ATHENIS
Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC
| Coordinatore | AUSTRIAMICROSYSTEMS AG
Organization address
address: Schloss Premstaetten contact info |
| Nazionalità Coordinatore | Austria [AT] |
| Totale costo | 8˙084˙966 € |
| EC contributo | 5˙150˙000 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2007-1 |
| Funding Scheme | CP |
| Anno di inizio | 2008 |
| Periodo (anno-mese-giorno) | 2008-01-01 - 2010-12-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
AUSTRIAMICROSYSTEMS AG
Organization address
address: Schloss Premstaetten contact info |
AT (Unterpremstaetten) | coordinator | 0.00 |
| 2 |
CAVENDISH KINETICS B.V.
Organization address
address: HUGO DE GROOTLAAN 35 contact info |
NL ('S-HERTOGENBOSCH) | participant | 0.00 |
| 3 |
FONDAZIONE BRUNO KESSLER
Organization address
address: VIA SANTA CROCE 77 contact info |
IT (TRENTO) | participant | 0.00 |
| 4 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: HANSASTRASSE 27C contact info |
DE (MUENCHEN) | participant | 0.00 |
| 5 |
MASER ENGINEERING B.V.
Organization address
address: CAPITOOL 56 contact info |
NL (ENSCHEDE) | participant | 0.00 |
| 6 |
TECHNISCHE UNIVERSITAET WIEN
Organization address
address: KARLSPLATZ 13 contact info |
AT (WIEN) | participant | 0.00 |
| 7 |
UNIVERSITA DEGLI STUDI DI FERRARA
Organization address
address: SAVONAROLA 9 contact info |
IT (FERRARA) | participant | 0.00 |
| 8 |
VALEO EQUIPEMENTS ELECTRIQUES MOTEUR SAS
Organization address
address: 2 RUE ANDRE BOULLE contact info |
FR (CRETEIL) | participant | 0.00 |
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Obiettivo del progetto (Objective)
More than 20% of the value of each car already comes from embedded electronics. Keeping costs and space for additional functionality low requires further integration of electronic components such as low and high voltage devices and memory on a single System-on-Chip (SoC). SoC technologies for segments with lower reliability requirements are already available. However, there are no cost-effective technologies yet combining all of the harshest automotive reliability requirements for full SoC integration of powertrain ICs for engines, starters, alternators, etc. This barrier to powertrain IC SoC integration inhibits cost reduction and introduction of more fuel efficient cars. nThe purpose of ATHENIS is to provide proof of concept for the industry's first SoC technology platform that can surmount these integration barriers. The ATHENIS SoC technology platform is intended to be the first in meeting the combination of all of the harshest requirements including full reverse polarity capability at the low cost of CMOS, application voltages up to 120V, currents up to 10A, temperatures up to 200°C, embedded non-volatile memory, chip-level ESD up to =8kV HBM, and high logic gate densities. nThis will be achieved by combining HVCMOS technology from austriamicrosystems AG with MEMS-based 'Nanomech' embedded Non-Volatile Memory (eNVM) technology from Cavendish Kinetics. Innovative (patent pending) add-on technology modules such as reverse polarity HVCMOS and =8kV ESD structures for HVCMOS as well as automotive extensions for Nanomech will be developed. An alternator-like demonstrator with and without eNVM is selected for a worst case proof of concept. eNVM will enable 'flexibility' to software-configure alternator systems for multiple car platforms. Valeo Electrical Systems will provide system specifications, system development and system evaluation. The other research partners contribute the required novel characterization, reliability, test, and simulation methodology.