Explore the words cloud of the HYPHEN project. It provides you a very rough idea of what is the project "HYPHEN" about.
The following table provides information about the project.
Coordinator |
KARLSRUHER INSTITUT FUER TECHNOLOGIE
Organization address contact info |
Coordinator Country | Germany [DE] |
Total cost | 149˙875 € |
EC max contribution | 149˙875 € (100%) |
Programme |
1. H2020-EU.1.1. (EXCELLENT SCIENCE - European Research Council (ERC)) |
Code Call | ERC-2015-PoC |
Funding Scheme | ERC-POC |
Starting year | 2015 |
Duration (year-month-day) | from 2015-08-01 to 2017-01-31 |
Take a look of project's partnership.
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1 | KARLSRUHER INSTITUT FUER TECHNOLOGIE | DE (KARLSRUHE) | coordinator | 149˙875.00 |
The global explosion of data traffic and the migration of essential services to “the cloud” are combining to push current data-center infrastructures to their limits. This applies in particular to communication networks within and between data centers (DC), which limit scalability of computing and storage already today. Wavelength-division multiplexing (WDM) transmission schemes are key to overcome these bottlenecks, increasing the throughput of inter-DC and intra-DC communication links by more than an order of magnitude. However, but there are currently no WDM systems in the market that fulfill the associated cost and performance requirements: Conventional systems based on discrete components such as SFP or CFP transceivers are far too bulky and too expensive, while monolithic photonic integration remains technologically challenging and constrained in performance. The fundamental question remains: How to flexibly combine photonic components of a variety of material systems to create cost- and performance-optimized solutions for data centers? The answer to this question will unlock multi-billion-Euro market opportunities connected with cloud networks. HYPHEN aims at exploring and verifying the commercial potential of a novel class of optical WDM engines that combine the benefits of a large-scale photonic integration with the design flexibility of discrete systems. The optical engines are based on hybrid multi-chip integration and exploit the technique of photonic wire bonding, which was established and elaborated in the framework of the ERC Stating Grant EnTeraPIC. HYPHEN comprises an in-depth analysis of market opportunities and competitive boundary conditions, the specification of technical product concepts that are geared towards the most important technology gap, as well as the associated IP strategy and risk analysis. The project shall result in a comprehensive business plan that allows to raise funds for the next phase of commercialization.
year | authors and title | journal | last update |
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2016 |
Simon Schneider, Matthias Lauermann, Philipp-Immanuel Dietrich, Claudius Weimann, Wolfgang Freude, Christian Koos Optical coherence tomography system mass-producible on a silicon photonic chip published pages: 1573, ISSN: 1094-4087, DOI: 10.1364/OE.24.001573 |
Optics Express 24/2 | 2019-07-25 |
2015 |
Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L. Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie published pages: , ISSN: , DOI: |
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 | 2019-07-25 |
2016 |
Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C. Hybrid 2D/3D photonic integration for non-planar circuit topologies published pages: , ISSN: , DOI: |
42th European Conf. Opt. Commun. (ECOC\'16), Düsseldorf, Germany, Sept. 18–22 | 2019-07-25 |
2015 |
Nicole Lindenmann, Stephan Dottermusch, Maria Laura Goedecke, Tobias Hoose, Muhammad Rodlin Billah, Temitope Paul Onanuga, Andreas Hofmann, Wolfgang Freude, Christian Koos Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding published pages: 755-760, ISSN: 0733-8724, DOI: 10.1109/JLT.2014.2373051 |
Journal of Lightwave Technology 33/4 | 2019-07-25 |
2012 |
N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, C. Koos Photonic wire bonding: a novel concept for chip-scale interconnects published pages: 17667, ISSN: 1094-4087, DOI: 10.1364/OE.20.017667 |
Optics Express 20/16 | 2019-07-25 |
2015 |
Koos, C. Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications published pages: , ISSN: , DOI: |
18th International Workshop on Physics of Semiconductor Devices (IPWSD-2015), Bangalore, India, December 7-10 | 2019-07-25 |
2016 |
Koos, C.; Freude, W.; Dalton, L. R.; Kippenberg, T. J.; Barry, L. P.; Ramdane, A.; Lelarge, F.; Wolf, S.; Zwickel, H.; Lauermann, M.; Weimann, C.; Hartmann, W.; Kemal, J. N.; Marin-Palomo, P.; Trocha, P.; Pfeifle, J.; Herr, T.; Brasch, V.; Watts, R. T.; Elder, D. L.; Martinez, A.; Panapakkam, V.; Chimot, N. Silicon-organic hybrid (SOH) devices and their use in comb-based communication systems published pages: , ISSN: , DOI: |
13th International Conference on Group IV Photonics (GFP\'16), Shanghai, China, August 24–26 | 2019-07-25 |
2017 |
Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Muehlbrandt, S.; Melikyan, A.; Zwickel, H.; Kutuvantavida, Y.; Harter, T.; Lauermann, M.; Elder, D. L. Nanophotonic modulators and photodetectors using silicon photonic and plasmonic device concepts published pages: paper 10098-6, ISSN: , DOI: |
SPIE Physics and Simulation of Optoelectronic Devices XXV (OPTO-SPIE\'17), San Francisco (CA), USA, Jan. 28 - Feb. 2 | 2019-07-25 |
2015 |
Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C. Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation published pages: , ISSN: , DOI: |
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 | 2019-07-25 |
2017 |
Koos, C.; Kippenberg, T. J.; Barry, L. P.; Ramdane, A.; Lelarge, F.; Freude, W.; Marin-Palomo, P.; Kemal, J. N.; Weimann, C.; Wolf, S.; Trocha, P.; Pfeifle, J.; Karpov, M.; Kordts, A.; Brasch, V.; Watts, R. T.; Martinez, A.; Panapakkam, V.; Chimot, N. Chip-scale frequency comb generators for high-speed communications and optical metrology published pages: paper 10090-15, ISSN: , DOI: |
SPIE Nonlinear Frequency Generation and Conversion: Materials and Devices XVI, (LASE-SPIE\'17), San Francisco (CA), USA, Jan. 28 - Feb. 2 | 2019-07-25 |
2016 |
Christian Koos, Juerg Leuthold, Wolfgang Freude, Manfred Kohl, Larry Dalton, Wim Bogaerts, Anna Lena Giesecke, Matthias Lauermann, Argishti Melikyan, Sebastian Koeber, Stefan Wolf, Claudius Weimann, Sascha Muehlbrandt, Kira Koehnle, Joerg Pfeifle, Wladislaw Hartmann, Yasar Kutuvantavida, Sandeep Ummethala, Robert Palmer, Dietmar Korn, Luca Alloatti, Philipp Claudius Schindler, Delwin L. Elder, Thorsten Wahlbrink, Jens Bolten Silicon-Organic Hybrid (SOH) and Plasmonic-Organic Hybrid (POH) Integration published pages: 256-268, ISSN: 0733-8724, DOI: 10.1109/JLT.2015.2499763 |
Journal of Lightwave Technology 34/2 | 2019-07-25 |
2016 |
Gerald Göring, Philipp-Immanuel Dietrich, Matthias Blaicher, Swati Sharma, Jan G. Korvink, Thomas Schimmel, Christian Koos, Hendrik Hölscher Tailored probes for atomic force microscopy fabricated by two-photon polymerization published pages: 63101, ISSN: 0003-6951, DOI: 10.1063/1.4960386 |
Applied Physics Letters 109/6 | 2019-07-25 |
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