3D-HIPMAS
Pilot Factory for 3D High Precision MID Assemblies
| Coordinatore | HAHN-SCHICKARD-GESELLSCHAFT FUER ANGEWANDTE FORSCHUNG E.v.
Organization address
address: WILHELM-SCHICKARD-STRASSE 10 contact info |
| Nazionalità Coordinatore | Germany [DE] |
| Sito del progetto | http://www.3d-hipmas.eu/ |
| Totale costo | 5˙350˙276 € |
| EC contributo | 3˙499˙600 € |
| Programma | FP7-NMP
Specific Programme "Cooperation": Nanosciences, Nanotechnologies, Materials and new Production Technologies |
| Code Call | FP7-2012-NMP-ICT-FoF |
| Funding Scheme | CP-FP |
| Anno di inizio | 2012 |
| Periodo (anno-mese-giorno) | 2012-10-01 - 2015-09-30 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
HAHN-SCHICKARD-GESELLSCHAFT FUER ANGEWANDTE FORSCHUNG E.v.
Organization address
address: WILHELM-SCHICKARD-STRASSE 10 contact info |
DE (Villingen) | coordinator | 721˙750.00 |
| 2 |
ASSOCIATION POLE EUROPEEN DE PLASTURGIE
Organization address
address: RUE PIERRE ET MARIE CURIE 2 contact info |
FR (BELLIGNAT) | participant | 485˙100.00 |
| 3 |
PHOTONIC SCIENCE LIMITED
Organization address
address: MILLHAM MOUNTFIELD contact info |
UK (ROBERTSBRIDGE) | participant | 411˙441.00 |
| 4 |
HAECKER AUTOMATION GMBH
Organization address
address: INSELSBERGSTRASSE 17 contact info |
DE (SCHWARZHAUSEN) | participant | 349˙495.00 |
| 5 |
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: RUE LEBLANC 25 contact info |
FR (PARIS 15) | participant | 325˙066.00 |
| 6 |
LPKF LASER & ELECTRONICS AG
Organization address
address: OSTERIEDE 7 contact info |
DE (GARBSEN) | participant | 300˙108.00 |
| 7 |
RADIALL
Organization address
address: Rue Philibert Hoffmann 101 contact info |
FR (Rosny Sous Bois) | participant | 228˙903.00 |
| 8 |
RAYCE SARL
Organization address
address: RUE ALEXANDRE FREUND 3 contact info |
FR (SAINT-LOUIS) | participant | 181˙357.00 |
| 9 |
Phonak AG
Organization address
address: Laubisruetistrasse 28 contact info |
CH (Staefa) | participant | 163˙633.00 |
| 10 |
PLASTIPOLIS
Organization address
address: Rue Pierre et Marie Curie 180 contact info |
FR (OYONNAX) | participant | 113˙076.00 |
| 11 |
ENSINGER GMBH
Organization address
address: RUDOLF DIESEL STRASSE 8 contact info |
DE (NUFRINGEN) | participant | 110˙200.00 |
| 12 |
PRAGMA INDUSTRIES SAS
Organization address
address: RUE DE BASSILOUR DEPOT ANNE 665 contact info |
FR (BIDART) | participant | 109˙471.00 |
Mappa
Word cloud
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Obiettivo del progetto (Objective)
'Due to the high potential of miniaturization and integration, with regard to the innovation degree, quality and sustainability requirements, the 21st century looks forward to the integration of new functions on plastic parts to produce smart plastic products, as markets are requiring traceability, security, communication as well as ergonomics. So called “Molded Interconnected Devices” (MID) basically combine all the features of molded plastic parts with electrical conductive circuitry and electronics components assembly directly on the plastic packaging. MID lead finally to highly integrated multimaterial and multifunctional 3D compact systems. With a 20% of growth per year since 2008, MID is the tomorrow’s converging technology for electronics and plastics. To achieve advanced high precision and high quality 3D micro systems, the EU industry is facing the following MIDs bottlenecks: - to be able to manufacture high precision 3D micro-parts integration plastics and electronics, including 3D plastic system carrier, 3D-conductive tracks and 3D electronics component assembly - to be able to reduce the manufacturing cost by 50% in order for EU industry to be competitive with low-wage countries, - to provide the industry with reliable, robust and in-line controlled manufacturing processes for plastics and electronics converging technologies. 3D-HiPMAS will overcome these challenges by providing the EU industry with a pilot factory based on 4 key technological building blocks enabling the manufacturing of low costs and high precision 3D multi-materials parts: A. 3D high precision plastics micro-parts B. 3D high definition conductive tracks C. 3D precision electronics components assembly D. 3D reliable and robust online monitoring and quality inspection system E. These 4 technologies will be integrated in order to launch the future EU pilot factory The consortium is composed of all key actors from the value chain, from the material manufacturer to the end-user'
Introduzione (Teaser)
Moulded Interconnect Devices (MIDs) combine all the features of moulded plastic parts with electrical circuitry and electronic components assembled directly on the plastic package.