona Pasternak, John Gallop, Frederik W. Ã˜sterberg, Peter U. Jepsen, Wlodek Strupinski, Olga Kazakova, Peter BÃ¸ggild Electrical Homogeneity Mapping of Epitaxial Graphene on Silicon Carbide published pages: 31641-31647, ISSN: 1944-8244, DOI: 10.1021/acsami.8b11428	ACS Applied Materials & Interfaces 10/37	2020-04-23
2018	J. Bogdanowicz et al. Widthâ€Dependent Sheet Resistance of Nanometerâ€Wide Si Fins as Measured with Micro Fourâ€Point Probe published pages: , ISSN: 1862-6319, DOI:	physica status solidi (a) volume 215 (6) 2018	2020-04-23
2017	V. Vandalon, A.A. Bol, W.M.M. Kessels Second-harmonic generation and Raman spectroscopy probing charge density and orientation of atomic-layer deposited MoS2 published pages: , ISSN: , DOI:	Material Research Seminar	2020-04-23
2018	Joyce Roque, Georges Beainy, NÃ©vine Rochat, Nicolas Bernier, Sylvain David, JÃ©rÃ©my Moeyaert, Mickael Martin, Thierry Baron, Jean-Luc RouviÃ¨re Comprehension of peculiar local emission behavior of InGaAs quantum well by colocalized nanocharacterization combining cathodoluminescence and electron microscopy techniques published pages: 42901, ISSN: 2166-2754, DOI: 10.1116/1.5033363	Journal of Vacuum Science & Technology B 36/4	2020-04-23
2018	David M. A. Mackenzie, Patrick R. Whelan, Peter BÃ¸ggild, Peter Uhd Jepsen, Albert Redo-Sanchez, David Etayo, Norbert Fabricius, Dirch Hjorth Petersen Quality assessment of terahertz time-domain spectroscopy transmission and reflection modes for graphene conductivity mapping published pages: 9220, ISSN: 1094-4087, DOI: 10.1364/oe.26.009220	Optics Express 26/7	2020-04-23
2017	H. Bender, F. Seidel, P. Favia, O. Richard, W. Vandervorst X-ray absorption in pillar shaped transmission electron microscopy specimens published pages: 58-68, ISSN: 0304-3991, DOI: 10.1016/j.ultramic.2017.03.006	Ultramicroscopy 177	2020-04-23
2017	Thomas Nuytten, Janusz Bogdanowicz, Thomas Hantschel, Andreas Schulze, Paola Favia, Hugo Bender, Ingrid De Wolf, Wilfried Vandervorst Advanced Raman Spectroscopy Using Nanofocusing of Lightâ€‰ published pages: 1600612, ISSN: 1438-1656, DOI: 10.1002/adem.201600612	Advanced Engineering Materials	2020-04-23
2017	Zhichao Zhong, Bart Goris, Remco Schoenmakers, Sara Bals, K. Joost Batenburg A bimodal tomographic reconstruction technique combining EDS-STEM and HAADF-STEM published pages: 35-45, ISSN: 0304-3991, DOI: 10.1016/j.ultramic.2016.12.008	Ultramicroscopy 174	2020-04-23
2017	A Schulze, R Loo, P Ryan, M Wormington, P Favia, L Witters, N Collaert, H Bender, W Vandervorst, M Caymax Observation and understanding of anisotropic strain relaxation in selectively grown SiGe fin structures published pages: 145703, ISSN: 0957-4484, DOI: 10.1088/1361-6528/aa5fbb	Nanotechnology 28/14	2020-04-23

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