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HEATPACK SIGNED

new generation of High thErmAl efficiency componenTs PACKages for space

Total Cost €

EC-Contrib. €

Partnership

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HEATPACK project word cloud

Explore the words cloud of the HEATPACK project. It provides you a very rough idea of what is the project "HEATPACK" about.

materials critical substrate secure nitride supply solutions conductivity conditioning processor gan sections material modules amplifier multilayer strategic structure innovative notably digital hermetic power delivering benefits baseplate space assembly insert telecommunication hemt performance cooling demonstrating solid 400w resistance interface micro band single 600w heatpack implementing reliability 10w silver bandgap technologies sintering throughput compliant lid tim thermal electronic sectors galileo switching transparent composite enhanced conditioner output trl roadblock transformative gt possibilities diamond blocks packages chain linked validate module cw excess satellite building components levels electrical commercial environments gallium ceramic lifetime generation efficiency

Project "HEATPACK" data sheet

The following table provides information about the project.

Coordinator	THALES ALENIA SPACE FRANCE SAS Organization address address: AVENUE JEAN FRANCOIS CHAMPOLLION 26 city: TOULOUSE postcode: 31100 website: www.thalesaleniaspace.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	France [FR]
Total cost	2˙941˙298 €
EC max contribution	2˙941˙298 € (100%)
Programme	1. H2020-EU.2.1.6.1. (Enabling European competitiveness, non-dependence and innovation of the European space sector) 2. H2020-EU.2.1.6.2. (Enabling advances in space technology)
Code Call	H2020-SPACE-2018
Funding Scheme	RIA
Starting year	2019
Duration (year-month-day)	from 2019-01-01 to 2021-12-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	THALES ALENIA SPACE FRANCE SAS THALES ALENIA SPACE FRANCE SAS Organization address address: AVENUE JEAN FRANCOIS CHAMPOLLION 26 city: TOULOUSE postcode: 31100 website: www.thalesaleniaspace.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (TOULOUSE)	coordinator	617˙517.00
2	CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT Organization address address: RUE JAQUET DROZ 1 city: NEUCHATEL postcode: 2000 website: www.csem.ch contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	CH (NEUCHATEL)	participant	359˙850.00
3	ALTER TECHNOLOGY TUV NORD UK LIMITED ALTER TECHNOLOGY TUV NORD UK LIMITED Organization address address: BAIN SQUARE 5 city: LIVINGSTON postcode: EH54 7DQ website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (LIVINGSTON)	participant	320˙000.00
4	EGIDE SA EGIDE SA Organization address address: SITE INDUSTRIEL DU SACTAR city: BOLLENE postcode: 84500 website: www.egide.fr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (BOLLENE)	participant	308˙623.00
5	UNIVERSITY OF BRISTOL UNIVERSITY OF BRISTOL Organization address address: BEACON HOUSE QUEENS ROAD city: BRISTOL postcode: BS8 1QU website: www.bristol.ac.uk contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (BRISTOL)	participant	279˙392.00
6	RHP TECHNOLOGY GMBH RHP TECHNOLOGY GMBH Organization address address: FORSCHUNGSZENTRUM SEIBERSDORF GEBAUDE CA city: SEIBERSDORF AN DER LEITHA postcode: 2444 website: www.rhp-technology.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	AT (SEIBERSDORF AN DER LEITHA)	participant	276˙875.00
7	POLITECHNIKA WARSZAWSKA POLITECHNIKA WARSZAWSKA Organization address address: PLAC POLITECHNIKI 1 city: WARSZAWA postcode: 00 661 website: http://www.pw.edu.pl contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	PL (WARSZAWA)	participant	269˙630.00
8	ALTER TECHNOLOGY TUV NORD SA ALTER TECHNOLOGY TUV NORD SA Organization address address: CALLE TOMAS ALBA EDISON 4 ISLA DE LA CARTUJA city: SEVILLA postcode: 41092 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	ES (SEVILLA)	participant	258˙035.00
9	ADAMANT AERODIASTIMIKES EFARMOGES ETAIREIA PERIORISMENIS EFTHYNIS ADAMANT AERODIASTIMIKES EFARMOGES ETAIREIA PERIORISMENIS EFTHYNIS Organization address address: AGIAS LAVRAS THESI SKAMNIES city: ANO KASTRITSI-PATRAS postcode: 265 04 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	EL (ANO KASTRITSI-PATRAS)	participant	251˙375.00

Map

Project objective

HEATPACK project aims to develop and validate critical technology building blocks for enabling transformative packages for space applications with very low thermal resistance. This is to fully exploit the potential of wide-bandgap technologies which are now being considered as critical in numerous sectors and for space applications in particular, as enhanced thermal management solutions beyond state-of-the-art need to be provided. Benefits will range from improved performance to increased components reliability and lifetime. HEATPACK concepts for achieving high power / high thermal efficiency packages include: - Diamond based composite materials with a thermal conductivity >600W/m.K to be used as baseplate or insert - Silver sintering based Thermal Interface Material (TIM) for components assembly - TIM for package to structure assembly with both electrical and thermal enhanced properties (in excess of 10W/m.K) - Innovative cooling solutions with strategic implementation possibilities (baseplate, lid, structure…) Using these technologies, two different modules implementing Gallium Nitride (GaN) components will be developed: -A power supply switching module based on a multilayer ceramic substrate -A L-band High Power Amplifier based on a single hermetic micro package, delivering up to 400W CW output power The main application targeted is the Galileo Second Generation satellite program since thermal management of the GaN HEMT based Solid State Power Amplifier and Electronic Power Conditioner sections currently provide a roadblock due to the very high power levels involved. Other needs are linked to power conditioning notably for digital transparent processor targeting very high throughput satellite for telecommunication. To secure a fully European supply chain for high power components thermal management, the technologies developed will reach a TRL of 7, demonstrating commercial viable solutions providing reliability levels compliant with space environments.

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The information about "HEATPACK" are provided by the European Opendata Portal: CORDIS opendata.