Explore the words cloud of the REFERENCE project. It provides you a very rough idea of what is the project "REFERENCE" about.
The following table provides information about the project.
Coordinator |
SOITEC SA
Organization address contact info |
Coordinator Country | France [FR] |
Project website | http://reference.ecsel.soitec.eu |
Total cost | 33˙065˙895 € |
EC max contribution | 10˙028˙062 € (30%) |
Programme |
1. H2020-EU.2.1.1.7. (ECSEL) |
Code Call | H2020-ECSEL-2015-1-RIA-two-stage |
Funding Scheme | ECSEL-RIA |
Starting year | 2015 |
Duration (year-month-day) | from 2015-12-01 to 2019-11-30 |
Take a look of project's partnership.
The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s. The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design, metrology to system integration capable to address the unresolved 4G requirements for RF FEMs (data rate >1Gb/s) and pave the way to 5G. The R&D and demonstration actions include: • Development of innovative RFSOI substrates for 4G / 5G • Move to 300 mm diameter • Development of 4G / 5G RF-SOI devices with 2 major European foundries : analog in 200 mm 130nm technology, RF digital by combining RFSOI and FDSOI in 300 mm at 22nm; • Innovative design for 4G /5G (analog and RF digital), • Integration of several 4G FEM components on the same chip and demonstration System in Package Technology (SiP). 3 applications are investigated : • Cellular / Iot : 4G RFSOI FEM demonstrator at SiP device level • Automotive : 4G RF-SOI demonstrator at SiP device level • Aviation: RF-SOI high data rate wireless communication module at system level; targeting a new frequency band for aeronautic.
The project is executed within 5 European countries, by on a strong and complementary and well balanced consortium, 6 large industrial companies (world leaders in material, foundries, aeronautics), 4 SMEs and a network of world class level and major European public research institutes and academics. It clearly aims to develop industrial solutions enabling European leadership and production. Through this technology disruption, REFERENCE project addresses major thrusts for smart mobility, smart society, semiconductor processes, equipments, design technology and smart systems implementation, and support the societal challenges of smart transport, as well as secure and innovative society.
D1.11 | Websites, patent fillings, videos etc. | 2020-03-06 18:02:20 |
Take a look to the deliverables list in detail: detailed list of REFERENCE deliverables.
year | authors and title | journal | last update |
---|---|---|---|
2017 |
S. Boutayeb Output Matching Network Design for Class B/J PA published pages: , ISSN: , DOI: |
Mars | 2020-03-06 |
2017 |
A. Giry RFSOI for Tunable RF published pages: , ISSN: , DOI: |
Mars | 2020-03-06 |
2018 |
Yeghoyan Taguhi, Alassaad Kassem, McMitchell Sean R.C., Gutierrez Marina, Souliere Véronique, Araujo Daniel, Ferro Gabriel Silicon (001) Heteroepitaxy on 3C-SiC(001)/Si(001) Seed published pages: 128-131, ISSN: , DOI: |
Materials Science Forum Vol. 924 | 2020-03-06 |
2017 |
A. Giry, A. Serhan, P. Ferris RF SOI Technology for PA/FEM Integration published pages: , ISSN: , DOI: |
2020-03-06 | |
2017 |
D. Nicolas, A. Serhan , P. Ferris, A. Giry, T. Parra Système de Détection d\'impédance en technologie CMOS SOI pour accord d\'antennes published pages: , ISSN: , DOI: |
Journées Nationales Micro-ondes Mai | 2020-03-06 |
2017 |
T. YEGHOYAN, K. ALASSAAD, V. SOULIERE, G. FERRO Silicon Deposition on 3C-SiC Seeds of Different Orientations published pages: 87-90, ISSN: , DOI: |
Materials Science Forum Vol. 897 | 2020-03-06 |
2018 |
Lei Zhu, Shuangke Liu, Frederic Allibert, Ionut Radu, Xinen Zhu, Yumin Lu, Xi Wang RF Characteristics of Two Generations of RFeSI HR-SOI Substrates Over Temperature published pages: 377-379, ISSN: 1531-1309, DOI: 10.1109/lmwc.2018.2813884 |
IEEE Microwave and Wireless Components Letters 28/5 | 2020-03-06 |
2018 |
Babak Kazemi Esfeh, Martin Rack, Khaled Ben Ali, Frederic Allibert, Jean-Pierre Raskin RF Small- and Large-Signal Characteristics of CPW and TFMS Lines on Trap-Rich HR-SOI Substrates published pages: 3120-3126, ISSN: 0018-9383, DOI: 10.1109/ted.2018.2845679 |
IEEE Transactions on Electron Devices 65/8 | 2020-03-06 |
2018 |
Manuel Sellier (Invited) Substrate and Device Engineering for IoT and Automotive published pages: 3-13, ISSN: 1938-5862, DOI: 10.1149/08508.0003ecst |
ECS Transactions 85/8 | 2020-03-06 |
2018 |
Oleg Kononchuk, Didier Landru, Damien Massy, Nadia Ben Mohamed, Youngpil Kim, Pablo Acosta-Alba and François Rieutord SOI Wafer Technology for Advanced Mos Applications published pages: , ISSN: , DOI: |
236th ECS meetings Oct 3rd 2018 | 2020-03-06 |
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The information about "REFERENCE" are provided by the European Opendata Portal: CORDIS opendata.