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Opendata, web and dolomites

LO-KMOF SIGNED

Vapour-deposited metal-organic frameworks as high-performance gap-filling dielectrics for nanoelectronics

Total Cost €

EC-Contrib. €

Partnership

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LO-KMOF project word cloud

Explore the words cloud of the LO-KMOF project. It provides you a very rough idea of what is the project "LO-KMOF" about.

invention limit smaller deposition time zero successful consumption indispensable talk demonstrator medium noise interconnect power densely since integrating signal lo materials wires chips cross rises adjacent circuits erc industrially speed wiring induce complexity consume semiconductor kmof performance vapour interconnects incentive transistors alleviate resistance persistent first propagation metal layer frameworks organic faster chip containing capacitance dielectric validated vapore proposes packed fabricated miniaturization

Project "LO-KMOF" data sheet

The following table provides information about the project.

Coordinator	KATHOLIEKE UNIVERSITEIT LEUVEN Organization address address: OUDE MARKT 13 city: LEUVEN postcode: 3000 website: www.kuleuven.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Belgium [BE]
Total cost	0 €
EC max contribution	150˙000 € (0%)
Programme	1. H2020-EU.1.1. (EXCELLENT SCIENCE - European Research Council (ERC))
Code Call	ERC-2019-PoC
Funding Scheme	ERC-POC-LS
Starting year	2019
Duration (year-month-day)	from 2019-09-01 to 2021-02-28

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	KATHOLIEKE UNIVERSITEIT LEUVEN KATHOLIEKE UNIVERSITEIT LEUVEN Organization address address: OUDE MARKT 13 city: LEUVEN postcode: 3000 website: www.kuleuven.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	coordinator	120˙000.00
2	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	30˙000.00

Map

Project objective

Since the invention of integrated circuits, there has been a persistent incentive towards miniaturization. An indispensable part of every chip is a multi-level wiring system fabricated on top of the semiconductor layer containing the transistors. As transistors get smaller and more densely packed, the complexity and the impact on performance of the on-chip interconnects rises. The non-zero resistance and capacitance associated with the metal wires and the dielectric medium between them induce cross-talk noise between adjacent interconnects, limit the speed of signal propagation and increase the power consumption of a chip.

The LO-KMOF project proposes an approach to alleviate these issues by integrating for the first time metal-organic frameworks as an interconnect dielectric. The project will make use of a novel vapour phase deposition approach for these materials, developed in the ERC project VAPORE. If successful, the project will contribute to chips that are not only faster but also consume less power. The proposed technology will be validated in an industrially relevant demonstrator.

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The information about "LO-KMOF" are provided by the European Opendata Portal: CORDIS opendata.