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WIPE SIGNED

Wafer scale Integration of Photonics and Electronics

Total Cost €

EC-Contrib. €

Partnership

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Outcomes and
results

WIPE project word cloud

Explore the words cloud of the WIPE project. It provides you a very rough idea of what is the project "WIPE" about.

transmission affordable significantimportance attachment purposes techniques phosphide co showing connection lower heterogeneous polymer contain optical efficient intimate modules leveraging electronic standard manufacturing andcontrol data library tools density foundries consumption wire powerful energy performance ics interconnection pics bicmos created industry receiver wipe module bonding consisting laser chips photonics connections smes designers photonic inp electronics 400gb feasibility fibre packaging complexity direct photronic circuits indium pic centre hybrid proven combination welding sustains ambition pdks leadership waveguides wafer industrialised driver kits standardised transceiver integration facilitates

Project "WIPE" data sheet

The following table provides information about the project.

Coordinator	TECHNISCHE UNIVERSITEIT EINDHOVEN Organization address address: GROENE LOPER 3 city: EINDHOVEN postcode: 5612 AE website: www.tue.nl/en contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Netherlands [NL]
Project website	http://www.wipe.jeppix.eu
Total cost	3˙766˙097 €
EC max contribution	3˙062˙997 € (81%)
Programme	1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
Code Call	H2020-ICT-2015
Funding Scheme	RIA
Starting year	2016
Duration (year-month-day)	from 2016-01-01 to 2019-06-30

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	TECHNISCHE UNIVERSITEIT EINDHOVEN TECHNISCHE UNIVERSITEIT EINDHOVEN Organization address address: GROENE LOPER 3 city: EINDHOVEN postcode: 5612 AE website: www.tue.nl/en contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	coordinator	1˙030˙188.00
2	FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. Organization address address: HANSASTRASSE 27C city: MUNCHEN postcode: 80686 website: www.fraunhofer.de contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (MUNCHEN)	participant	601˙147.00
3	EFFECT PHOTONICS BV EFFECT PHOTONICS BV Organization address address: TORENALLEE 20 city: EINDHOVEN postcode: 5617 BC website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	participant	537˙656.00
4	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	410˙437.00
5	SMART PHOTONICS BV SMART PHOTONICS BV Organization address address: HIGH TECH CAMPUS 29 city: EINDHOVEN postcode: 5656 AE website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	participant	216˙505.00
6	EFFECT PHOTONICS LTD EFFECT PHOTONICS LTD Organization address address: PROSPECT HOUSE, SINDERLAND ROAD 2 city: ALTRINCHAM postcode: WA145ET website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (ALTRINCHAM)	participant	193˙562.00
7	BERENSCHOT GROEP BV BERENSCHOT GROEP BV Organization address address: Europalaan 40 city: Utrecht postcode: 3526 KS website: www.berenschot.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (Utrecht)	participant	73˙500.00
8	IBM RESEARCH GMBH IBM RESEARCH GMBH Organization address address: SAEUMERSTRASSE 4 city: RUESCHLIKON postcode: 8803 website: www.zurich.ibm.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	CH (RUESCHLIKON)	participant	0.00
9	IMINDS IMINDS Organization address address: TECHNOLOGIEPARK 19 city: GENT postcode: 9052 website: www.ibbt.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (GENT)	participant	0.00

Map

Project objective

The WIPE project aims at developing hybrid electronic-photonic chips as a key enabling technology for data transmission purposes. It aims at bringing photonics to a new level by developing a concept that can be well industrialised. This sustains EU leadership in photonics, as is the ambition of the work program.

A new wafer-scale technology will thus be developed for direct and intimate attachment of III-V Indium-Phosphide (InP) photonic integrated circuits (PICs) and BiCMOS electronic chips (ICs). The ICs contain the driver, receiver andcontrol electronics for the PIC and enable direct connection to polymer optical waveguides. This technology of ‘wafer scale heterogeneous integration’ enables high-performance and high-density photonic-electronic (photronic) modules are created having a lower energy consumption, lower packaging complexity and lower cost compared to modules using more traditional interconnection techniques like wire bonding and laser welding of fibre connections.

Next to the new bonding technology, an integrated module design technology is developed for efficient co-design of hybrid photonic and electronic modules. A library consisting of photonic/electronic standard modules, is created leveraging the process design kits (PDKs) of the most important European foundries of photonic chips in combination with a powerful BiCMOS. These tools are of significantimportance to industry, since they offer photronic module designers a standardised approach that highly facilitates the module design for SMEs and affordable manufacturing by photonic and electronic foundries. The WIPE approach will be proven by showing the feasibility of a 400Gb/s transceiver for data centre application.

Deliverables

List of deliverables.
Photonic chip performance	Documents, reports	2020-03-13 10:23:05
Exploitation plan: Second release	Other	2020-03-13 10:23:07
Industrialisation plan	Other	2020-03-13 10:23:04
Technology benchmarking	Documents, reports	2020-03-13 10:23:04
Roadmap	Documents, reports	2020-03-13 10:23:05
Communication kit version 3	Documents, reports	2020-03-13 10:23:06
Communication kit version 1	Documents, reports	2019-05-30 17:24:59
Exploitation plan: First release	Other	2019-05-30 17:25:00
Communication kit version 2	Documents, reports	2019-05-30 17:24:55
Public launch and website	Other	2019-05-30 17:24:59

Take a look to the deliverables list in detail: detailed list of WIPE deliverables.

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The information about "WIPE" are provided by the European Opendata Portal: CORDIS opendata.