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MICROPRINCE SIGNED

Pilot line for micro-transfer-printing of functional components on wafer level

Total Cost €

EC-Contrib. €

Partnership

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Outcomes and
results

MICROPRINCE project word cloud

Explore the words cloud of the MICROPRINCE project. It provides you a very rough idea of what is the project "MICROPRINCE" about.

printed microprince transfer chain special national expertise thicknesses cluster industry size material companies components optical regional purpose foundry micro 13 scenarios worldwide laboratory pilot sensors ecs semiconductor creation microns printing line onto microscale accompanied native wafer dimensions hundreds sme flexible successfully manufacturing structured processed industrial tp acting contains feasibility incl clear elastomer competence stamp environment filters nationwide setup substrate substrates materials capability consisting demonstrating supports first smart lateral countries circuit functional institutes heterogeneous combine integration scientific leadership few

Project "MICROPRINCE" data sheet

The following table provides information about the project.

Coordinator	X-FAB MEMS FOUNDRY GmbH Organization address address: HAARBERGSTR. 67 city: ERFURT postcode: 99097 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Germany [DE]
Project website	https://microprince.eu/
Total cost	10˙854˙745 €
EC max contribution	2˙614˙618 € (24%)
Programme	1. H2020-EU.2.1.1.7. (ECSEL)
Code Call	H2020-ECSEL-2016-2-IA-two-stage
Funding Scheme	ECSEL-IA
Starting year	2017
Duration (year-month-day)	from 2017-04-01 to 2020-09-30

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	X-FAB MEMS FOUNDRY GmbH X-FAB MEMS FOUNDRY GmbH Organization address address: HAARBERGSTR. 67 city: ERFURT postcode: 99097 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (ERFURT)	coordinator	419˙925.00
2	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	504˙867.00
3	MELEXIS GMBH MELEXIS GMBH Organization address address: KONRAD-ZUSE-STRASSE 15 city: ERFURT postcode: 99099 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (ERFURT)	participant	312˙375.00
4	TECHNISCHE UNIVERSITAET DRESDEN TECHNISCHE UNIVERSITAET DRESDEN Organization address address: HELMHOLTZSTRASSE 10 city: DRESDEN postcode: 1069 website: http://www.tu-dresden.de/ contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (DRESDEN)	participant	263˙946.00
5	FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. Organization address address: HANSASTRASSE 27C city: MUNCHEN postcode: 80686 website: www.fraunhofer.de contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (MUNCHEN)	participant	262˙407.00
6	X-FAB SEMICONDUCTOR FOUNDRIES GMBH X-FAB SEMICONDUCTOR FOUNDRIES GMBH Organization address address: HAARBERGSTRASSE 67 city: ERFURT postcode: 99097 website: www.xfab.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (ERFURT)	participant	211˙900.00
7	HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM Organization address address: TECHNOLOGIEPARK-ZWIJNAARDE 19 AA TOWER city: GENT postcode: 9052 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (GENT)	participant	176˙344.00
8	UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK Organization address address: WESTERN ROAD city: Cork postcode: T12 YN60 website: www.ucc.ie contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (Cork)	participant	173˙125.00
9	OPTICS BALZERS JENA GMBH OPTICS BALZERS JENA GMBH Organization address address: OTTO-EPPENSTEIN-STRASSE 2 city: JENA postcode: 7745 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (JENA)	participant	97˙599.00
10	MELEXIS TECHNOLOGIES MELEXIS TECHNOLOGIES Organization address address: TRANSPORTSTRAAT 1 city: TESSENDERLO postcode: 3980 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (TESSENDERLO)	participant	86˙162.00
11	X-CELEPRINT LIMITED X-CELEPRINT LIMITED Organization address address: 6th Floor, 2 Grand Canal Square city: DUBLIN postcode: 2 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (DUBLIN)	participant	67˙175.00
12	MELEXIS MELEXIS Organization address address: ROZENDAALSTRAAT 12 city: IEPER postcode: 8900 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (IEPER)	participant	38˙787.00
13	MELEXIS TECHNOLOGIES SA MELEXIS TECHNOLOGIES SA Organization address address: CHEMIN DE BUCHAUX 38 city: BEVAIX postcode: 2022 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	CH (BEVAIX)	participant	0.00

