Coordinatore | COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: rue des martyrs 17 contact info |
Nazionalità Coordinatore | France [FR] |
Totale costo | 3˙542˙773 € |
EC contributo | 2˙617˙000 € |
Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
Code Call | FP7-ICT-2009-4 |
Funding Scheme | CP |
Anno di inizio | 2010 |
Periodo (anno-mese-giorno) | 2010-01-01 - 2012-12-31 |
# | ||||
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1 |
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: rue des martyrs 17 contact info |
FR (Grenoble) | coordinator | 0.00 |
2 |
ALMA MATER STUDIORUM-UNIVERSITA DI BOLOGNA
Organization address
address: Via Zamboni contact info |
IT (BOLOGNA) | participant | 0.00 |
3 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Organization address
address: Rue Michel -Ange contact info |
FR (PARIS) | participant | 0.00 |
4 |
ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE
Organization address
address: BATIMENT CE 3316 STATION 1 contact info |
CH (LAUSANNE) | participant | 0.00 |
5 |
EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZURICH
Organization address
address: Raemistrasse contact info |
CH (ZUERICH) | participant | 0.00 |
6 |
INSTITUT POLYTECHNIQUE DE GRENOBLE
Organization address
address: AVENUE FELIX VIALLET contact info |
FR (GRENOBLE CEDEX 1) | participant | 0.00 |
7 |
STMICROELECTRONICS GRENOBLE 2 SAS
Organization address
address: RUE JULES HOROWITZ contact info |
FR (GRENOBLE) | participant | 0.00 |
8 |
UNIVERSITE JOSEPH FOURIER GRENOBLE 1
Organization address
address: Avenue Centrale, Domaine Universitaire contact info |
FR (GRENOBLE) | participant | 0.00 |
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
The shift from systems-on-chip (SoC) to manycore architectures brings new hardware and software challenges ranging from seamless integration of processors, memories the design of modular systems and application software to run on massively parallel and scalable platforms. Manycores will benefit tremendously from 3-dimensional (3D) integration technology that enables distribution in space of computational and storage functions to achieve unprecedented performance levels.nPROD3D is an ambitious high risk and high reward project that builds upon existing European world-class R&D expertise of the partners. PRO3D will innovate in both hardware and software technologies and demonstrate the effectiveness of manycores by an integrated and concerted effort in key aspects of hardware and software design. The uniqueness of this proposal stems from the experience of the partners in various aspects of manycore design that need to be addressed concurrently.nThe key outcome of PRO3D will be a holistic system design methodology to bring a drastic improvement of productivity to reduce cost development and time to market for future embedded computing. In particular, PROD3D will: i) develop a system software flow that can operate transparently on parallel manycore platforms; ii) develop formal methods for software design guaranteeing the composability and correct operation of both Hardware and software; iii) explore the impact of 3D integration for new computing architectures iv) Extend the software-flow to 3D-stacked manycores.nThe PRO3D consortium brings together world-class leaders in their own field with competencies to cover software, architecture and 3D integration. One of the key differentiators of the PRO3D consortium is its access to an industrial many core System on Chip, named 'Platform 2012' and provided by STM. The industrial impact of PRO3D is potentially high since re-search outcomes will be directly exploitatable into STM product roadmaps.