THERMINATOR
Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future
| Coordinatore | STMICROELECTRONICS SRL
Organization address
address: Stradale Primosole 50 contact info |
| Nazionalità Coordinatore | Italy [IT] |
| Totale costo | 10˙997˙930 € |
| EC contributo | 6˙293˙810 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2009-4 |
| Funding Scheme | CP |
| Anno di inizio | 2010 |
| Periodo (anno-mese-giorno) | 2010-01-01 - 2012-12-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
STMICROELECTRONICS SRL
Organization address
address: Stradale Primosole 50 contact info |
IT (Catania) | coordinator | 0.00 |
| 2 |
ALMA MATER STUDIORUM-UNIVERSITA DI BOLOGNA
Organization address
address: Via Zamboni contact info |
IT (BOLOGNA) | participant | 0.00 |
| 3 |
BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM
Organization address
address: MUEGYETEM RAKPART contact info |
HU (BUDAPEST) | participant | 0.00 |
| 4 |
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: RUE LEBLANC contact info |
FR (PARIS 15) | participant | 0.00 |
| 5 |
CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT
Organization address
address: RUE JAQUET DROZ contact info |
CH (NEUCHATEL) | participant | 0.00 |
| 6 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse contact info |
DE (MUNCHEN) | participant | 0.00 |
| 7 |
GRADIENT DESIGN AUTOMATION, INC. - GDA
Organization address
address: OLD IRONSIDES DRIVE, SUITE 200 contact info |
US (SANTA CLARA) | participant | 0.00 |
| 8 |
INTEL MOBILE COMMUNICATIONS GMBH
Organization address
address: AM CAMPEON contact info |
DE (NEUBIBERG) | participant | 0.00 |
| 9 |
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Organization address
address: Kapeldreef contact info |
BE (LEUVEN) | participant | 0.00 |
| 10 |
MUNEDA GmbH
Organization address
address: Stefan-George-Ring contact info |
DE (Munich) | participant | 0.00 |
| 11 |
NXP SEMICONDUCTORS GERMANY GMBH
Organization address
address: Stresemannallee contact info |
DE (Hamburg) | participant | 0.00 |
| 12 |
NXP SEMICONDUCTORS NETHERLANDS BV
Organization address
address: High Tech Campus contact info |
NL (EINDHOVEN) | participant | 0.00 |
| 13 |
OFFIS E.V.
Organization address
address: Escherweg contact info |
DE (OLDENBURG) | participant | 0.00 |
| 14 |
POLITECNICO DI TORINO
Organization address
address: CORSO DUCA DEGLI ABRUZZI contact info |
IT (TORINO) | participant | 0.00 |
| 15 |
ST-POLITO Societa' consortile a r.l.
Organization address
address: CORSO DUCA DEGLI ABRUZZI contact info |
IT (Torino) | participant | 0.00 |
| 16 |
Synopsys Armenia CJSC
Organization address
address: Arshakunyats contact info |
AM (Yerevan) | participant | 0.00 |
| 17 |
SYNOPSYS SWITZERLAND LLC
Organization address
address: Thurgauerstrasse contact info |
CH (ZURICH) | participant | 0.00 |
Mappa
Word cloud
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Obiettivo del progetto (Objective)
Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and device breakdown. To complicate the picture, electronic components tend to get warmer on their own as they operate, due to the fact that the power drawn by the devices from the power supply is dissipated by Joule effect.nnAs time passes, heat and temperature management is becoming increasingly problematic, for reasons ranging from economical to technological. Packages that are able to sustain high temperatures are very expensive, and so are heat-sinks and cooling systems. In addition, high operating temperatures tend to cause malfunctioning of circuits and components, thus impacting the reliability of the electronic products which incorporate such devices.nnThe development of new, thermal-aware design paradigms can no longer be postponed if the goal is to enable designers to fully exploit the electronic technologies of the future, being those CMOS or alternative to CMOS.nnThe thermal problem has several facets, thus it needs to be addressed in a comprehensive manner. The THERMINATOR projects will address the following major challenges: 1) To devise innovative thermal models usable at different levels of abstraction, and to interface/integrate them into existing simulation and design frameworks. 2) To develop new, thermal-aware design solutions, customized for the different technologies and application domains of interest. 3) To enhance existing EDA solutions by means of thermal-aware add-on tools that will enable designers to address temperature issues during their daily work and with their usual design flows.
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