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3D-MUSE SIGNED

3D Multi-Process Sequential Integration for Smart Sensor Interfaces

Total Cost €

EC-Contrib. €

Partnership

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3D-MUSE project word cloud

Explore the words cloud of the 3D-MUSE project. It provides you a very rough idea of what is the project "3D-MUSE" about.

dimension integration excellent lower wafer tiers sensor locating perform former interaction volume cyberphysical bottleneck scaling refer conceiving too moderate power monolithic implements micro trend functional digital spearhead parallel density circuits trade plain comprising stack latter connected full muse smart interactions wants actuators plethora cube electronics emancipation specialize interconnect sensors beneficial 3d architectures progression mixed environment turn designs heart sequential multiple handle analog course signal nodes time blocks scavenging candidates interfaces options single operate purely tier capability iot offs device optimal budget preferably bonding true goes performance

Project "3D-MUSE" data sheet

The following table provides information about the project.

Coordinator	UNIVERSITETET I OSLO Organization address address: PROBLEMVEIEN 5-7 city: OSLO postcode: 313 website: www.uio.no contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Norway [NO]
Total cost	3˙846˙157 €
EC max contribution	3˙846˙157 € (100%)
Programme	1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
Code Call	H2020-ICT-2017-1
Funding Scheme	RIA
Starting year	2018
Duration (year-month-day)	from 2018-01-01 to 2021-12-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	UNIVERSITETET I OSLO UNIVERSITETET I OSLO Organization address address: PROBLEMVEIEN 5-7 city: OSLO postcode: 313 website: www.uio.no contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NO (OSLO)	coordinator	590˙891.00
2	COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES Organization address address: RUE LEBLANC 25 city: PARIS 15 postcode: 75015 website: www.cea.fr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (PARIS 15)	participant	1˙607˙728.00
3	INTEGRATED DETECTOR ELECTRONICS AS INTEGRATED DETECTOR ELECTRONICS AS Organization address address: GJERDRUMS VEI 19 city: OSLO postcode: 484 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NO (OSLO)	participant	753˙125.00
4	LUNDS UNIVERSITET LUNDS UNIVERSITET Organization address address: Paradisgatan 5c city: LUND postcode: 22100 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	SE (LUND)	participant	393˙527.00
5	STMICROELECTRONICS CROLLES 2 SAS STMICROELECTRONICS CROLLES 2 SAS Organization address address: RUE JEAN MONNET 850 city: CROLLES postcode: 38920 website: www.st.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (CROLLES)	participant	350˙885.00
6	INSTITUT POLYTECHNIQUE DE GRENOBLE INSTITUT POLYTECHNIQUE DE GRENOBLE Organization address address: AVENUE FELIX VIALLET 46 city: GRENOBLE CEDEX 1 postcode: 38031 website: http://www.grenoble-inp.fr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (GRENOBLE CEDEX 1)	participant	150˙000.00

Map

Project objective

The IoT is composed of connected devices that are characterized by their interaction with the environment via a plethora of sensors and actuators. The trend goes to ever more complex interactions and thus an increase in the number of different sensors integrated in the same product, which in turn requires the processing capability to handle all of those sensors. At the same time those systems are expected to still perform on an ever lower power budget, preferably so low as to be able to operate purely on power scavenging. And of course the cost needs to be moderate too. The electronics at the heart of such a system needs to be mixed-signal electronics that interfaces to the analog sensors and actuators, but can also provide the necessary digital processing power.

3D-MUSE wants to spearhead the progression from what we shall refer to as 'systems-in-stack' to true 'systems-in-cube' that monolithic/sequential 3D integration will enable. We define the former as a 3D system that is characterized by locating functional blocks within a single plain in the (typically parallel/wafer-bonding) 3D integration stack, while the latter makes use of the full emancipation of the interconnect density in the third dimension of sequential 3D integration and rather implements functional blocks in a volume comprising multiple tiers. We shall demonstrate this concept by conceiving novel architectures for micro circuits in a volume in a two tier 3D sequential integration process. In particular, we have identified mixed-signal circuits as, on one hand, a major bottleneck for functional performance scaling of sensor nodes and smart sensors in the IoT and cyberphysical systems, and on the other hand, excellent candidates for beneficial trade-offs when implemented as circuits in a volume with using two specialize tiers, one for analog device options and another for optimal digital designs. We shall refer to such a technology as 'multi-process' sequential 3D integration.

Deliverables

List of deliverables.
Specification for the analog MOSFET	Documents, reports	2020-01-30 10:20:29
Periodic Project report 1	Documents, reports	2020-01-30 10:20:29
Project Web-Page	Websites, patent fillings, videos etc.	2020-01-30 10:20:29
Data management plan (DMP)	Open Research Data Pilot	2020-01-30 10:20:29

Take a look to the deliverables list in detail: detailed list of 3D-MUSE deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2018	Laurent Brunet, Perrine Batude, Claire Fenouillet-Beranger, Maud Vinet (Invited) 3D Monolithic Integration published pages: 125-130, ISSN: 1938-5862, DOI: 10.1149/08508.0125ecst	ECS Transactions 85/8	2020-01-30

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The information about "3D-MUSE" are provided by the European Opendata Portal: CORDIS opendata.