ELITE

Extended Large (3D) Integration TEchnology

Coordinatore	COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES    more  Organization address address: Rue des Martyrs 17 city: Grenoble postcode: 38054 contact info Titolo: Ms. Nome: Marie-Laure Cognome: Page Email: send email Telefono: 33438782796 Fax: 33438785183
Nazionalità Coordinatore	France [FR]
Totale costo	5˙628˙834 €
EC contributo	3˙600˙000 €
Programma	FP7-ICT Specific Programme "Cooperation": Information and communication technologies
Code Call	FP7-ICT-2007-1
Funding Scheme	CP
Anno di inizio	2007
Periodo (anno-mese-giorno)	2007-11-01   -   2011-08-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES  Organization address address: Rue des Martyrs 17 city: Grenoble postcode: 38054 contact info Titolo: Ms. Nome: Marie-Laure Cognome: Page Email: send email Telefono: 33438782796 Fax: 33438785183	FR (Grenoble)	coordinator	0.00
2	HYPERSTONE GMBH  Organization address address: LINE-EID-STRASSE 3 city: KONSTANZ postcode: 78467 contact info Titolo: Dr. Nome: Harald Cognome: Westerholt Email: send email Telefono: +49 7 53198030 Fax: +49 7 53151725	DE (KONSTANZ)	participant	0.00
3	KUNGLIGA TEKNISKA HOEGSKOLAN  Organization address address: Valhallavaegen city: STOCKHOLM postcode: 10044 contact info Titolo: - Nome: Thomas Cognome: Sjöland Email: send email Telefono: +46 8 790 4113 Fax: +46 8 7511793	SE (STOCKHOLM)	participant	0.00
4	LANCASTER UNIVERSITY  Organization address address: BAILRIGG city: LANCASTER postcode: LA1 4YW contact info Titolo: Dr Nome: Sarah Cognome: Taylor Email: send email Telefono: +44 1524 59273 Fax: +44 1524 843087	UK (LANCASTER)	participant	0.00
5	MICRON SEMICONDUCTOR ITALIA SRL  Organization address address: VIA CAMILLO OLIVETTI city: AGRATE BRIANZA postcode: 20041 contact info Titolo: Mr. Nome: Francesco Cognome: Reina Email: send email Telefono: +39 9 56364804 Fax: +39 9 5636 4033	IT (AGRATE BRIANZA)	participant	0.00

Mappa

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 Obiettivo del progetto (Objective)

For developing complex next-generation chips which include a combination of disparate technologies, the circuit integration exclusively in two dimensions has proved to be a seriously limiting factor. Utilising the third dimension for integration of complex chips is a promising technique for removing the bottlenecks in two-dimensional (2-D) integration. Advantages of third-dimension (3-D) integration are in first order form factor and power dissipation.The proposed project ELITE aims at miniaturization and density increase beyond Moore by means of exhaustive die stacking. It takes as development vehicle an advanced solid state drive which will widely substitute traditional hard disk drives for purpose of mobile and hand-held applications and which is considered as the enabler of the up-coming era of mobile data. The system architecture will include a large amount of non-volatile flash memory, one or more microcontrollers and external analog high-speed interface.One of the main topics of ELITE will be the development of a technology for vertical die stacking and for vertical interconnect. Starting from the expertise and experience of the consortium new technology modifications or alternative technologies will be investigated. Also assembly technology will be investigated considering possible later usage in mass-production with its specific requirements on manufacturability and cost.Conceptual and physical simulations will be deployed for planning and ensuring the system architecture and specifying a demonstrator which will prove the feasibility of the concept. Firmware inside the chip will be used to optimize performance by means of parallel tasks, guaranty highly reliable data access as well as controlling power dissipation.As a final step, generalization of the results which are reached with the solid-state drive vehicle will be generalized in order to be re-used for applications from different technical domains and markets.