NANOINTERFACE
Knowledge-based multi-scale modelling of metal-oxide-polymer interface behaviour for micro- and nanoelectronics
| Coordinatore | PHILIPS ELECTRONICS NEDERLAND B.V.
Organization address
address: Boschdijk 525 contact info |
| Nazionalità Coordinatore | Netherlands [NL] |
| Sito del progetto | http://www.nanointerface.eu |
| Totale costo | 5˙222˙544 € |
| EC contributo | 3˙300˙000 € |
| Programma | FP7-NMP
Specific Programme "Cooperation": Nanosciences, Nanotechnologies, Materials and new Production Technologies |
| Code Call | FP7-NMP-2007-SMALL-1 |
| Funding Scheme | CP-FP |
| Anno di inizio | 2008 |
| Periodo (anno-mese-giorno) | 2008-09-01 - 2011-08-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
PHILIPS ELECTRONICS NEDERLAND B.V.
Organization address
address: Boschdijk 525 contact info |
NL (EINDHOVEN) | coordinator | 0.00 |
| 2 |
ACCELRYS LIMITED
Organization address
address: Unit 334 Cambridge Science Park contact info |
UK (CAMBRIDGE) | participant | 0.00 |
| 3 |
AMIC Angewandte Micro-Messtechnik GmbH
Organization address
address: VOLMERSTRASSE 9B contact info |
DE (BERLIN) | participant | 0.00 |
| 4 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Organization address
address: Rue Michel -Ange 3 contact info |
FR (PARIS) | participant | 0.00 |
| 5 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse 27C contact info |
DE (MUENCHEN) | participant | 0.00 |
| 6 |
GEORGIA TECH LORRAINE ASSOCIATION
Organization address
address: RUE MARCONI 2 contact info |
FR (METZ) | participant | 0.00 |
| 7 |
HONEYWELL INTERNATIONAL INC
Organization address
address: CENTERVILLE 2711 contact info |
US (Wilmington) | participant | 0.00 |
| 8 |
INFINEON TECHNOLOGIES AG
Organization address
address: Am Campeon 1-12 contact info |
DE (Neubiberg) | participant | 0.00 |
| 9 |
NXP SEMICONDUCTORS NETHERLANDS BV
Organization address
address: High Tech Campus 60 contact info |
NL (EINDHOVEN) | participant | 0.00 |
| 10 |
SAINT PETERSBURG ELECTROTECHNICAL UNIVERSITY LETI
Organization address
address: PROF POPOV 5 contact info |
RU (SAINT PETERSBURG) | participant | 0.00 |
| 11 |
TECHNISCHE UNIVERSITEIT DELFT
Organization address
address: Stevinweg 1 contact info |
NL (DELFT) | participant | 0.00 |
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Obiettivo del progetto (Objective)
'Micro- and nano-electronic components are multi-scale in nature, caused by the huge scale differences of the individual materials and components in these products. Consequently, product behaviour is becoming strongly dependent on material behaviour at the atomic scale. To prevent extensive trial-and-error based testing for new technology developments, new powerful quantitative knowledge-based modelling techniques are required. Current continuum-based finite element models rely intrinsically on extensive characterisation efforts to quantify the parameters present in these models (‘top-down’ approach). On the other hand, state-of-the-art models at atomic scale are able to describe the material behaviour at molecular level, but predictions at product scale are not feasible yet. Through direct coupling of molecular and continuum models, a multi-disciplinary approach in which experimentally validated multi-scale modelling methods will be developed in order to generate new materials and interfaces for System-in-Package (SiP) products with tailored properties and improved reliability within an industrial environment. In this approach, a user-friendly software tool will be realised which incorporates chemical, physical and electrical information from the atomic level into macroscopic models (‘bottom-up’ approach). Furthermore, new and efficient micro- and nano-scale measurement techniques are developed for obtaining detailed information about the most important phenomena at micro- and nano-scale and fast characterisation and qualification of SiPs. An additional important distinguishing part of this project is that, due to the composition of the consortium, the whole industrial development chain is covered: from material development, multi-scale models and experimental methods towards a fully functional commercial software package, ready to be used within an industrial environment.'