Map

Project objective

The “Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level” project (MICROPRINCE) is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (µTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transfer printed to demonstrate the capabilities of the technology and pilot line. Based on several EU and national research activities demonstrating successfully the feasibility of µTP technology in a scientific and laboratory environment, the MICROPRINCE consortium has the goal to setup the first worldwide open access foundry pilot line for heterogeneous integration by µTP and to demonstrate its capability on five defined target application scenarios. For this purpose, the consortium consisting of 13 partners from four different countries combine their expertise along the value chain from materials and equipment, technology and semiconductor processing, integrated circuit and system design, test and application. The partners are industrial companies incl. SME’s, accompanied by leading research institutes with a clear focus on production and application in Europe. The working principle of the micro-transfer-printing technology is to use a micro-structured elastomer stamp to transfer microscale functional components from their native substrates onto non-native substrates. The lateral dimensions of the functional components can range from a few microns to a few hundreds of microns with thicknesses of only a few microns. The native substrate contains the functional components to be printed and is flexible in size and material. The MICROPRINCE pilot line is acting as a regional and nationwide competence cluster for a novel technology with European dimensions for heterogeneous system integration and supports the ECS industry to reach leadership in key applications.

Deliverables

List of deliverables.
Internal and external IT communication infrastructure and project website	Websites, patent fillings, videos etc.	2020-03-12 17:32:40

Take a look to the deliverables list in detail: detailed list of MICROPRINCE deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2019	Gerbach, Ronny; Ghosal, Kanchan; Krieger, Uwe; Kittler, Gabriel; Bower, Christopher; Knechtel, Roy MICROPRINCEâ€”Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly published pages: , ISSN: , DOI: 10.5281/zenodo.2651911	2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Fairfax, Alaska, 29 November 2017 1	2020-03-12
2019	Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk Micro-Transfer-Printing and Potential Process Optimizations by FEA published pages: , ISSN: , DOI: 10.5281/zenodo.2677535	NTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (Eurosime 2019), Hannover, Germany, 24 - 27 March 2019 1	2020-03-12
2019	Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; GÃ¼nther, Daniela; Altmann, Frank Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing published pages: , ISSN: , DOI: 10.5281/zenodo.2702429	International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019), Halle, Germany, 10-11 April 2019 1	2020-03-12
2019	Fischbach, Robert; Horst, Tilman; Lienig, Jens Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing published pages: , ISSN: , DOI: 10.5281/zenodo.3234391	2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017) 1	2020-03-12
2019	Gomez, David; Moore, Tanya; Meitl, Matthew A.; Bonafede, Salvatore; Pearson, Andrew; Ghosal, Kanchan; Raymond, Brook; Radauscher, Erich; Kneeburg, David; Roe, Julia; Fecioru, Alin; Kelleher, Steven; Trindade, Antonio Jose; Bower, Christopher A. Manufacturing Capability of Micro-Transfer Printing published pages: , ISSN: , DOI: 10.5281/zenodo.2654512	Smart Systems Integration (SSI), Barcelona, 10-11 April 2019 1	2020-03-12
2017	Fischbach, Robert; Heinig, Andy; Lienig, Jens Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT published pages: , ISSN: , DOI: 10.5281/zenodo.1043277	Fraunhofer EAS 1	2020-03-12
2017	Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors published pages: , ISSN: , DOI: 10.5281/zenodo.1043259	Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors 1	2020-03-12
2019	Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA published pages: , ISSN: , DOI: 10.5281/zenodo.2677551	1	2020-03-12
2019	Roelkens, Gunther; Zhang, Jing; Kumari, Sulakshna; Juvert, Joan; Liles, Alexandros; Muliuk, Grigorij; Goyvaerts, Jeroen; Hag, Bahawal; Mahmoud, Nayyera; Van Thourhout, Dries Transfer printing for heterogeneous silicon PICs published pages: , ISSN: , DOI: 10.5281/zenodo.2678181	Presentation at smart Systems Integration 1	2020-03-12
2019	Wicht, Sebastian; Krieger, Uwe; Guenther, Daniela; Heise, Niclas; Krojer, Matthias; Kittler, Gabriel; Naumann, Falk; Altmann, Frank; Gomez, David; Fecioru, Alin MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level published pages: , ISSN: , DOI: 10.5281/zenodo.2654502	1	2020-03-12

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