CONNECT
CarbON Nanotube compositE InterconneCTs
Total Cost €
0EC-Contrib. €
0Partnership
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0CONNECT project word cloud
Explore the words cloud of the CONNECT project. It provides you a very rough idea of what is the project "CONNECT" about.
Project "CONNECT" data sheet
The following table provides information about the project.
| Coordinator |
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Organization address contact info |
| Coordinator Country | Germany [DE] |
| Project website | http://www.connect-h2020.eu/ |
| Total cost | 3˙999˙267 € |
| EC max contribution | 3˙437˙872 € (86%) |
| Programme |
1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)) |
| Code Call | H2020-ICT-2015 |
| Funding Scheme | RIA |
| Starting year | 2016 |
| Duration (year-month-day) | from 2016-01-01 to 2018-12-31 |
Partnership
Take a look of project's partnership.
| # | ||||
|---|---|---|---|---|
| 1 | FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. | DE (MUNCHEN) | coordinator | 1˙187˙378.00 |
| 2 | COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES | FR (PARIS 15) | participant | 1˙044˙500.00 |
| 3 | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS | FR (PARIS) | participant | 380˙043.00 |
| 4 | AIXTRON LIMITED | UK (CAMBRIDGE) | participant | 325˙000.00 |
| 5 | UNIVERSITY OF GLASGOW | UK (GLASGOW) | participant | 200˙450.00 |
| 6 | SYNOPSYS (NORTHERN EUROPE) LIMITED | UK (READING BERKSHIRE) | participant | 166˙276.00 |
| 7 | Gold Standard Simulations ltd | UK (Glasgow) | participant | 134˙223.00 |
| 8 | IBM RESEARCH GMBH | CH (RUESCHLIKON) | participant | 0.00 |
Map
Project objective
Our modern society has gained enormously from novel miniaturized microelectronic products with enhanced functionality at ever decreasing cost. However, as size goes down, interconnects become major bottlenecks irrespective of the application domain. CONNECT proposes innovations in novel interconnect architectures to enable future CMOS scaling by integration of metal-doped or metal-filled Carbon Nanotube (CNT) composite. To achieve the above, CONNECT aspires to develop fabrication techniques and processes to sustain reliable CNTs for on-chip interconnects. Also challenges of transferring the process into the semiconductor industry and CMOS compatibility will be addressed. CONNECT will investigate ultra-fine CNT lines and metal-CNT composite material for addressing the most imminent high power consumption and electromigration issues of current state-of-the-art copper interconnects. Demonstrators will be developed to show significantly improved electrical resistivity (up to 10µOhmcm for individual doped CNT lines), ampacity (up to 108A/cm2 for CNT bundles), thermal and electromigration properties compared to state-of-the-art approaches with conventional copper interconnects. Additionally, CONNECT will develop novel CNT interconnect architectures to explore circuit- and architecture-level performance and energy efficiency. The technologies developed in this project are key for both performance and manufacturability of scaled microelectronics. It will allow increased power density and scaling density of CMOS or CMOS extension and will also be applicable to alternative computing schemes such as neuromorphic computing. The CONNECT consortium has strong links along the value chain from fundamental research to endâ€users and brings together some of the best research groups in that field in Europe. The realisation of CONNECT will foster the recovery of market shares of the European electronic sector and prepare the industry for future developments of the electronic landscape
Deliverables
| Website Creation and Activation | Documents, reports | 2019-09-02 09:58:28 |
| Hierarchical models of the electrical and thermal conductivities of metallic CNT and composite Cu-CNT interconnects | Documents, reports | 2019-09-02 09:58:28 |
| Report on novel interconnect architecture exploration and simulation | Documents, reports | 2019-09-02 09:58:28 |
| Wikipedia page Creation and Activation | Documents, reports | 2019-09-02 09:58:28 |
| Report on dissemination activities during last period | Documents, reports | 2019-09-02 09:58:27 |
| Intellectual Property Audit and workshop organized at t0+24 | Documents, reports | 2019-09-02 09:58:27 |
| Hierarchical models of the contacts between CNTs and Cu and between CNT and Cu-CNT interconnects and transistors, and the corresponding electro-thermal coupling | Documents, reports | 2019-09-02 09:58:27 |
Take a look to the deliverables list in detail: detailed list of CONNECT deliverables.
