3PLAST
Pyroelectrical and piezoelectrical printable large area sensor technology
| Coordinatore | FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
| Nazionalità Coordinatore | Germany [DE] |
| Totale costo | 3˙191˙373 € |
| EC contributo | 2˙199˙796 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2007-1 |
| Funding Scheme | CP |
| Anno di inizio | 2008 |
| Periodo (anno-mese-giorno) | 2008-02-01 - 2011-05-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
DE (MUENCHEN) | coordinator | 0.00 |
| 2 |
ACREO AB.
Organization address
address: ELECTRUM 236 contact info |
SE (KISTA) | participant | 0.00 |
| 3 |
ASEM PRAEZISIONS-AUTOMATEN GMBH
Organization address
address: MANFRED-VON-ARDENNE-RING 13 contact info |
DE (DRESDEN) | participant | 0.00 |
| 4 |
CELERAS INNOVATION GMBH
Organization address
address: ROTRAINSTRASSE contact info |
CH (EGGENWIL) | participant | 0.00 |
| 5 |
EMFIT OY
Organization address
address: KONTTISENTIE 8 contact info |
FI (VAAJAKOSKI) | participant | 0.00 |
| 6 |
FESTO AG & CO KG
Organization address
address: RUITER STRASSE 82 contact info |
DE (ESSLINGEN) | participant | 0.00 |
| 7 |
IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.
Organization address
address: ZONE INDUSTRIELLE contact info |
LU (ECHTERNACH) | participant | 0.00 |
| 8 |
JOANNEUM RESEARCH FORSCHUNGSGESELLSCHAFT MBH
Organization address
address: Steyrergasse contact info |
AT (GRAZ) | participant | 0.00 |
| 9 |
UNIVERSITAET LINZ
Organization address
address: ALTENBERGERSTRASSE 69 contact info |
AT (LINZ) | participant | 0.00 |
Mappa
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Obiettivo del progetto (Objective)
In order to establish cost-efficient innovative solutions for safety and security systems , self-controlled machine monitoring and user-friendly human-machine interfaces, it is necessary that items are able to communicate bidirectional which is realized by advanced sensor functions. Therefore, devices using novel sensor concepts manufactured via high-throughput processes on cost-efficient, flexible substrates are essential in order to be applied in high-volume markets.nWithin 3PLAST, a novel concept combining physical polymer sensors with organic electronics all printed on large-area flexible substrates is developed. The macroelectronic 3PLAST sensors provide accurate information on changes in temperature and pressure and are unbeatably flexible in design. Integration of 3PLAST sensors on everyday objects adds temperature and pressure sensitivity to them. The basic sensor device is comprised of a piezo- and/or pyroelectric polymer thin-film capacitor, integrated with high-performance organic thin-film transistors operating at low voltages, and acting as signal amplifiers and conditioners. Application of low-cost manufacturing technologies such as screen printing and hot embossing, which can be applied in high-throughput processes, ensures that the developed components can be manufactured with a high-competitive cost structure in the future.nCovering the entire value chain, The 3PLAST consortium consists of highly experienced research institutes such as Fraunhofer, Joanneum and Acreo and the University of Linz. Application scenarios are determined by the driving industrial partners such as, IEE, Festo, or Motorola. ASEM and Emfit – as an SME – are enriching the consortium as material supplier, manufacturer of process tools and end user.n3PLAST consortium provides completely new solutions in the context of integrated macroelectronic sensor technology enabling versatile applications in consumer electronics, automotive and process automation industry.