MiSPIA
Microelectronic Single-Photon 3D Imaging Arraysnfor low-light high-speed Safety and Security Applications
| Coordinatore | POLITECNICO DI MILANO
Organization address
address: Via Golgi 40 contact info |
| Nazionalità Coordinatore | Italy [IT] |
| Totale costo | 3˙401˙019 € |
| EC contributo | 2˙632˙854 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2009-5 |
| Funding Scheme | CP |
| Anno di inizio | 2010 |
| Periodo (anno-mese-giorno) | 2010-06-01 - 2013-12-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
POLITECNICO DI MILANO
Organization address
address: Via Golgi 40 contact info |
IT (Milano) | coordinator | 0.00 |
| 2 |
CENTRO RICERCHE FIAT SCPA
Organization address
address: Strada Torino contact info |
IT (ORBASSANO (TO)) | participant | 0.00 |
| 3 |
CF CONSULTING FINANZIAMENTI UNIONE EUROPEA SRL
Organization address
address: Via Giuseppe Mussi contact info |
IT (MILANO) | participant | 0.00 |
| 4 |
EMZA VISUAL SENSE LTD
Organization address
address: HAYOZMA ST 3 RD contact info |
IL (KAFAR SABA) | participant | 0.00 |
| 5 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: Hansastrasse contact info |
DE (MUNCHEN) | participant | 0.00 |
| 6 |
HERIOT-WATT UNIVERSITY
Organization address
address: Riccarton contact info |
UK (EDINBURGH) | participant | 0.00 |
| 7 |
MICRO PHOTON DEVICES S.R.L.
Organization address
address: Via Stradivari contact info |
IT (BOLZANO) | participant | 0.00 |
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Obiettivo del progetto (Objective)
MiSPIA will develop beyond state-of-the-art photonics technology for array imagers of smart-pixels able to detect single photons. Intelligent in-pixel pre-processing will simultaneously provide ultra high sensitivity (single-photon level), very high frame-rate (up to 200,000fps) and advanced multi-spectral (300-900nm) three-dimensional (3D) distance ranging and two-dimensional (2D) imaging of fast moving objects. MiSPIA detectors will be used in two key applications: long-range (200-1,000m) 2D and 3D active identification in low light level surveillance operations; and very fast (over 200fps) short-range (10-50m) 3D monitoring in automotive pre-crash safety systems. Instead of (slow and noisy) CCDs and CMOS active pixels (with poor sensitivity and noisy electronics), MiSPIA will exploit the ultimate performances of truly-single photon detectors: the Single-Photon Avalanche Diodes (SPAD).nMiSPIA imagers will be based on four different SPAD smart-pixels: 'photon-counting' pixels for 2D imaging; LIDAR pixels for 3D direct 'time-of-flight' (dTOF); two different phase-sensitive pixels for 3D indirect time-of-flight (iTOF) depth acquisitions. Full-size imager chips will be manufactured, characterized and eventually integrated into two 3D ranging cameras deployed into the two end-users applications for validation.nMiSPIA technologies will be both highly-advanced and cost-effective: a high-voltage 0.35µm CMOS processing for front-side illuminated imagers; and a new flipped-chip Silicon-on-Insulator (SOI) CMOS technology for back-side illuminated imagers. Both will prove beyond state-of-the art co-integration of photonic SPAD detectors and CMOS microelectronics for intelligent and dense 2D imaging and 3D ranging high-performance cameras. Such cameras will provide imaging at the quantum limit and on-chip pre-processing at the most effective speed at a drastic reduction of manufacturing costs, down to 5€ per imager chip.nThe developments of the MiSPIA Project will be published on the official website www.mispia.eu.