Explore the words cloud of the FineSol project. It provides you a very rough idea of what is the project "FineSol" about.
The following table provides information about the project.
Coordinator |
ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS
Organization address contact info |
Coordinator Country | Greece [EL] |
Project website | http://www.finesol.org |
Total cost | 6˙148˙635 € |
EC max contribution | 4˙959˙450 € (81%) |
Programme |
1. H2020-EU.2.1.5.1. (Technologies for Factories of the Future) |
Code Call | H2020-FoF-2015 |
Funding Scheme | IA |
Starting year | 2015 |
Duration (year-month-day) | from 2015-11-01 to 2019-04-30 |
Take a look of project's partnership.
The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. Consequently, this would effectively enable more than a doubling of the functions available on electronic devices such as cell phones, satellite navigation systems, health devices etc. The successful completion of the FineSol project would lift the ultra-miniaturisation/functionality road block and also enable reduction in raw material usage, reduction in WEEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.
Presentation of dissemination material | Documents, reports | 2020-02-12 08:53:01 |
Project website | Websites, patent fillings, videos etc. | 2020-02-12 08:53:00 |
Take a look to the deliverables list in detail: detailed list of FineSol deliverables.
year | authors and title | journal | last update |
---|---|---|---|
2017 |
TBS \"\"\"IIW International Conference (by Prof Luisa Coutinho)\"\"\" published pages: , ISSN: , DOI: |
2020-02-12 | |
2017 |
TBS IAB WG Inspection, Qualification and Certification of Welders, Genoa, Italy published pages: , ISSN: , DOI: |
2020-02-12 | |
2016 |
TBS EWF General Assembly published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS Going Green - CARE INNOVATION 2018 published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2018, /Towards miniaturization of electronics by developing and characterizing hyperfine solder powders used in printed circuit boards published pages: , ISSN: , DOI: |
2020-02-12 | |
2016 |
TBS IIW-International Institute of Welding - 69th Annual Assembly and International Conference published pages: , ISSN: , DOI: |
2020-02-12 | |
2016 |
TBS 13th International Conference on Nanosciences & Nanotechnologies-NN16 published pages: , ISSN: , DOI: |
2020-02-12 | |
2017 |
TBS Printed Electronics USA 2018 published pages: , ISSN: , DOI: |
2020-02-12 | |
2016 |
TBS IAB-IIW Members Meeting published pages: , ISSN: , DOI: |
2020-02-12 | |
2017 |
TBS EFFRA Project Event and Impact Workshop published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS 16th International Conference on Nanosciences & Nanoechnologies-NN18 Characterization of Hyperfine Solder Powders used for Miniaturized Electronics published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS Printed Electronics EUROPE 2018 published pages: , ISSN: , DOI: |
2020-02-12 | |
2017 |
TBS EFFRA’s Factories of the Future Community Day (flyer distribution) published pages: , ISSN: , DOI: |
2020-02-12 | |
2017 |
TBS 15th International Conference on Nanosciences & Nanoechnologies-NN17 (booth and presentation) published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS III FPGA Symposium, poster session. Presentaion of Finesol to show future change in miniaturization published pages: , ISSN: , DOI: |
2020-02-12 | |
2017 |
TBS Euronanoforum 2017 published pages: , ISSN: , DOI: |
2020-02-12 | |
2016 |
TBS 21st Edition of the Workshop on Electromagnetic,Nondestructive Evaluation (distribution of flyer) published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS Project Presentation at ASR Joining Event published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS Printed Electronics USA 2018 published pages: , ISSN: , DOI: |
2020-02-12 | |
2016 |
TBS EFFRA\'s Factories of the Future Conference 2016 published pages: , ISSN: , DOI: |
2020-02-12 | |
2018 |
TBS IDTechEx Show EUROPE - Masterclass in Advanced Screen Printing in PE Applications published pages: , ISSN: , DOI: |
2020-02-12 |
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The information about "FINESOL" are provided by the European Opendata Portal: CORDIS opendata.