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DIMENSION SIGNED

Directly Modulated Lasers on Silicon

Total Cost €

EC-Contrib. €

Partnership

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Outcomes and
results

DIMENSION project word cloud

Explore the words cloud of the DIMENSION project. It provides you a very rough idea of what is the project "DIMENSION" about.

techniques takes back modulated demonstrators 25gb amplitude coherent opportunity 802 photonics lengths modulator lr8 pulse electro dimension inter position compatible performance medium chip 400 10km wafers datacenter functions bonding array cloud transmitter modulation adhere metro bi offers opening electronics stack platform gbe realise telecom cmos route 25g assembly technologies pursued volume transceivers grown active operated excess structures truly wavelength band standard manufacturing advantages link ieee fundamental innovative saving onto era line optical thin data centres front standards laser channels ieee802 silicon place demonstrating components photonic operation lasers tuneable 3bs pam4 power establishes integration ultra

Project "DIMENSION" data sheet

The following table provides information about the project.

Coordinator	TECHNISCHE UNIVERSITAET DRESDEN Organization address address: HELMHOLTZSTRASSE 10 city: DRESDEN postcode: 1069 website: http://www.tu-dresden.de/ contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Germany [DE]
Project website	http://dimension-h2020.eu
Total cost	3˙422˙128 €
EC max contribution	2˙621˙758 € (77%)
Programme	1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
Code Call	H2020-ICT-2015
Funding Scheme	RIA
Starting year	2016
Duration (year-month-day)	from 2016-02-01 to 2020-09-30

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	TECHNISCHE UNIVERSITAET DRESDEN TECHNISCHE UNIVERSITAET DRESDEN Organization address address: HELMHOLTZSTRASSE 10 city: DRESDEN postcode: 1069 website: http://www.tu-dresden.de/ contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (DRESDEN)	coordinator	705˙500.00
2	IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK Organization address address: IM TECHNOLOGIEPARK 25 city: FRANKFURT ODER postcode: 15236 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (FRANKFURT ODER)	participant	800˙633.00
3	ADVA OPTICAL NETWORKING SE ADVA OPTICAL NETWORKING SE Organization address address: MAERZENQUELLE 1-3 city: MEININGEN postcode: 98617 website: www.advaoptical.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (MEININGEN)	participant	522˙500.00
4	ALTER TECHNOLOGY TUV NORD UK LIMITED ALTER TECHNOLOGY TUV NORD UK LIMITED Organization address address: BAIN SQUARE 5 city: LIVINGSTON postcode: EH54 7DQ website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (LIVINGSTON)	participant	322˙500.00
5	RESEARCH AND EDUCATION LABORATORY IN INFORMATION TECHNOLOGIES RESEARCH AND EDUCATION LABORATORY IN INFORMATION TECHNOLOGIES Organization address address: Adrianiou 2 & Papada city: Athens postcode: 11525 website: www.ait.edu.gr contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	EL (Athens)	participant	270˙625.00
6	IBM RESEARCH GMBH IBM RESEARCH GMBH Organization address address: SAEUMERSTRASSE 4 city: RUESCHLIKON postcode: 8803 website: www.zurich.ibm.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	CH (RUESCHLIKON)	participant	0.00

Map

Project objective

DIMENSION establishes a truly integrated electro-optical platform, extending the silicon (Bi)CMOS and silicon photonics platform with III-V photonic functionality. The III-V integration concept is fully CMOS compatible and offers fundamental advantages compared to state-of-the art integration approaches. After bonding and growing ultra-thin III-V structures onto the silicon front-end-of-line, the active optical functions are embedded into the back-end of line stack. This offers great opportunities for new innovative devices and functions at the chip-level but also for the assembly of such silicon devices. As processing takes place on silicon wafers, this project has the unique opportunity to bring the cost of integrated devices, with CMOS, photonic and III-V functionality, down to the cost of silicon volume manufacturing. Such a platform has the potential to allow Europe to take a leading position in the field of high functionality integrated photonics. Moreover, the project demonstrators adhere to standards such as IEEE802.3, 25G optical components and low-power electronics, thus opening a viable route towards ultra-low-cost high-performance optical transceivers for a new era of data centres and cloud systems. DIMENSION will realise three demonstrators: • A short-reach transmitter for intra-datacenter operation addressing the 400 GbE-LR8 (IEEE 802.3bs) standard making use of an array of directly modulated lasers, pulse-amplitude-modulation (PAM4) techniques and 8 wavelength channels in the telecom O-band. • A medium-reach transmitter for inter-datacenter applications beyond the 400 GbE-LR8 (IEEE 802.3bs) standard by providing a tuneable coherent transmitter for inter-datacenter and metro applications for link lengths in excess of 10km using a modulator integrated on the same chip. • A novel laser directly grown on silicon photonics, operated at 25Gb/s in the telecom O-band demonstrating the significant cost-saving potential of the technologies pursued in DIMENSION.

