3PLAST

Pyroelectrical and piezoelectrical printable large area sensor technology

Coordinatore	FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V    more  Organization address address: Hansastrasse 27C city: MUENCHEN postcode: 80686 contact info Titolo: Mr. Nome: Walter Cognome: Krause Email: send email Telefono: +49 89 12052713 Fax: +49 89 12057534
Nazionalità Coordinatore	Germany [DE]
Totale costo	3˙191˙373 €
EC contributo	2˙199˙796 €
Programma	FP7-ICT Specific Programme "Cooperation": Information and communication technologies
Code Call	FP7-ICT-2007-1
Funding Scheme	CP
Anno di inizio	2008
Periodo (anno-mese-giorno)	2008-02-01   -   2011-05-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V  Organization address address: Hansastrasse 27C city: MUENCHEN postcode: 80686 contact info Titolo: Mr. Nome: Walter Cognome: Krause Email: send email Telefono: +49 89 12052713 Fax: +49 89 12057534	DE (MUENCHEN)	coordinator	0.00
2	ACREO AB.  Organization address address: ELECTRUM 236 city: KISTA postcode: 16440 contact info Titolo: Dr. Nome: Mårten Cognome: Armgarth Email: send email Telefono: +46 11 363639 Fax: +46 11 363601	SE (KISTA)	participant	0.00
3	ASEM PRAEZISIONS-AUTOMATEN GMBH  Organization address address: MANFRED-VON-ARDENNE-RING 13 city: DRESDEN postcode: 1099 contact info Titolo: Mr. Nome: Rüdiger Cognome: Kurz Email: send email Telefono: +49 94619521668 Fax: +49 94619521101	DE (DRESDEN)	participant	0.00
4	CELERAS INNOVATION GMBH  Organization address address: ROTRAINSTRASSE city: EGGENWIL postcode: 5445 contact info Titolo: Dr. Nome: Markus Cognome: Riester Email: send email Telefono: +43 676 424 3622	CH (EGGENWIL)	participant	0.00
5	EMFIT OY  Organization address address: KONTTISENTIE 8 city: VAAJAKOSKI postcode: 40800 contact info Titolo: Mr Nome: Heikki Cognome: Raisanen Email: send email Telefono: +358 14 3329000 Fax: +358 14 3329001	FI (VAAJAKOSKI)	participant	0.00
6	FESTO AG & CO KG  Organization address address: RUITER STRASSE 82 city: ESSLINGEN postcode: 73734 contact info Titolo: - Nome: Andreas Cognome: Münzenmaier Email: send email Telefono: 497113000000 Fax: 49711300000000	DE (ESSLINGEN)	participant	0.00
7	IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.  Organization address address: ZONE INDUSTRIELLE city: ECHTERNACH postcode: 6468 contact info Titolo: Dr. Nome: Thomas Cognome: Wittkowski Email: send email Telefono: +352 24542362 Fax: +352 24543362	LU (ECHTERNACH)	participant	0.00
8	JOANNEUM RESEARCH FORSCHUNGSGESELLSCHAFT MBH  Organization address address: Steyrergasse city: GRAZ postcode: 8010 contact info Titolo: Dr Nome: Barbara Cognome: Stadlober Email: send email Telefono: +43 316 8762721 Fax: +43 316 8762710	AT (GRAZ)	participant	0.00
9	UNIVERSITAET LINZ  Organization address address: ALTENBERGERSTRASSE 69 city: LINZ postcode: 4040 contact info Titolo: Prof. Nome: Siegfried Cognome: Bauer Email: send email Telefono: 4373220000000 Fax: 4373220000000	AT (LINZ)	participant	0.00

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 Obiettivo del progetto (Objective)

In order to establish cost-efficient innovative solutions for safety and security systems , self-controlled machine monitoring and user-friendly human-machine interfaces, it is necessary that items are able to communicate bidirectional which is realized by advanced sensor functions. Therefore, devices using novel sensor concepts manufactured via high-throughput processes on cost-efficient, flexible substrates are essential in order to be applied in high-volume markets.nWithin 3PLAST, a novel concept combining physical polymer sensors with organic electronics all printed on large-area flexible substrates is developed. The macroelectronic 3PLAST sensors provide accurate information on changes in temperature and pressure and are unbeatably flexible in design. Integration of 3PLAST sensors on everyday objects adds temperature and pressure sensitivity to them. The basic sensor device is comprised of a piezo- and/or pyroelectric polymer thin-film capacitor, integrated with high-performance organic thin-film transistors operating at low voltages, and acting as signal amplifiers and conditioners. Application of low-cost manufacturing technologies such as screen printing and hot embossing, which can be applied in high-throughput processes, ensures that the developed components can be manufactured with a high-competitive cost structure in the future.nCovering the entire value chain, The 3PLAST consortium consists of highly experienced research institutes such as Fraunhofer, Joanneum and Acreo and the University of Linz. Application scenarios are determined by the driving industrial partners such as, IEE, Festo, or Motorola. ASEM and Emfit – as an SME – are enriching the consortium as material supplier, manufacturer of process tools and end user.n3PLAST consortium provides completely new solutions in the context of integrated macroelectronic sensor technology enabling versatile applications in consumer electronics, automotive and process automation industry.