Publications
| year | authors and title | journal | last update |
|---|---|---|---|
| 2016 |
J. Liang, L. Zhang, N. Azemard-Crestani, P. Nouet, A. Todri-Sanial Physical Description and Analysis of Doped Carbon Nanotube Interconnects published pages: , ISSN: , DOI: |
2016 IEEE Power and Timing Modeling, Optimization and Simulation | 2019-09-02 |
| 2017 |
J. Liang, J. Lee, S. Berrada, V. Georgiev, A. Asenov, N. Azemard-Crestani, A. Todri-Sanial Atomistic to Circuit Level Modeling of Defective Doped SWCNTs with Contacts for On-Chip Interconnect Application published pages: , ISSN: , DOI: |
12th IEEE Nanotechnology Materials and Devices Conference (NMDC) | 2019-09-02 |
| 2017 |
J. Lee, T. Sadi, Jie Liang, V. P. Georgiev, A. Todri-Sanial, and A. Asenov. A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulations published pages: , ISSN: , DOI: |
2017 International Workshop on Computational Nanotechnology (IWCN) | 2019-09-02 |
| 2017 |
J. Liang, A. Todri-Sanial Power and Performance Analysis of Doped SW/DW CNT for On-Chip Interconnect Application published pages: , ISSN: , DOI: |
GRAPHENE 2017 International Conference. | 2019-09-02 |
| 2016 |
Olivier Faynot, Severine Cheramy, Maud Vinet, Sylvain Maitrejean Status and Future of Advanced Interconnects and the Needs for Simulation published pages: , ISSN: , DOI: |
2016 IEEE International Conference on Simulation of Semiconductor Processes and Devices | 2019-09-02 |
| 2016 |
A. Todri-Sanial Investigation of Electrical and Thermal Properties of Carbon Nanotube Interconnects published pages: , ISSN: , DOI: |
2016 IEEE Power and Timing Modeling, Optimization and Simulation | 2019-09-02 |
| 2016 |
Jie Liang, Aida Todri-Sanial Carbon Nanotubes for Interconnects published pages: , ISSN: , DOI: |
2016 IEEE International Conference on Simulation of Semiconductor Processes and Devices | 2019-09-02 |
| 2017 |
J. Lee, J. Liang, S. M. Amoroso, T. Sadi, L. Wang, P. Asenov, A. Pender, D. Reid, V. P. Georgiev, C. Millar, A. Todri-Sanial, and A. Asenov Atoms-to-Circuits Simulation Investigation of CNT Interconnects for Next Generation CMOS Technologies. published pages: , ISSN: , DOI: |
22nd International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) | 2019-09-02 |
| 2016 |
S. M. Amoroso, A. Pender, A. Brown, D. Reid, E. Towie, P. Asenov, C. Millar and A. Asenov Tools for Simulation Workflow Management and their Application to Interconnect Modelling published pages: , ISSN: , DOI: |
2016 IEEE International Conference on Simulation of Semiconductor Processes and Devices | 2019-09-02 |
| 2018 |
Uhlig, B., Liang, J., Lee, J., Ramos, R., Dhavamani, A., Nagy, N., Dijon, J., Okuno, H., Kalita, D., Georgiev, V., Asenov, A., Amoroso, S., Wang, L., Millar, C., Konemann, F., Gotsmann, B., Goncalves, G., Chen, B., Pandey, R. R., Chen, R., and Todri-Sanial, A. Progress on Carbon Nanotube BEOL Interconnects. published pages: , ISSN: , DOI: |
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), Dresden, Germany, 19-23 Mar 2018 | 2019-09-02 |
| 2017 |
Aida Todri-Sanial, Raphael Ramos, Hanako Okuno, Jean Dijon, Abitha Dhavamani, Marcus Widlicenus, Katharina Lilienthal, Benjamin Uhlig, Toufik Sadi, Vihar Georgiev, Asen Asenov, Salvatore Amoroso, Andrew Pender, Andrew Brown, Campbell Millar, Fabian Motzfeld, Bernd Gotsmann, Jie Liang, Goncalo Goncalves, Nalin Rupesinghe, Ken Teo A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits published pages: 47-62, ISSN: 1531-636X, DOI: 10.1109/MCAS.2017.2689538 |
IEEE Circuits and Systems Magazine 17/2 | 2019-09-02 |
| 2018 |
Rongmei Chen, Jie Liang, Jaehyun Lee, Vihar P. Georgiev, Raphael Ramos, Hanako Okuno, Dipankar Kalita, Yuanqing Cheng, Liuyang Zhang, Reetu R. Pandey, Salvatore Amoroso, Campbell Millar, Asen Asenov, Jean Dijon, Aida Todri-Sanial Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances--Part I: Pristine MWCNT published pages: 1-8, ISSN: 0018-9383, DOI: 10.1109/TED.2018.2868421 |
IEEE Transactions on Electron Devices | 2019-09-02 |
| 2018 |
Rongmei Chen, Jie Liang, Jaehyun Lee, Vihar P. Georgiev, Raphael Ramos, Hanako Okuno, Dipankar Kalita, Yuanqing Cheng, Liuyang Zhang, Reetu R. Pandey, Salvatore Amoroso, Campbell Millar, Asen Asenov, Jean Dijon, Aida Todri-Sanial Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances--Part II: Impact of Charge Transfer Doping published pages: 1-8, ISSN: 0018-9383, DOI: 10.1109/TED.2018.2868424 |
IEEE Transactions on Electron Devices | 2019-09-02 |
| 2018 |
Jie Liang, Jaehyun Lee, Salim Berrada, Vihar P. Georgiev, Reeturaj Pandey, Rongmei Chen, Asen Asenov, Aida Todri-Sanial Atomistic- to Circuit-Level Modeling of Doped SWCNT for On-Chip Interconnects published pages: 1084-1088, ISSN: 1536-125X, DOI: 10.1109/TNANO.2018.2802320 |
IEEE Transactions on Nanotechnology 17/6 | 2019-09-02 |
| 2018 |
Jaehyun Lee, Salim Berrada, Fikru Adamu-Lema, Nicole Nagy, Vihar P. Georgiev, Toufik Sadi, Jie Liang, Raphael Ramos, Hamilton Carrillo-Nunez, Dipankar Kalita, Katharina Lilienthal, Marcus Wislicenus, Reeturaj Pandey, Bingan Chen, Kenneth B. K. Teo, Goncalo Goncalves, Hanako Okuno, Benjamin Uhlig, Aida Todri-Sanial, Jean Dijon, Asen Asenov Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study published pages: 3884-3892, ISSN: 0018-9383, DOI: 10.1109/TED.2018.2853550 |
IEEE Transactions on Electron Devices 65/9 | 2019-09-02 |
| 2018 |
Fabian Konemann, Morten Vollmann, Fabian Menges, Bernd Gotsmann Nanoscale Thermometry by Scanning Microscopy published pages: , ISSN: , DOI: |
THERMINIC 2018 - 24th International Worskhop | 2019-09-02 |
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