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Report

Teaser, summary, work performed and final results

Periodic Reporting for period 1 - WAKeMeUP (Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors)

Teaser

The WAKeMeUP project objective is to set up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains.The already defined...

Summary

The WAKeMeUP project objective is to set up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains.
The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, hard security on the same chip.
The project will also target the industrialization of the embedded Phase Change Memory (PCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption.
The alternative memory solutions will also be studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories.
To achieve this goal of generating high value added semiconductor circuits in Europe in a breakthrough leading edge technology the project will deploy all the necessary activities to bring a new technology to an early industrial maturity stage. These activities encompass such developments as: technology enhancements for various specific application requirements such as wide temperature range and reliability, high security requests, high flexibility…, design enablement allowing first time silicon success, prototyping demonstrator products in the different application areas.
In the WAKeMeUP project, new devices and systems will be developed by the application partners in automotive and secure based on FD-SOI and embedded digital technology to answer specific applications needs.

Work performed

The first period of the WAKeMeUP project was the set-up and start-up phase. Intensive activities were conducted to set up the communication plan, the quality plan, the data management plan, several meetings and calls were necessary to adjust the project management procedure as well as the detailed discussions concerning the partners’ technical activities and collaborations. The WAKeMeUP project very quickly took its cruising speed by capitalizing on the technical collaboration network already used and reinforced by the previous project PANACHE. Particular attention was paid to the integration of the new partners and interlocutors from Germany (CONTI, FhG, MLX, etc.).
The 40nm eNVM process extension was clearly defined with several technology perimeters (P1 to P5) and the process development activities were going on on the different perimeters. A special focus has been put on perimeter 4 and perimeter 5 on the second period.
The development of the 28nm FDSOI ePCM technology is progressing as planned. A special focus was put on the memory cell characterisation and electrical test given some statistical distribution and first assessment of the memory cell performances. The validation work was first targeting the automotive mission profile in term of reliability (Temperature and Cycling). The first demonstrator called ‘CENTAURI’ was successfully processed, tested and characterized, samples were delivered to the end customer for further qualification purpose at application level.
Furthermore, a development plan for a more aggressive PCM cell size (shrinked cell) has been defined and started. The technology developments are in line with the plan for this first project period, nevertheless some delays have been announced for the next version of the demonstrator (Auto 28nm ePCM proto rev2).

In parallel to the process development, several work and studies were conducted to enhance the PCM with the help of academics and research institutes and also work has been started on the equipment side. Concerning the FeRAM path, the German partners already defined the development plan and started material and architecture studies on the first samples. All these activities were supported by the work done within WP4, definition, IP design and validation as well as the test chip planning. On the application side, partners started the specification work (requirements) and the preliminary integration work as well as using first samples for system level qualification.

Final results

The WakeMeUP project addresses the foreseen challenges for advanced MCUs by developing key enablers technologies. WAKeMeUP intends to provide demonstrators, in small volume, based on Advanced Non-volatile memory technologies for automotive microcontrollers, high security applications and general electronics demonstrators. Different test chip will be developed to test the technological capabilities and applicability. This implies that the project target at high Technology Readiness Level TRL (3 to 8) for the pilot line of 40nm MCU and 28nm FDSOI with ePCM. Some specific actions will be develop to push the e PCM performances and to benchmark them with others e NVM memory technologies. The TRL of such development will be between 2 and 5. Most of the WAKeMeUP enabling technologies and demonstrators are foreseen to reach the TRL 7-8 level by the end of the project.

The economic impact of strengthening the Nano electronics manufacturing capabilities in Europe includes more than the direct effect in skilled wages. When the demand for Nano electronics increases, the demand for materials, services, labor, machinery and equipment required in producing silicon devices increases, setting off a ripple effect throughout the European economy. This indirect impact is effective in all other industries, particularly in the SMEs sector which is playing a key role in delivering services and equipment depending on Nano electronic devices. Moreover, the field of applications enabled by the WAKeMeUP project encompasses all aspects of the electronics industry, and the widest range of applications, from automotive, to secure payments, and all kinds of smart objects, appliances…

The project will generate benefits for the involved member states, either in production facilities and or in academic know-how and it is expected to have a positive effect on the labor market. It will also benefit to the other ECSEL member states as supplier of the Pilot Line equipment or design of the devices or IP or users of the Pilot Line outputs. By establishing a new Non-Volatile Memory technology suitable for embedded and low-power applications in System-on-Chip (SoC), WAKeMeUP will positively impact many European segments of activity. Indeed, SoC applications are at the center of the European efforts towards building an added value technology platform for “More than Moore” technologies and maintain European research organizations in leading position. With appropriate technology transfers (in terms of processes, procedures and standard or even prototypes), the industries working in the following fields will find potential interest of the outreached activities from WAKeMeUP:
-Green technology thanks to precise industry processes, smart agriculture and farming.
-Health and biomedical applications (telemedicine or biomolecule sensing).
-Infrastructure control with tool surveillance, data security and environmental monitoring.

Website & more info

More info: http://www.wakemeup-ecsel.eu/.