Opendata, web and dolomites
H2020 projects about "sip"
The page lists 20 projects related to the topic "sip".
| # | |||
|---|---|---|---|
| 1 | DormantMicrobes | Revealing the function of dormant soil microorganisms and the cues for their awakening | 2015 |
| 2 | Triangulum | Triangulum: The Three Point Project / Demonstrate. Disseminate. Replicate. | 2015 |
| 3 | RE-InVEST | Rebuilding an Inclusive, Value-based Europe of Solidarity and Trust through Social Investments | 2015 |
| 4 | EMYNOS | nExt generation eMergencY commuNicatiOnS | 2015 |
| 5 | MUCDIFF | Competition between the enteric pathogen Clostridium difficile and the commensal members of the gut microbiota for mucosal sugars | 2015 |
| 6 | TMGSiP | THz Muti-Gb/s System in Package | 2015 |
| 7 | R2POWER300 | Preparing R2 extension to 300mm for BCD Smart Power | 2015 |
| 8 | L3MATRIX | Large Scale Silicon Photonics Matrix for Low Power and Low Cost Data Centers | 2015 |
| 9 | VERAM | Vision and Roadmap for European Raw Materials | 2015 |
| 10 | Multi-SIP Hydrogel | A multifunctional self-immolative hydrogel for accelerating the healing of chronic wounds | 2017 |
| 11 | TRACER | Tree Roots: an analytical ‘culture’ of economy and religion – case-study Egypt 2050-1550 BC. | 2016 |
| 12 | REFERENCE | Rf Engineered substrates to FostER fEm performaNCE | 2015 |
| 13 | EXPAND | EXPAND - enhancing co-creation in JPI Urban Europe through widening Member State and stakeholder participation | 2016 |
| 14 | LINKIP | Linking time domain spectral IP to hydraulic properties for environmental and engineering applications | 2018 |
| 15 | SIMS | Sustainable Intelligent Mining Systems | 2017 |
| 16 | TSNet | Time Sensitive Networking (TSN) technologies for Next Generation Ethernet | 2017 |
| 17 | HouseBuildR | Build your house exactly as you imagined it | 2018 |
| 18 | PS | Predicting Suicide | 2018 |
| 19 | TWILIGHT | Towards the neW era of 1.6 Tb/s System-In-Package transceivers for datacenter appLIcations exploiting wafer-scale co-inteGration of InP membranes and InP-HBT elecTronics | 2019 |
| 20 | COMAP-4S | COmponents and MAcrocomponents Packaging For Space | 2020 |