HARPA

Harnessing Performance Variability

Coordinatore	POLITECNICO DI MILANO    more  Organization address address: Via Ponzio 34/5 city: Milano postcode: 20133 contact info Titolo: Mr. Nome: Fabio Cognome: Conti Email: send email Telefono: +39 0223993431 Fax: +39 0223993417
Nazionalità Coordinatore	Italy [IT]
Totale costo	3˙979˙620 €
EC contributo	2˙797˙000 €
Programma	FP7-ICT Specific Programme "Cooperation": Information and communication technologies
Code Call	FP7-ICT-2013-10
Funding Scheme	CP
Anno di inizio	2013
Periodo (anno-mese-giorno)	2013-09-01   -   2016-08-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	POLITECNICO DI MILANO  Organization address address: Via Ponzio 34/5 city: Milano postcode: 20133 contact info Titolo: Mr. Nome: Fabio Cognome: Conti Email: send email Telefono: +39 0223993431 Fax: +39 0223993417	IT (Milano)	coordinator	0.00
2	HENESIS S.R.L.  Organization address address: via Gramsci city: Boretto postcode: 42022 contact info Titolo: Dr. Nome: Luca Cognome: Ascari Email: send email Telefono: +39 05211854211 Fax: 3905210000000	IT (Boretto)	participant	0.00
3	INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS  Organization address address: Patission Str. city: ATHINA postcode: 10682 contact info Titolo: Prof. Nome: Yannis Cognome: Vassiliou Email: send email Telefono: +30 2107724374 Fax: +30 2107722456	EL (ATHINA)	participant	0.00
4	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW  Organization address address: Kapeldreef city: LEUVEN postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: +32 16 28 16 13	BE (LEUVEN)	participant	0.00
5	STMICROELECTRONICS GRENOBLE 2 SAS  Organization address address: RUE JULES HOROWITZ city: GRENOBLE postcode: 38000 contact info Titolo: Mr. Nome: Benoit Cognome: HANIFI Email: send email Telefono: +33 4 76586992 Fax: +33 4 76584334	FR (GRENOBLE)	participant	0.00
6	THALES COMMUNICATIONS & SECURITY SAS  Organization address address: AVENUE DES LOUVRESSES city: GENNEVILLIERS postcode: 92230 contact info Titolo: Dr. Nome: Sylvie Cognome: RAYNAUD Email: send email Telefono: 33146132642 Fax: 33141302253	FR (GENNEVILLIERS)	participant	0.00
7	UNIVERSITY OF CYPRUS  Organization address address: KALLIPOLEOS STREET city: NICOSIA postcode: 1678 contact info Titolo: Dr. Nome: Yiannakis Cognome: Sazeides Email: send email Telefono: +357 22892704 Fax: 35722892701	CY (NICOSIA)	participant	0.00
8	VYSOKA SKOLA BANSKA - TECHNICKA UNIVERZITA OSTRAVA  Organization address address: 17 Listopadu city: OSTRAVA postcode: 70833 contact info Titolo: Ms. Nome: Kate?ina Cognome: Mrázková Email: send email Telefono: +420 597329142	CZ (OSTRAVA)	participant	0.00

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 Obiettivo del progetto (Objective)

Application requirements, power, and technological constraints are driving the architectural convergence of future processors towards heterogeneous many-cores. This development is confronted with variability challenges, mainly the susceptibility to time-dependent variations in silicon devices. Increasing guard-bands to battle variations is not scalable, due to the too large worst-case cost impact for technology nodes around 10 nm. The goal of HARPA is to enable next-generation embedded and high-performance heterogeneous many-cores to cost-effectively confront variations by providing Dependable-Performance: correct functionality and timing guarantees throughout the expected lifetime of a platform under thermal, power, and energy constraints. The HARPA solution employs a cross-layer approach. A middleware implements a control engine that steers software/hardware knobs based on information from strategically dispersed monitors. This engine relies on technology models to identify/exploit various types of platform slack - performance, power/energy, thermal, lifetime, and structural (hardware) - to restore timing guarantees and ensure the expected lifetime amidst time-dependent variations. Dependable-Performance is critical for embedded applications to provide timing correctness; for high-performance applications, it is paramount to ensure load balancing in parallel phases and fast execution of sequential phases. The lifetime requirement has ramifications on the manufacturing process cost and the number of field-returns. The HARPA novelty is in seeking synergies in techniques that have been considered virtually exclusively in the embedded or high-performance domains (worst-case guaranteed partly proactive techniques in embedded, and dynamic best-effort reactive techniques in high-performance). HARPA will demonstrate the benefits of merging concepts from these two domains by evaluating key applications from both segments running on embedded and high-performance platforms.