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PIN3S SIGNED

Pilot Integration of 3nm Semiconducter technology

Total Cost €

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EC-Contrib. €

0

Partnership

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 PIN3S project word cloud

Explore the words cloud of the PIN3S project. It provides you a very rough idea of what is the project "PIN3S" about.

kti    manufacturers    section    electronics    ic    node    performance    realizing    form    zeiss    2018    world    overlay    3d    creation    miniaturization    energy    thermo    complemented    metrology    pilot    volume    more    materials    mobility    twente    technologies    pin3s    migrate    bases    nanoscale    euv    integration    cooperation    introduction    imec    maintaining    supplying    memory    germany    15    delft    plan    deal    hospital    approximately    asml    manufacturing    ecsel    ahead    fraunhofer    suppliers    solutions    realize    netherland    care    developers    communication    defects    lithography    3nm    tools    nova    mask    security    repair    efficient    heidelberg    leadership    strategic    covers    structures    industry    components    class    involvement    builds    health    institutes    logic    network    university    semiconductor    innovations    size    safety    annual    tu    evaluation    universities    fisher    ambition    power    societal    ju   

Project "PIN3S" data sheet

The following table provides information about the project.

Coordinator
ASML NETHERLANDS B.V. 

Organization address
address: DE RUN 6501
city: VELDHOVEN
postcode: 5504DR
website: www.asml.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Total cost 119˙581˙291 €
 EC max contribution 26˙787˙918 € (22%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2018-1-IA-two-stage
 Funding Scheme ECSEL-IA
 Starting year 2019
 Duration (year-month-day) from 2019-10-01   to  2022-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ASML NETHERLANDS B.V. NL (VELDHOVEN) coordinator 4˙500˙000.00
2    CARL ZEISS SMT GMBH DE (OBERKOCHEN) participant 5˙913˙176.00
3    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 5˙734˙108.00
4    BERLINER GLAS KGAA HERBERT KUBATZ GMBH & CO DE (BERLIN) participant 1˙422˙687.00
5    KLA-Tencor MIE GmbH DE (Weilburg) participant 1˙164˙750.00
6    APPLIED MATERIALS ISRAEL LTD IL (REHOVOT) participant 984˙188.00
7    UNIVERSITEIT TWENTE NL (ENSCHEDE) participant 975˙166.00
8    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 903˙068.00
9    PRODRIVE TECHNOLOGIES BV NL (SON) participant 828˙750.00
10    NOVA MEASURING INSTRUMENTS LTD IL (REHOVOT) participant 796˙478.00
11    SIOUX CCM BV NL (NUENEN) participant 703˙930.00
12    FEI ELECTRON OPTICS BV NL (EINDHOVEN) participant 690˙250.00
13    KLA-TENCOR CORPORATION (ISRAEL) IL (MIGDAL HAEMEK) participant 368˙550.00
14    ION BEAM SERVICES FR (ROUSSET) participant 265˙795.00
15    COVENTOR SARL FR (VILLEBON SUR YVETTE) participant 259˙696.00
16    TECHNISCHE UNIVERSITEIT DELFT NL (DELFT) participant 241˙652.00
17    VDL ETG TECHNOLOGY & DEVELOPMENT BV NL (EINDHOVEN) participant 233˙870.00
18    PFEIFFER VACUUM FR (ANNECY) participant 196˙909.00
19    SCIA SYSTEMS GMBH DE (CHEMNITZ) participant 157˙644.00
20    SOLMATES BV NL (ENSCHEDE) participant 151˙437.00
21    APPLIED MATERIALS BELGIUM BE (LEUVEN) participant 116˙875.00
22    RECIF TECHNOLOGIES FR (Blagnac) participant 99˙108.00
23    REDEN B.V. NL (HENGELO OV) participant 79˙827.00
24    UNIVERSITATEA POLITEHNICA DIN BUCURESTI RO (BUCHAREST) participant 0.00

Map

 Project objective

The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation. Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge network based on Universities of Germany, Heidelberg University Hospital, and the Netherland, TU Delft and the University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer. The project addresses Section 15 “Electronics Components & Systems Process Technology, Equipment, Materials and Manufacturing”, Major Challenge 4 “Maintaining world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and Major Challenge 1 “Developing advanced logic and memory technology for nanoscale integration and application-driven performance” of the ECSEL JU Annual Work Plan 2018. As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment & Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying new equipment and materials approximately two years ahead of introduction of volume production of advanced semiconductor manufacturers. With the results of the Pin3S project the consortium builds on realizing IC manufacturers to migrate to the 3nm Technology node which enables a class of new products which have more functionality, more performance and are more power efficient. As such it will form the bases for innovations yet to come enabling solutions that address the societal challenges in communication, mobility, health care, security, energy and safety & security.

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The information about "PIN3S" are provided by the European Opendata Portal: CORDIS opendata.

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