Deliverables

List of deliverables.
Report on basic component characterization	Documents, reports	2020-01-21 10:09:13
Data Management Plan	Documents, reports	2020-01-21 10:09:12
Report on system specifications	Documents, reports	2020-01-21 10:09:13
Second report on dissemination, exploitation and standardisation activities	Documents, reports	2020-01-21 10:09:13
First report on electrical design	Documents, reports	2020-01-21 10:09:13
Second periodic report â€“ governing the first fabrication iteration	Documents, reports	2020-01-21 10:09:13
Report on techno-economical evaluation	Documents, reports	2020-01-21 10:09:13
Report on component-level and single-channel characterization	Documents, reports	2020-01-21 10:09:13
Project presentation document, website public, intranet active	Websites, patent fillings, videos etc.	2020-01-21 10:09:12
First report on dissemination, exploitation and standardisation activities	Documents, reports	2020-01-21 10:09:12
Interim progress report	Documents, reports	2020-01-21 10:09:12
First periodic report â€“ governing the design phase	Documents, reports	2020-01-21 10:09:12
Report on component specifications	Documents, reports	2020-01-21 10:09:13

Take a look to the deliverables list in detail: detailed list of DIMENSION deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2018	P. Torres-Ferrera, M.A. GarcÃa-YÃ¡Ã±ez, R. GutiÃ©rrez-CastrejÃ³n, I. Tomkos Coherent optical WDM systems for 1.6â€¯Tb/s Ethernet over 40â€¯km of single-mode fiber published pages: , ISSN: 1068-5200, DOI: 10.1016/j.yofte.2018.01.021	Optical Fiber Technology	2020-01-21
2017	Herwig Hahn, Marilyne Sousa, Lukas Czornomaz Low-resistive, CMOS-compatible ohmic contact schemes to moderately doped n-InP published pages: 235102, ISSN: 0022-3727, DOI: 10.1088/1361-6463/aa6f7a	Journal of Physics D: Applied Physics 50/23	2020-01-21
2016	Despoina Petousi, Pedro Rito, Stefan Lischke, Dieter Knoll, Iria Garcia-Lopez, Marcel Kroh, Rainer Barth, Christian Mai, Ahmet-Cagri Ulusoy, Anna Peczek, Georg Winzer, Karsten Voigt, Dietmar Kissinger, Klaus Petermann, Lars Zimmermann Monolithically Integrated High-Extinction-Ratio MZM With a Segmented Driver in Photonic BiCMOS published pages: 2866-2869, ISSN: 1041-1135, DOI: 10.1109/LPT.2016.2624700	IEEE Photonics Technology Letters 28/24	2020-01-21
2018	N. Neumann, Z. Al-Husseini and D. Plettemeier Nonlinearity, noise and bandwidth influence for PAM4 modulation format published pages: , ISSN: , DOI:		2020-01-21
2018	Christos A. Thraskias, Eythimios N. Lallas, Niels Neumann, Laurent Schares, Bert J. Offrein, Ronny Henker, Dirk Plettemeier, Frank Ellinger, Juerg Leuthold, Ioannis Tomkos Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications published pages: 2758-2783, ISSN: 1553-877X, DOI: 10.1109/comst.2018.2839672	IEEE Communications Surveys & Tutorials 20/4	2020-01-21
2018	Marc Seifried, Gustavo Villares, Yannick Baumgartner, Herwig Hahn, Mattia Halter, Folkert Horst, Daniele Caimi, Charles Caer, Marilyne Sousa, Roger Franz Dangel, Lukas Czornomaz, Bert Jan Offrein Monolithically Integrated CMOS-Compatible IIIâ€“V on Silicon Lasers published pages: 1-9, ISSN: 1077-260X, DOI: 10.1109/jstqe.2018.2832654	IEEE Journal of Selected Topics in Quantum Electronics 24/6	2020-01-21
2017	Benjamin Wohlfeil, Danish Rafique, and Michael Eiselt Photonic Integrated Circuits for Data Center Interconnects published pages: , ISSN: , DOI:	European Conference on Integrated optics (ECIO)	2020-01-21
2018	Roger Dangel, Antonio La Porta, Daniel Jubin, Folkert Horst, Norbert Meier, Marc Seifried, Bert J. Offrein Polymer Waveguides Enabling Scalable Low-Loss Adiabatic Optical Coupling for Silicon Photonics published pages: 1-11, ISSN: 1077-260X, DOI: 10.1109/jstqe.2018.2812603	IEEE Journal of Selected Topics in Quantum Electronics 24/4	2020-01-21
2018	Giuglea, G. Belfiore, M. Khafaji, R. Henker, D. Petousi, G. Winzer, L. Zimmermann and F. Ellinger Comparison of Segmented and Traveling-Wave Electro-Optical Transmitters Based on Silicon Photonics Mach-Zehnder Modulators published pages: , ISSN: , DOI:	International Conference on Photonics in Switching and Computing	2020-01-21
2018	Benjamin Wohlfeil, Gilda Raoof Mehrpoor, Annika Dochhan, Danish Rafique, Michael Eiselt and JÃ¶rg-Peter Elbers Photonic integrated circuits for data center interconnects published pages: , ISSN: , DOI:	International Conference on Photonics in Switching and Computing	2020-01-21

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