Explore the words cloud of the METRO4-3D project. It provides you a very rough idea of what is the project "METRO4-3D" about.
The following table provides information about the project.
Coordinator |
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Organization address contact info |
Coordinator Country | Belgium [BE] |
Project website | http://www.metro4-3d.eu/ |
Total cost | 3˙349˙813 € |
EC max contribution | 2˙689˙035 € (80%) |
Programme |
1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)) |
Code Call | H2020-ICT-2015 |
Funding Scheme | IA |
Starting year | 2016 |
Duration (year-month-day) | from 2016-02-01 to 2019-01-31 |
Take a look of project's partnership.
# | ||||
---|---|---|---|---|
1 | INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM | BE (LEUVEN) | coordinator | 1˙137˙903.00 |
2 | CAPRES AS | DK (KGS. LYNGBY) | participant | 301˙875.00 |
3 | DANMARKS TEKNISKE UNIVERSITET | DK (KGS LYNGBY) | participant | 300˙473.00 |
4 | COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES | FR (PARIS 15) | participant | 249˙221.00 |
5 | FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. | DE (MUNCHEN) | participant | 246˙325.00 |
6 | MATERIALS CENTER LEOBEN FORSCHUNG GMBH | AT (LEOBEN) | participant | 234˙136.00 |
7 | ION-TOF TECHNOLOGIES GMBH | DE (MUNSTER) | participant | 117˙600.00 |
8 | PVA TEPLA ANALYTICAL SYSTEMS GMBH | DE (WESTHAUSEN) | participant | 101˙500.00 |
9 | EIDGENOSSISCHE MATERIALPRUFUNGS- UND FORSCHUNGSANSTALT | CH (DUBENDORF) | participant | 0.00 |
10 | LAM RESEARCH BELGIUM | BE (LEUVEN) | participant | 0.00 |
Within the food chain of equipment delivery for the semiconductor industry, Europe has kept a very strong position in the metrology area with many companies establishing themselves as main leaders in the field. Hence in line with the objectives of the ICT25 call for innovation action to overcome the (initial) barriers for the successful commercialization of novel European products, this project aims at exploring for a number of metrology solutions their technological readiness, reliability and relevance of the developed protocols, and the COO. The portfolio within the project covers new metrology concepts addressing specifically the processing challenges linked to 3D-Devices and range from probing basic layer properties (composition, electrical properties) in FEOL to control of metallization in BEOL up to issues linked to die stacking. Due to the specific processing steps which need to be addressed, three separate metrology tools will be assessed in this project i.e a Tofsims system (IonTOF) with build-in Scanning Probe stage and FIB column for true 3D-composition profiling, a completely automated micro-Hall and sheet resistance measurement tool (Capres) with additional capabilities for measurements on dedicated test structures (prior to full BEOL) and an GHz acoustic Microscope (Tepla) for probing voids in TSV’s and stacked dies. As some of them (IonTOf, Capres) are addressing partly complementary information (composition versus electrical properties), their co-existence in this project creates additional value as beyond the tool assessment also a methodology based on combining these concepts can be explored and certified. Moreover a significant efficiency gain is created as they can employ similar test structures and devices. For each of these tools, the basic metrology concepts are existing and validated in the lab on selected applications but their general applicability field within the semiconductor industry still needs to be established
Report on organized training on the instrument | Documents, reports | 2019-10-03 10:47:52 |
Report 2 on dissemination activities | Documents, reports | 2019-10-03 10:47:52 |
Summary of the access time on the instruments | Documents, reports | 2019-10-03 10:47:52 |
Set-up of the website and strategic board | Websites, patent fillings, videos etc. | 2019-10-03 10:47:52 |
Report documenting the detailed technical specifications of the individual components | Documents, reports | 2019-10-03 10:47:52 |
Report on dissemination activities | Documents, reports | 2019-10-03 10:47:52 |
Take a look to the deliverables list in detail: detailed list of METRO4-3D deliverables.
year | authors and title | journal | last update |
---|---|---|---|
2017 |
Eva Grünwald, René Hammer, Jördis Rose, Bernhard Sartory, Roland Brunner Accretion Detection via Scanning Acoustic Microscopy in Microelectronic Components - Considering Symmetry Breaking Effects published pages: 1466-1467, ISSN: 1431-9276, DOI: 10.1017/S1431927617007991 |
Microscopy and Microanalysis 23/S1 | 2019-10-03 |
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The information about "METRO4-3D" are provided by the European Opendata Portal: CORDIS opendata.