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TAKE5 SIGNED

Technology Advances and Key Enablers for 5 nm

Total Cost €

EC-Contrib. €

Partnership

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Outcomes and
results

TAKE5 project word cloud

Explore the words cloud of the TAKE5 project. It provides you a very rough idea of what is the project "TAKE5" about.

interaction qualified prototyping 1d node core 7nm eniac ket law exploration semiconductor technologies 300mm holistic pilot center accuracy 5nm lithography solutions masp introduction volume precision imec geometries co deposition touches connected module anniversary thematically ju brings cmos 50th line platform lithographic take5 structuring options itrs subsequent continuation comprising 10nm senate celebrated demonstration scanner modules appropriate device metrology ecsel industry relates moore innovative fast discovery euv layout 2d resolution platforms electronic optimization architecture manufacturing materials covers 3d 450mm patterning chain will nano roadmap etch specification

Project "TAKE5" data sheet

The following table provides information about the project.

Coordinator	ASML NETHERLANDS B.V. Organization address address: DE RUN 6501 city: VELDHOVEN postcode: 5504DR website: www.asml.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Netherlands [NL]
Total cost	149˙882˙181 €
EC max contribution	28˙364˙017 € (19%)
Programme	1. H2020-EU.2.1.1.7. (ECSEL)
Code Call	H2020-ECSEL-2015-2-IA-two-stage
Funding Scheme	ECSEL-IA
Starting year	2016
Duration (year-month-day)	from 2016-04-01 to 2019-03-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	ASML NETHERLANDS B.V. ASML NETHERLANDS B.V. Organization address address: DE RUN 6501 city: VELDHOVEN postcode: 5504DR website: www.asml.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (VELDHOVEN)	coordinator	9˙450˙000.00
2	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	9˙039˙656.00
3	CARL ZEISS SMT GMBH CARL ZEISS SMT GMBH Organization address address: RUDOLF EBER STRASSE 2 city: OBERKOCHEN postcode: 73447 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (OBERKOCHEN)	participant	3˙600˙000.00
4	APPLIED MATERIALS ISRAEL LTD APPLIED MATERIALS ISRAEL LTD Organization address address: OPPENHEIMER STREET 9 city: REHOVOT postcode: 76705 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (REHOVOT)	participant	2˙081˙250.00
5	NOVA MEASURING INSTRUMENTS LTD NOVA MEASURING INSTRUMENTS LTD Organization address address: WEIZMANN SCIENCE PARK BUILDING 22 city: REHOVOT postcode: 76100 website: www.nova.co.il contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (REHOVOT)	participant	1˙500˙000.00
6	KLA-TENCOR CORPORATION (ISRAEL) KLA-TENCOR CORPORATION (ISRAEL) Organization address address: HATIKSHORET ST. city: MIGDAL HAEMEK postcode: 23100 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (MIGDAL HAEMEK)	participant	901˙379.00
7	BRUKER JV ISRAEL LTD BRUKER JV ISRAEL LTD Organization address address: 6 HAMECHKAR STREET RAMAT GAVRIEL INDUSTRIAL ZONE city: MIGDAL HAEMEK postcode: 2306990 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (MIGDAL HAEMEK)	participant	662˙250.00
8	FEI ELECTRON OPTICS BV FEI ELECTRON OPTICS BV Organization address address: ACHTSEWEG NOORD GEBOUW AAE 5 city: EINDHOVEN postcode: 5651 GG website: www.fei.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	participant	559˙050.00
9	COVENTOR SARL COVENTOR SARL Organization address address: AVENUE DU QUEBEC 3 city: VILLEBON SUR YVETTE postcode: 91140 website: www.coventor.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (VILLEBON SUR YVETTE)	participant	387˙156.00
10	FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. Organization address address: HANSASTRASSE 27C city: MUNCHEN postcode: 80686 website: www.fraunhofer.de contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (MUNCHEN)	participant	123˙268.00
11	ASM BELGIUM NV ASM BELGIUM NV Organization address address: KAPELDREEF 75 city: HEVERLEE postcode: 3001 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (HEVERLEE)	participant	58˙300.00
12	LAM RESEARCH BELGIUM LAM RESEARCH BELGIUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	1˙706.00

