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GRACE SIGNED

GaN mm-wave Radar Components Embedded

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Project "GRACE" data sheet

The following table provides information about the project.

Coordinator
CHALMERS TEKNISKA HOEGSKOLA AB 

Organization address
address: -
city: GOETEBORG
postcode: 41296
website: www.chalmers.se

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Sweden [SE]
 Project website http://www.chalmers.se/en/departments/mc2/research/grace/Pages/News.aspx
 Total cost 1˙742˙815 €
 EC max contribution 1˙742˙815 € (100%)
 Programme 1. H2020-EU.3.4.5.6. (ITD Systems)
 Code Call H2020-CS2-CFP07-2017-02
 Funding Scheme CS2-RIA
 Starting year 2018
 Duration (year-month-day) from 2018-11-01   to  2020-10-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    CHALMERS TEKNISKA HOEGSKOLA AB SE (GOETEBORG) coordinator 614˙577.00
2    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 621˙125.00
3    OMMIC SAS FR (LIMEIL BREVANNES) participant 507˙112.00

Map

 Project objective

The GRACE project aims at development of surface mount technology (SMT) components for mm-wave (mmW) frequencies, with particular focus on radar systems in the W-band.

Low-cost high-performance radars are critical for future Enhanced Flight Vison System (EFVS) combining IR sensors and a mmW radar.

Key radar components are Power Amplifier (PAs) and Signal Sources (SSs), two functionalities that require high power. The most promising technology to deliver the required power levels in an area-effective package with potential to be cost-effective in volume production is a short-gate length GaN HEMT monolithic microwave integrated circuit (MMIC) technology. The GRACE project aims at utilizing the D01GH and the D006GHG processes from OMMIC, which are two only commercially open European MMIC processes with capability of delivering sufficient gain in the W frequency band.

The GRACE project also aims at packaging the designed MMICs using a fan-out wafer level (FOWL) packaging approach offered by Fraunhofer IZM. FOWL packaging (FOWLP) is one of the latest packaging trends in microelectronics with advantages such as significant package miniaturization, substrate-less package, lower thermal resistance, and higher performance with lower loss and low parasitic coupling

The specific objectives of the GRACE project are:

*Design of a 93-100 GHz Power Amplifier (PA) MMIC with an output power in the range of 500mW to 1W *Design of a signal-source MMIC covering 93-100 GHz with state-of-the art far-carrier phase noise performance *Development of a FOWL packaging flow for the PA MMIC *Development of a FOWL packaging flow for the signal source MMIC

 Deliverables

List of deliverables.
Delivery of wafers carrying SS and PA MMICs Other 2020-02-12 12:29:43
CDR Run 1 Report Documents, reports 2020-01-14 16:56:38
Kick-off meeting Documents, reports 2020-01-14 16:40:47
Plan for Communication, Dissemination and Exploitation of project results Documents, reports 2020-01-14 14:59:06
Data Management Plan Open Research Data Pilot 2020-01-14 14:59:05

Take a look to the deliverables list in detail:  detailed list of GRACE deliverables.

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The information about "GRACE" are provided by the European Opendata Portal: CORDIS opendata.

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