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Opendata, web and dolomites

PRIME SIGNED

Ultra-Low PoweR technologIes and MEmory architectures for IoT

Total Cost €

EC-Contrib. €

Partnership

Views

Outcomes and
results

PRIME project word cloud

Explore the words cloud of the PRIME project. It provides you a very rough idea of what is the project "PRIME" about.

complementarily semiconductor energy things goals demonstrators competitive market ecosystem security medical innovative flow ram power flexible wafer architecture agricultural 22nm consumption houses area containing iot technologies revolution ip ulp platform analog delivered capability tools innovation stt providers eco healthcare blocks idms internet ultra logic leadership foundries banks strengthen created macros domains implementations chip performance advantage efficient realize node device sensor expertise domestics solutions desired suppliers developped mobility creation industry wireless memory rram manufacturing rf covers fdsoi smart components benefit architectural puf prime building

Project "PRIME" data sheet

The following table provides information about the project.

Coordinator	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Belgium [BE]
Project website	http://www.prime-h2020.eu
Total cost	38˙296˙264 €
EC max contribution	12˙038˙776 € (31%)
Programme	1. H2020-EU.2.1.1.7. (ECSEL)
Code Call	H2020-ECSEL-2015-1-RIA-two-stage
Funding Scheme	ECSEL-RIA
Starting year	2015
Duration (year-month-day)	from 2015-12-01 to 2019-09-30

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	coordinator	3˙116˙585.00
2	GLOBALFOUNDRIES Dresden Module One LLC & Co. KG GLOBALFOUNDRIES Dresden Module One LLC & Co. KG Organization address address: Wilschdorfer Landstrasse 101 city: Dresden postcode: 1109 website: www.globalfoundries.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (Dresden)	participant	2˙936˙049.00
3	FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. Organization address address: HANSASTRASSE 27C city: MUNCHEN postcode: 80686 website: www.fraunhofer.de contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (MUNCHEN)	participant	1˙013˙123.00
4	TECHNISCHE UNIVERSITAET DRESDEN TECHNISCHE UNIVERSITAET DRESDEN Organization address address: HELMHOLTZSTRASSE 10 city: DRESDEN postcode: 1069 website: http://www.tu-dresden.de/ contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (DRESDEN)	participant	977˙842.00
5	STICHTING IMEC NEDERLAND STICHTING IMEC NEDERLAND Organization address address: HIGH TECH CAMPUS 31 city: EINDHOVEN postcode: 5656 AE website: www.holstcentre.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	participant	688˙361.00
6	IDT EUROPE GMBH IDT EUROPE GMBH Organization address address: GRENZSTRASSE 28 city: DRESDEN postcode: 1109 website: http://www.zmd.biz contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (DRESDEN)	participant	560˙248.00
7	CEZAMAT PW SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA CEZAMAT PW SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA Organization address address: UL. POLECZKI 19 city: WARSZAWA postcode: 00-644 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	PL (WARSZAWA)	participant	450˙000.00
8	SURECORE LTD SURECORE LTD Organization address address: FLOOR 5, 2 WELLINGTON PLACE city: LEEDS postcode: LS1 4AP website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (LEEDS)	participant	425˙437.00
9	SYNOPSYS NETHERLANDS BV SYNOPSYS NETHERLANDS BV Organization address address: HIGH TECH CAMPUS 41 city: EINDHOVEN postcode: 5656 AE website: www.viragelogic.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	participant	379˙609.00
10	DREAM CHIP TECHNOLOGIES GMBH DREAM CHIP TECHNOLOGIES GMBH Organization address address: STEINRIEDE 10 city: GARBSEN postcode: 30827 website: www.dreamchip.de contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (GARBSEN)	participant	335˙625.00
11	STMICROELECTRONICS SA STMICROELECTRONICS SA Organization address address: BOULEVARD ROMAIN ROLLAND 29 city: MONTROUGE postcode: 92120 website: www.st.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (MONTROUGE)	participant	320˙795.00
12	SOITEC SA SOITEC SA Organization address address: CHEMIN DES FRANQUES - PARC TECHNOLOGIQUE DES FONTAINES city: BERNIN postcode: 38190 website: www.soitec.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (BERNIN)	participant	210˙625.00
13	STMICROELECTRONICS ROUSSET SAS STMICROELECTRONICS ROUSSET SAS Organization address address: AVENUE COQ ZI PEYNIER ROUSSET city: ROUSSET postcode: 13790 website: www.st.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	FR (ROUSSET)	participant	201˙334.00
14	INTRINSIC ID B.V. INTRINSIC ID B.V. Organization address address: HIGH TECH CAMPUS 9 city: EINDHOVEN postcode: 5656 AE website: www.intrinsic-id.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (EINDHOVEN)	participant	140˙400.00
15	BUBBLES AND BEYOND GMBH BUBBLES AND BEYOND GMBH Organization address address: KARL-HEINE-STRASSE 99 city: LEIPZIG postcode: 4229 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (LEIPZIG)	participant	129˙375.00
16	TECHNOLUTION BV TECHNOLUTION BV Organization address address: BURGERMEESTER JAMESSINGEL 1 city: GOUDA postcode: 2803 WV website: www.technolution.eu contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (GOUDA)	participant	125˙865.00
17	Singulus Technologies AG Singulus Technologies AG Organization address address: Hanauer Landstrasse 103 city: KAHL AM MAIN postcode: 63796 website: www.singulus.de contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (KAHL AM MAIN)	participant	27˙500.00

