Opendata, web and dolomites

MUNDFAB SIGNED

Modeling Unconventional Nanoscaled Device FABrication

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

 MUNDFAB project word cloud

Explore the words cloud of the MUNDFAB project. It provides you a very rough idea of what is the project "MUNDFAB" about.

generations    power    performance    commercial    3d    annealing    internet    structures    electron    tools    time    nanosized    area    nereid    looped    experimental    roadmap    device    faceting    performed    data    sequential    model    investigations    deposition    materials    nano    fabrication    germanium    big    world    solid    predict    indispensable    overcome    because    scaling    calibrated    electrical    continuing    nanoscaled    story    computer    complemented    ppac    predictivity    nor    decade    epitaxial    simulation    explicitly    defect    energy    alloys    mobility    the3d    architectures    requests    paradigm    simulate    tcad    lose    moore    continuum    dopants    aided    toolchain    formerly    kmc    layers    activation    temperature    technologies    things    sufficient    complete    insufficient    regrowth    unconventional    nanosecond    industrial    laser    virtual    models    predicted    stages    first    silicon    workflow    situation    topography    continued    sentaurus    lkmc    accordingly    whenever    nanoelectronics    predictive    integration   

Project "MUNDFAB" data sheet

The following table provides information about the project.

Coordinator
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 

Organization address
address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686
website: www.fraunhofer.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 3˙787˙988 €
 EC max contribution 3˙787˙988 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2019-2
 Funding Scheme RIA
 Starting year 2020
 Duration (year-month-day) from 2020-01-01   to  2022-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) coordinator 746˙047.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 786˙618.00
3    CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS FR (PARIS) participant 660˙065.00
4    TECHNISCHE UNIVERSITAET WIEN AT (WIEN) participant 600˙823.00
5    CONSIGLIO NAZIONALE DELLE RICERCHE IT (ROMA) participant 537˙395.00
6    SIEC BADAWCZA LUKASIEWICZ - INSTYTUT TECHNOLOGII MATERIALOW ELEKTRONICZNYCH PL (WARSZAWA) participant 302˙500.00
7    STMICROELECTRONICS CROLLES 2 SAS FR (CROLLES) participant 154˙538.00

Map

 Project objective

Because of power, energy, and cost reasons, a further development of big data and mobility applications as well as the Internet of Things will require continued Power-Performance-Area-and-Cost (PPAC, formerly More Moore) scaling. This is predicted to lead within less than a decade to a paradigm change towards the 3D sequential integration of nanosized structures. While technology-computer aided design (TCAD) is indispensable now particularly for the early stages of industrial research and development, we face the situation that classical continuum tools lose their predictivity when going towards the nano world and towards the very low temperature processes required for 3D sequential integration. They are then neither able to predict the reduced electrical activation of dopants, nor topography effects like faceting, nor defect formation and growth. Accordingly, the NEREID NanoElectronics Roadmap for Europe explicitly requests to “…develop new tools taking into account all the new materials, technologies and device architectures…” To overcome the insufficient state of models and tools for a predictive simulation of low-temperature processing of high-mobility layers like silicon-germanium alloys, dedicated experimental investigations will be performed for solid-phase epitaxial regrowth, epitaxial deposition, and nanosecond laser annealing. Model development will be based whenever possible on the KMC and LKMC tools of Sentaurus Process, complemented by model development with own tools only when the functionality of commercial products is not sufficient. Own tools will be looped into the Sentaurus TCAD workflow so that in the end we will for the first time present a complete calibrated toolchain able to simulate the virtual fabrication of the3D sequential integration of nanoscaled devices. This will allow continuing further on the success story of the use of TCAD for the early development of the next generations of unconventional nanoscaled electron devices.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "MUNDFAB" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "MUNDFAB" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.)

DIHNET.EU (2018)

Next Generation European DIH Network

Read More  

MULTIPOINT (2019)

Multibeam Femtosecond Laser System for High Throughput Micro-drilling of HLFC Structures

Read More  

B-HUB FOR EUROPE (2020)

Blockchain HUB FOR EUROPEan startups acceleration and growth

Read More