HYPOTHESIS

Feasibility study of intelligent High Integrated Power Electronic Module (HIPEM) for Aeronautic Application

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 Obiettivo del progetto (Objective)

'HYPOTHESIS is a focused RTD project that will investigate the feasibility of a High Temperature Intelligent High Integrated Power Electronics Module for aeronautic applications based on fast switching semiconductors, most probably using Silicon Carbide technology for the first generation power modules. The recent release of 1200V SiC power transistors (MOSFET’s, JFET’s…) with strongly improved switching behavior provides for an interesting opportunity for the development of Power Electronic Modules that are dissipating much less, can operate at higher frequencies and at temperatures up to 250ºC, do not require forced cooling and therefore reduce weight and volume. In order to take full advantage of the high switching speed of SiC transistors, the gate driver has to be placed as close as possible and ultimately integrated in the same power package. The challenge is to combine the materials and the technologies for die attach, power substrates, interconnect, wire bonding and final assembly into one module that can operate at high power levels and high temperatures at the reliability levels required for aeronautics. The HYPOTHESIS project will take up this challenge based upon the experiences in integrated circuits for high temperature operation and on the results of recent state-of-the-art investigations. It will investigate the feasibility of the technology for intelligent High Integrated Power Electric Modules that fulfill the requirements set forward in the call topic JTI-CS-2011-3-SGO-02-037 and that is based on the requirements for the More and All Electric Aircraft. After a thorough analysis of the requirements and of the available and affordable technologies, an experimental module will be designed, manufactured and validated for performance and reliability. The design and technology recommendations that result from this investigation will contribute to the next generation of intelligent HIPEMs suited for the next generation of All Electric Aircrafts.'

Introduzione (Teaser)

Existent power modules relying on silicon electronics do not allow for drastic weight and volume reductions as more-electric aircraft call for. EU-funded scientists seek to gain a better view of the design criteria of next-generation power converters through a technical feasibility study.

Descrizione progetto (Article)

Silicon carbide (SiC) is a next-generation material expected to significantly reduce power loss in power semiconductor devices such as junction-gate and metal-oxide semiconductor field-effect transistors. Power modules that use SiC power semiconductors enable achieving higher power densities, voltages, temperatures and frequencies, while reducing heat dissipation. Eliminating the need for cooling equipment, SiC shows great promise for lighter electronic components compared to conventional silicon semiconductor technology.

The EU-funded project HYPOTHESIS (Feasibility study of intelligent high integrated power electronic module (HIPEM) for aeronautic application) is performing a feasibility study of intelligent integrated electric modules that have high power, ensuring they meet the requirements of the more-electric aircraft. These modules are a core block on which the design of next-generation electronic converter components will be built.

After thoroughly analysing the requirements and the available and affordable technologies, an experimental module will be designed, manufactured, and validated for performance and reliability.

To fully exploit the high switching speed of SiC transistors, the gate driver should be placed close enough and ultimately integrated into the same power package.

Initial project work was dedicated to specifications drafting and the concept design of the power module. The last work package included the preparation of deliverables such as the technology selection table, the system partitioning and design specifications, and the test plan. Module design activities have also commenced.

The advent of more-electric and ultimately all-electric aircraft places high demands in terms of weight and volume reductions. Intelligent power electronic modules have great potential to reduce the aviation industry's carbon footprint.