HYPERSOL

Environmentally Sustainable Manufacturing of Ultra-Functional Miniaturised Consumer Electronics Using Hyper-Fine Solder Powders

Coordinatore	ATOMISING SYSTEMS LIMITED    more  Organization address address: 371 COLEFORD ROAD city: SHEFFIELD postcode: S95NF contact info Titolo: Dr. Nome: Paul Cognome: Rose Email: send email Telefono: 441143000000 Fax: 441143000000
Nazionalità Coordinatore	United Kingdom [UK]
Totale costo	1˙851˙225 €
EC contributo	1˙374˙975 €
Programma	FP7-SME Specific Programme "Capacities": Research for the benefit of SMEs
Code Call	FP7-SME-2010-1
Funding Scheme	BSG-SME
Anno di inizio	2010
Periodo (anno-mese-giorno)	2010-12-01   -   2013-07-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	ATOMISING SYSTEMS LIMITED  Organization address address: 371 COLEFORD ROAD city: SHEFFIELD postcode: S95NF contact info Titolo: Dr. Nome: Paul Cognome: Rose Email: send email Telefono: 441143000000 Fax: 441143000000	UK (SHEFFIELD)	coordinator	78˙900.01
2	MILTECH HELLAS AE  Organization address address: METAXA STREET 90 city: PEANIA postcode: 19002 contact info Titolo: Mr. Nome: John Cognome: Spanoudakis Email: send email Telefono: 302107000000 Fax: 302107000000	EL (PEANIA)	participant	342˙925.00
3	Prisma Electronics ABEE  Organization address address: Dimokratias Avenue 87 city: ALEXANDROUPOLIS postcode: 68100 contact info Titolo: Mr. Nome: Serafim Cognome: Katsikas Email: send email Telefono: 302109000000 Fax: 302109000000	EL (ALEXANDROUPOLIS)	participant	342˙925.00
4	ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK  Organization address address: UL. KAMIENNA 17 city: RZASKA postcode: 30 199 contact info Titolo: Mr. Nome: Piotr Cognome: Bistro? Email: send email Telefono: 48124295508 Fax: 48124295508	PL (RZASKA)	participant	232˙325.00
5	BOLUDA DIVISION INDUSTRIAL SL  Organization address address: "CALLE JOIERS, VIAL A, NAVE 9 17-19" city: PALAU SOLITA I PLEGAMANS postcode: 8184 contact info Titolo: Mr. Nome: Fransesc Cognome: Martinez Email: send email Telefono: 34938644942 Fax: 34608105046	ES (PALAU SOLITA I PLEGAMANS)	participant	181˙044.24
6	BIZESP LTD  Organization address address: OXFORD CENTRE FOR INNOVATION - MILL STREET city: OXFORD postcode: OX2 OJX contact info Titolo: Mr. Nome: David Cognome: Bridgland Email: send email Telefono: +44 1865 811142 Fax: +44 1865 793165	UK (OXFORD)	participant	158˙855.75
7	POLMECANIC Sp. z o.o.  Organization address address: ul. 18 Stycznia 16 city: WIELUN postcode: 98-300 contact info Titolo: Mr. Nome: Adam Cognome: Bokwa Email: send email Telefono: 48605065665 Fax: 48605065665	PL (WIELUN)	participant	26˙000.00
8	Surface Technology International Limited  Organization address address: Osborn Way city: Hook postcode: RG27 9HX contact info Titolo: Mrs. Nome: Sue Cognome: Knight Email: send email Telefono: 441257000000 Fax: 441257000000	UK (Hook)	participant	12˙000.00
9	BRUNEL UNIVERSITY  Organization address address: Kingston Lane city: UXBRIDGE postcode: UB83PH contact info Titolo: Ms. Nome: Teresa Cognome: Waller Email: send email Telefono: 441895000000 Fax: 441895000000	UK (UXBRIDGE)	participant	0.00
10	ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS  Organization address address: CHARILAOU THERMI ROAD 6 KM city: THERMI THESSALONIKI postcode: 57001 contact info Titolo: Prof. Nome: Elias Cognome: Houstis Email: send email Telefono: 302421000000 Fax: 302421000000	EL (THERMI THESSALONIKI)	participant	0.00
11	KENTRO EREVNAS TECHNOLOGIAS KAI ANAPTYXIS THESSALIAS  Organization address address: TECHNOLOGIKO PARKO A VIPE city: VOLOS postcode: 38500 contact info Titolo: Prof. Nome: Elias Cognome: Houstis Email: send email Telefono: 302421000000 Fax: 302421000000	EL (VOLOS)	participant	0.00

Mappa

 Word cloud

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 Obiettivo del progetto (Objective)

'The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fuelled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. Achievement of these twin drivers can reduce raw material requirements, reduce WEEE and deliver a competitive edge to the European industry, moving it up the value chain to high value added and high margin products. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. Hypersol aims to deliver solder pastes with solder spheres <10μ to enable PCB manufacturers to more than double the component density on the PCB. In layman’s terms, this would effectively enable more than a doubling of the functions available on your cell phone, satellite navigation system, MP3 player and of course the ubiquitous lap top computer which could soon become a palm top computer. The successful completion of the HYPERSOL project would lift the ultra-miniaturisation/functionality road block and in the process also enable reduction in raw material usage, reduction in WEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.'