BOOM
Terabit-on-chip:nmicro and nano-scale silicon photonic integrated components and sub-systems enabling Tb/s-capacity, scalable and fully integrated photonic routers
| Coordinatore | INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Organization address
address: IROON POLYTECHNEIOU 9 contact info |
| Nazionalità Coordinatore | Greece [EL] |
| Totale costo | 4˙235˙362 € |
| EC contributo | 3˙100˙000 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2007-2 |
| Funding Scheme | CP |
| Anno di inizio | 2008 |
| Periodo (anno-mese-giorno) | 2008-05-01 - 2011-09-30 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Organization address
address: IROON POLYTECHNEIOU 9 contact info |
EL (ZOGRAFOU) | coordinator | 0.00 |
| 2 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse contact info |
DE (MUENCHEN) | participant | 0.00 |
| 3 |
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Organization address
address: OTTO BLUMENTHAL STRASSE contact info |
DE (AACHEN) | participant | 0.00 |
| 4 |
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK
Organization address
address: IM TECHNOLOGIEPARK contact info |
DE (FRANKFURT (ODER)) | participant | 0.00 |
| 5 |
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Organization address
address: Kapeldreef contact info |
BE (LEUVEN) | participant | 0.00 |
| 6 |
LIONIX BV
Organization address
address: HALLENWEG contact info |
NL (ENSCHEDE) | participant | 0.00 |
| 7 |
TECHNISCHE UNIVERSITAT BERLIN
Organization address
address: Strasse des 17 Juni contact info |
DE (BERLIN) | participant | 0.00 |
| 8 |
TECHNISCHE UNIVERSITEIT EINDHOVEN
Organization address
address: DEN DOLECH contact info |
NL (EINDHOVEN) | participant | 0.00 |
| 9 |
TELECOM ITALIA S.p.A
Organization address
address: PIAZZA DEGLI AFFARI 2 contact info |
IT (MILAN) | participant | 0.00 |
Mappa
Word cloud
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
Obiettivo del progetto (Objective)
BOOM is an integration project that aims to pursue the systematic advancement of Silicon-on-Insulator (SOI) integration technology to develop compact, cost-effective and power efficient silicon photonic components that enable photonic Tb/s capacity systems for current and new generation high speed broadband core networks. BOOM develops fabrication techniques as well as flip-chip bonding and wafer-scale integration methods to fabricate and mount the complete family of III-V components on SOI boards including: arrays of Semiconductor Optical Amplifiers, monolithic blocks of Electro-absorption modulated lasers (EMLs) and highly efficient photodetectors. As such the BOOM SOI optical board technology will be able to blend the cost-effectiveness and integration potential of silicon with the high bandwidth and processing power of III-V material and provide a new generation of functional and miniaturized photonic components including: (a) a single 160 Gb/s SOI Wavelength Converter (WC) and a quadruple array of 160 Gb/s WCs with a record chip throughput of 640 Gb/s on a size 20x5 mm2 , (b) a compact, eight channel, ultra dense WDM InAlAs-InGaAs photoreceiver with record high responsivity and (c) a dual SOI EML transmitter together with its electronic drivers on a single chip. In addition, BOOM invests in the development of improved CMOS compatible waveguide technologies to fabricate miniaturized, low loss and fully reconfigurable wavelength routing cross-connects based on two dimensional grids of serially interconnected micro-ring resonators. BOOM will perform system level integration of all these components to assemble the first prototype rack-mount, ultra-high capacity routing platform based on silicon photonics that will require minimum board space and power consumption and achieve a total throughput of 640 Gb/s. The platform will be evaluated in a network operator test bed employing GbE optical signals.