Map

Project objective

The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 10nm technology node and the ECSEL JU project SeNaTe aiming at the 7nm technology node. The main objective of the TAKE5 project is the demonstration of 5nm patterning in line with the industry needs and the ITRS roadmap in the Advanced Patterning Center at the imec pilot line using innovative design and technology co-optimization, layout and device architecture exploration, and comprising demonstration of a lithographic platform for EUV technology, advanced process and holistic metrology platforms and new materials. A lithography scanner will be developed based on EUV technology to achieve the 5nm module patterning specification. Metrology platforms need to be qualified for 5nm patterning of 1D, 2D and 3D geometries with the appropriate precision and accuracy. For the 5nm technology modules new materials will need to be introduced. Introduction of these new materials brings challenges for all involved deposition processes and the related equipment set. Next to new deposition processes also the interaction of the involved materials with subsequent etch steps will be studied. The project will be dedicated to find the best options for patterning. The project relates to the ECSEL work program topic Process technologies – More Moore. It addresses and targets as set out in the MASP at the discovery of new Semiconductor Process, Equipment and Materials solutions for advanced CMOS processes that enable the nano-structuring of electronic devices with 5nm resolution in high-volume manufacturing and fast prototyping. The project touches the core of the continuation of Moore’s law which has celebrated its 50th anniversary and covers all aspects of 5nm patterning development.

Publications

List of publications.
year	authors and title	journal	last update
2017	Elizabeth Buitrago, Marieke Meeuwissen, Oktay Yildirim, Rolf Custers, Rik Hoefnagels, Gijsbert Rispens, Michaela Vockenhuber, Iacopo Mochi, Roberto Fallica, Zuhal Tasdemir, Yasin Ekinci State-of-the-art EUV materials and processes for the 7nm node and beyond published pages: 101430T, ISSN: , DOI: 10.1117/12.2260153	Extreme Ultraviolet (EUV) Lithography VIII 2017	2020-04-23
2019	Tal Itzkovich; Aner Avakrat; Shimon Levi; Omri Baum; Noam Amit; Kevin Houchens SEM inspection and review method for addressing EUV stochastic defects published pages: , ISSN: , DOI:	SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109591S (7 May 2019) 2019	2020-04-23
2017	Alberto Pirati, Jan van Schoot, Kars Troost, Rob van Ballegoij, Peter Krabbendam, Judon Stoeldraijer, Erik Loopstra, Jos Benschop, Jo Finders, Hans Meiling, Eelco van Setten, Niclas Mika, Jeannot Dredonx, Uwe Stamm, Bernhard Kneer, Bernd Thuering, Winfried Kaiser, Tilmann Heil, Sascha Migura The future of EUV lithography: enabling Moore\'s Law in the next decade published pages: 101430G, ISSN: , DOI: 10.1117/12.2261079	Extreme Ultraviolet (EUV) Lithography VIII 2017	2020-04-23
2017	Vivek Bakshi, Hakaru Mizoguchi, Ted Liang, Andrew Grenville, Jos Benschop Special Section Guest Editorial: EUV Lithography for the 3-nm Node and Beyond published pages: 1, ISSN: 1932-5150, DOI: 10.1117/1.jmm.16.4.041001	Journal of Micro/Nanolithography, MEMS, and MOEMS 16/04	2020-04-23
2017	Mark van de Kerkhof, Hans Jasper, Leon Levasier, Rudy Peeters, Roderik van Es, Jan-Willem Bosker, Alexander Zdravkov, Egbert Lenderink, Fabrizio Evangelista, Par Broman, Bartosz Bilski, Thorsten Last Enabling sub-10nm node lithography: presenting the NXE:3400B EUV scanner published pages: 101430D, ISSN: , DOI: 10.1117/12.2258025	Extreme Ultraviolet (EUV) Lithography VIII 2017	2020-04-23
2017	S. Guissi, W. F. Clark, A. Junker, J. Ervin, K. Greiner, D. Fried, B. Briggs, K. Devriendt, F. Sebaai, A. Charley, C. J. Wilson, J. Boemmels, Z. TÅ‘kei Modeling of Tone Inversion Process Flow for N5 Interconnect to Characterize Block Tip to Tip published pages: , ISSN: , DOI:	Proceedings of IEEE IITC INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE	2020-04-23

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