TIPS
Technology development and fabrication of Integrated solid-state Power Switches
| Coordinatore | PRIMES
Organization address
address: 67 BOULEVARD PIERRE RENAUDET contact info |
| Nazionalità Coordinatore | France [FR] |
| Totale costo | 534˙840 € |
| EC contributo | 401˙130 € |
| Programma | FP7-JTI
Specific Programme "Cooperation": Joint Technology Initiatives |
| Code Call | SP1-JTI-CS-2013-02 |
| Funding Scheme | JTI-CS |
| Anno di inizio | 2015 |
| Periodo (anno-mese-giorno) | 2015-02-01 - 2016-05-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
PRIMES
Organization address
address: 67 BOULEVARD PIERRE RENAUDET contact info |
FR (TARBES) | coordinator | 401˙130.00 |
Mappa
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Obiettivo del progetto (Objective)
'PRIMES has been created as a legal and independant entity, inheriting the successful experience of PEARL Laboratory. This has allowed to give to the structure a wide and strong international visibility as one of the best European technological platform specialized in power integration. PRIMES puts a huge effort in developing virtual model solutions for power electronics components and systems, combined to a prototyping and characterization platform to be able to design, simulate, manufacture and characterize new power module technological demonstrators at the same place. PRIMES bondwire-less technology with double-sided semiconductor cooling has been demonstrated for high power devices. Such technology is centered on the use of bumps for connecting the surface side of vertical power components and enables a significant improvement in power density as compared with standard IGBT modules. Chips interconnection is ensured by flat substrates both on the bottom and on the top side; additional bumps are inserted on the sides of the structure to enhance mechanical stiffness and reduce stress at device level; after proper insulation, the structure is apt for double-sided cooling, with improved performance of the semiconductor devices. The results of the project will be produced under license by the aPSI3D start-up, created in order to have a European manufacturer abble to produce specific integrated power modules. The results will be protected by patents or spreadly disseminated through international conferencies and publications.'