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COMPUSAPIEN SIGNED

Computing Server Architecture with Joint Power and Cooling Integration at the Nanoscale

Total Cost €

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EC-Contrib. €

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Partnership

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 COMPUSAPIEN project word cloud

Explore the words cloud of the COMPUSAPIEN project. It provides you a very rough idea of what is the project "COMPUSAPIEN" about.

stack    drastic    heterogeneous    revolution    supply    collateral    failures    last    models    foundations    faster    completely    server    computers    energy    template    cell    electrochemical    semiconductor    compusapien    scalable    joint    revise    microfluidic    network    scaling    prevailing    cooling    grown    respect    dimensional    disruptive    consumption    fuel    performance    servers    predictive    core    software    scalability    limiting    designs    overheating    digital    paradigm    architectures    sustain    maximum    worst    surge    dissipated    heat    supplied    40    situation    demand    electronic    provisioning    architecture    controller    breakthrough    inspired    evolution    brain    innovations    guarantee    vision    savings    chip    3d    subsystem    computation    soaring    mammalian    computing    density    benefits    effect    risk    reward    cores    temperature    champions    levels    integrate    overcomes    temperatures    realize    undesirable    combined    remaining    power    holistic   

Project "COMPUSAPIEN" data sheet

The following table provides information about the project.

Coordinator		 ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE 

Organization address
address: BATIMENT CE 3316 STATION 1
city: LAUSANNE
postcode: 1015
website: www.epfl.ch

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.
 Coordinator Country Switzerland [CH]
 Total cost 1˙999˙281 €
 EC max contribution 1˙999˙281 € (100%)
 Programme 1. H2020-EU.1.1. (EXCELLENT SCIENCE - European Research Council (ERC))
 Code Call ERC-2016-COG
 Funding Scheme ERC-COG
 Starting year 2017
 Duration (year-month-day) from 2017-06-01   to  2022-05-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE CH (LAUSANNE) coordinator 1˙999˙281.00

Map

 Project objective

The soaring demand for computing power in the last years has grown faster than semiconductor technology evolution can sustain, and has produced as collateral undesirable effect a surge in power consumption and heat density in computing servers. Although computing servers are the foundations of the digital revolution, their current designs require 30-40% of the energy supplied to be dissipated in cooling. The remaining energy is used for computation, but their complex many-core designs produce very high operating temperatures. Thus, operating all the cores continuously at maximum performance levels results in system overheating and failures. This situation is limiting the benefits of technology scaling.

The COMPUSAPIEN proposal aims to completely revise the current computing server architecture. In particular, inspired by the mammalian brain, this proposal targets to design a disruptive three-dimensional (3D) computing server architecture that overcomes the prevailing worst-case power and cooling provisioning paradigm for servers. This new 3D server design champions a heterogeneous many-core architecture template with an integrated on-chip microfluidic fuel cell network for joint cooling delivery and power supply. Also, it will include a novel predictive controller based on holistic power-temperature models, which exploit the server software stack to achieve energy-scalable computing capabilities. Because of its integrated electronic-electrochemical architecture design, COMPUSAPIEN is clearly a high-risk high-reward proposal that will bring drastic energy savings with respect to current server design approaches, and will guarantee energy scalability in future server architectures. To realize this vision, COMPUSAPIEN will develop and integrate breakthrough innovations in heterogeneous computing architectures, cooling-power subsystem design, combined microfluidic power delivery and temperature management in computers.

 Publications

year authors and title journal last update
List of publications.
2019 Benoit W. Denkinger, Flavio Ponzina, Soumya S. Basu, Andrea Bonetti, Szabolcs Balasi, Martino Ruggiero, Miguel Peon-Quiros, Davide Rossi, Andreas Burg, David Atienza
Impact of Memory Voltage Scaling on Accuracy and Resilience of Deep Learning Based Edge Devices
published pages: 1-1, ISSN: 2168-2356, DOI: 10.1109/mdat.2019.2947282 		IEEE Design & Test August 2019 2020-02-06
2019 Kawsar Haghshenas, Ali Pahlevan, Marina Zapater, Siamak Mohammadi, David Atienza
MAGNETIC: Multi-Agent Machine Learning-Based Approach for Energy Efficient Dynamic Consolidation in Data Centers
published pages: 1-1, ISSN: 1939-1374, DOI: 10.1109/tsc.2019.2919555 		IEEE Transactions on Services Computing 31 May 2019 2020-02-06
2018 Artem Aleksandrovich Andreev, Arvind Sridhar, Mohamed M. Sabry, Marina Zapater, Patrick Ruch, Bruno Michel, David Atienza
PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays
published pages: 73-85, ISSN: 0018-9340, DOI: 10.1109/tc.2017.2695179 		IEEE Transactions on Computers 67/1 2019-02-26
2018 Ali Pahlevan, Xiaoyu Qu, Marina Zapater, David Atienza
Integrating Heuristic and Machine-Learning Methods for Efficient Virtual Machine Allocation in Data Centers
published pages: 1667-1680, ISSN: 0278-0070, DOI: 10.1109/tcad.2017.2760517 		IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 37/8 2019-02-26
2018 Arman Iranfar, Marina Zapater, David Atienza
Machine Learning-Based Quality-Aware Power and Thermal Management of Multistream HEVC Encoding on Multicore Servers
published pages: 2268-2281, ISSN: 1045-9219, DOI: 10.1109/tpds.2018.2827381 		IEEE Transactions on Parallel and Distributed Systems 29/10 2019-03-01
2018 Arman Iranfar, Mehdi Kamal, Ali Afzali-Kusha, Massoud Pedram, David Atienza
TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip
published pages: 1532-1545, ISSN: 0278-0070, DOI: 10.1109/tcad.2017.2768417 		IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 37/8 2019-02-26

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