Explore the words cloud of the 3D-MUSE project. It provides you a very rough idea of what is the project "3D-MUSE" about.
The following table provides information about the project.
Coordinator |
UNIVERSITETET I OSLO
Organization address contact info |
Coordinator Country | Norway [NO] |
Total cost | 3˙846˙157 € |
EC max contribution | 3˙846˙157 € (100%) |
Programme |
1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)) |
Code Call | H2020-ICT-2017-1 |
Funding Scheme | RIA |
Starting year | 2018 |
Duration (year-month-day) | from 2018-01-01 to 2021-12-31 |
Take a look of project's partnership.
# | ||||
---|---|---|---|---|
1 | UNIVERSITETET I OSLO | NO (OSLO) | coordinator | 590˙891.00 |
2 | COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES | FR (PARIS 15) | participant | 1˙607˙728.00 |
3 | INTEGRATED DETECTOR ELECTRONICS AS | NO (OSLO) | participant | 753˙125.00 |
4 | LUNDS UNIVERSITET | SE (LUND) | participant | 393˙527.00 |
5 | STMICROELECTRONICS CROLLES 2 SAS | FR (CROLLES) | participant | 350˙885.00 |
6 | INSTITUT POLYTECHNIQUE DE GRENOBLE | FR (GRENOBLE CEDEX 1) | participant | 150˙000.00 |
The IoT is composed of connected devices that are characterized by their interaction with the environment via a plethora of sensors and actuators. The trend goes to ever more complex interactions and thus an increase in the number of different sensors integrated in the same product, which in turn requires the processing capability to handle all of those sensors. At the same time those systems are expected to still perform on an ever lower power budget, preferably so low as to be able to operate purely on power scavenging. And of course the cost needs to be moderate too. The electronics at the heart of such a system needs to be mixed-signal electronics that interfaces to the analog sensors and actuators, but can also provide the necessary digital processing power.
3D-MUSE wants to spearhead the progression from what we shall refer to as 'systems-in-stack' to true 'systems-in-cube' that monolithic/sequential 3D integration will enable. We define the former as a 3D system that is characterized by locating functional blocks within a single plain in the (typically parallel/wafer-bonding) 3D integration stack, while the latter makes use of the full emancipation of the interconnect density in the third dimension of sequential 3D integration and rather implements functional blocks in a volume comprising multiple tiers. We shall demonstrate this concept by conceiving novel architectures for micro circuits in a volume in a two tier 3D sequential integration process. In particular, we have identified mixed-signal circuits as, on one hand, a major bottleneck for functional performance scaling of sensor nodes and smart sensors in the IoT and cyberphysical systems, and on the other hand, excellent candidates for beneficial trade-offs when implemented as circuits in a volume with using two specialize tiers, one for analog device options and another for optimal digital designs. We shall refer to such a technology as 'multi-process' sequential 3D integration.
Specification for the analog MOSFET | Documents, reports | 2020-01-30 10:20:29 |
Periodic Project report 1 | Documents, reports | 2020-01-30 10:20:29 |
Project Web-Page | Websites, patent fillings, videos etc. | 2020-01-30 10:20:29 |
Data management plan (DMP) | Open Research Data Pilot | 2020-01-30 10:20:29 |
Take a look to the deliverables list in detail: detailed list of 3D-MUSE deliverables.
year | authors and title | journal | last update |
---|---|---|---|
2018 |
Laurent Brunet, Perrine Batude, Claire Fenouillet-Beranger, Maud Vinet (Invited) 3D Monolithic Integration published pages: 125-130, ISSN: 1938-5862, DOI: 10.1149/08508.0125ecst |
ECS Transactions 85/8 | 2020-01-30 |
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The information about "3D-MUSE" are provided by the European Opendata Portal: CORDIS opendata.