Map

Project objective

The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will develop and demonstrate the key building blocks of IoT ULP systems driven by the applications in the medical, agricultural, domestics and security domains. This will include development of high performance, energy efficient and cost effective technology platform, flexible design ecosystem (including IP and design flow), changes in architectural and power management to reduced energy consumption, security blocks based on PUF and finally the System of Chip and System in Package memory banks and processing implementations for IoT sensor node systems. Developped advanced as 22nm FDSOI low power technologies with logic, analog, RF and embedded new memory components (STT RAM and RRAM) together with innovative design and system architecture solutions will be used to build macros and demonstrate functionality and power reduction advantage of the new IoT device components. The PRIME project will realize several demonstrators of IoT system building blocks to show the proposed low power wireless solutions, functionality and performance of delivered design and technology blocks. The consortium semiconductor ecosystem (IDMs, design houses, R&D, tools & wafer suppliers, foundries, system/product providers) covers complementarily all desired areas of expertise to achieve the project goals. The project will enable an increase in Europe’s innovation capability in the area of ULP Technology, design and applications, creation of a competitive European eco-system and help to identify market leadership opportunities in security, mobility, healthcare and smart cost competitive manufacturing.

Deliverables

List of deliverables.
Public communication of final result	Other	2020-02-12 17:41:42
Web page	Other	2019-09-10 08:57:16

Take a look to the deliverables list in detail: detailed list of PRIME deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2017	Kalishetthyhalli Mahadevaiah, Mamathamba PVD and ALD process development of advanced oxide-based RRAM-stacks published pages: , ISSN: , DOI:		2019-12-17
2020	Elbert Bechthum, Johan Dijkhuis, Ming Ding, Yuming He, Johan van den Heuvel, Paul Mateman, Gert-Jan van Schaik, Kenichi Shibata, Minyoung Song, Evgenii Tiurin, Stefano Traferro, Nick Winkel, Yao-Hong Li, Christian Bachmann A low-power BLE transceiver with support for phase-based ranging, featuring 5Î¼s PLL locking time and 5.3ms ranging time, enabled by staircase-chirp PLL with sticky-lock channel-switching* published pages: , ISSN: , DOI:	2020 International Solid-State Circuits Conference	2019-12-17
2019	Mattis Hasler, Robert Wittig, Emil Matus, Gerhard Fettweis Slicing FIFOs for On-Chip Memory Bandwidth Exhaustion published pages: 1-10, ISSN: 1549-8328, DOI: 10.1109/tcsi.2019.2926134	IEEE Transactions on Circuits and Systems I: Regular Papers Print ISSN: 1549-8328 Electroni	2019-12-17
2019	W. Schwarzenbach, B.-Y. Nguyen, L. Ecarnot, S. Loubriat, M. Detard, E. Cela, C. Bertrand-Giuliani, G. Chabanne, C. Maddalon, N. Daval, C. Maleville Advanced FD-SOI and Beyond Low Temperature SmartCutâ„¢ Enables High Density 3-D SoC Applications published pages: 863-868, ISSN: 2168-6734, DOI: 10.1109/jeds.2019.2916460	IEEE Journal of the Electron Devices Society 7	2019-12-17
2019	Hua Lv, JoÃ£o Fidalgo, Diana C. LeitÃ£o, Ana V. Silva, Thomas KÃ¤mpfe, Stefan Riedel, Juergen Langer, Jerzy Wrona, Berthold Ocker, Paulo P. Freitas, Susana Cardoso The annealing effect on memory state stability and interlayer coupling in perpendicular magnetic tunnel junctions with ultrathin MgO barrier published pages: 142-146, ISSN: 0304-8853, DOI: 10.1016/j.jmmm.2019.01.050	Journal of Magnetism and Magnetic Materials 477	2019-12-17
2019	M Hasler, R Wittig, E Matus, G Fettweis A Hybrid Execution Approach to Improve the Performance of Dataflow Applications published pages: , ISSN: , DOI:	16th International SoC Design Conference	2019-12-17
2019	Maciej Haras, MichaÅ‚ Markiewicz, StÃ©phane Monfray, Thomas Skotnicki Pulse mode of operation â€“ A new booster of TEG, improving power up to X2.7 â€“ to better fit IoT requirements published pages: 104204, ISSN: 2211-2855, DOI: 10.1016/j.nanoen.2019.104204	Nano Energy In Press	2019-12-17
2019	S Nam, E Matus, G Fettweis Application Specific Instruction Processor for Dynamic Connection Allocation in TDM-NoCs published pages: , ISSN: , DOI:	32th IEEE International System-On-Chip Conference	2019-12-17
2017	S Haas, G Fettweis Energy-Efficient Hash Join Implementations in Hardware-Accelerated MPSoCs published pages: , ISSN: , DOI:	Eighth International Workshop on Accelerating Analytics and Data Management Systems Using Modern Processor and Storage Architectures Eighth International Workshop o	2019-12-17
2018	Hua Lv, Diana C. Leitao, Zhiwei Hou, Paulo P. Freitas, Susana Cardoso, Thomas KÃ¤mpfe, Johannes MÃ¼ller, Juergen Langer, Jerzy Wrona Barrier breakdown mechanism in nano-scale perpendicular magnetic tunnel junctions with ultrathin MgO barrier published pages: 55908, ISSN: 2158-3226, DOI: 10.1063/1.5007656	AIP Advances 8/5	2019-09-10
2017	Benjamin Prautsch, Uwe Eichler, Torsten Reich, Jens Lienig MESH: Explicit and Flexible Generation of Analog Arrays published pages: , ISSN: , DOI:	International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) annually	2019-09-10

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