MiSPIA

Microelectronic Single-Photon 3D Imaging Arraysnfor low-light high-speed Safety and Security Applications

Coordinatore	POLITECNICO DI MILANO    more  Organization address address: Via Golgi 40 city: Milano postcode: 20133 contact info Titolo: Prof. Nome: Franco Cognome: Zappa Email: send email Telefono: 390224000000 Fax: 39022367604
Nazionalità Coordinatore	Italy [IT]
Totale costo	3˙401˙019 €
EC contributo	2˙632˙854 €
Programma	FP7-ICT Specific Programme "Cooperation": Information and communication technologies
Code Call	FP7-ICT-2009-5
Funding Scheme	CP
Anno di inizio	2010
Periodo (anno-mese-giorno)	2010-06-01   -   2013-12-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	POLITECNICO DI MILANO  Organization address address: Via Golgi 40 city: Milano postcode: 20133 contact info Titolo: Prof. Nome: Franco Cognome: Zappa Email: send email Telefono: 390224000000 Fax: 39022367604	IT (Milano)	coordinator	0.00
2	CENTRO RICERCHE FIAT SCPA  Organization address address: Strada Torino city: ORBASSANO (TO) postcode: 10043 contact info Titolo: Dr. Nome: Massimo Cognome: Casali Email: send email Telefono: +39 011 9083492 Fax: +39 011 9083786	IT (ORBASSANO (TO))	participant	0.00
3	CF CONSULTING FINANZIAMENTI UNIONE EUROPEA SRL  Organization address address: Via Giuseppe Mussi city: MILANO postcode: 20154 contact info Titolo: Ms. Nome: Carla Cognome: Finocchiaro Email: send email Telefono: +30 02 310833 1 Fax: +39 02 33614064	IT (MILANO)	participant	0.00
4	EMZA VISUAL SENSE LTD  Organization address address: HAYOZMA ST 3 RD city: KAFAR SABA postcode: 44422 contact info Titolo: Mr. Nome: Eitan Cognome: Ramati Email: send email Telefono: +972 97679333 Fax: +972 9 7653550	IL (KAFAR SABA)	participant	0.00
5	FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V  Organization address address: Hansastrasse city: MUNCHEN postcode: 80686 contact info Titolo: Mr. Nome: Christoph Cognome: Schulte Email: send email Telefono: +49 89 12052728 Fax: +49 89 12057534	DE (MUNCHEN)	participant	0.00
6	HERIOT-WATT UNIVERSITY  Organization address address: Riccarton city: EDINBURGH postcode: EH14 4AS contact info Titolo: Dr. Nome: Eva Cognome: Olszewska-Day Email: send email Telefono: 441315000000 Fax: 441315000000	UK (EDINBURGH)	participant	0.00
7	MICRO PHOTON DEVICES S.R.L.  Organization address address: Via Stradivari city: BOLZANO postcode: 39100 contact info Titolo: Dr. Nome: Roberto Cognome: Biasi Email: send email Telefono: +39 0471 051 212 Fax: +39 0471 501 524	IT (BOLZANO)	participant	0.00

Mappa

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 Obiettivo del progetto (Objective)

MiSPIA will develop beyond state-of-the-art photonics technology for array imagers of smart-pixels able to detect single photons. Intelligent in-pixel pre-processing will simultaneously provide ultra high sensitivity (single-photon level), very high frame-rate (up to 200,000fps) and advanced multi-spectral (300-900nm) three-dimensional (3D) distance ranging and two-dimensional (2D) imaging of fast moving objects. MiSPIA detectors will be used in two key applications: long-range (200-1,000m) 2D and 3D active identification in low light level surveillance operations; and very fast (over 200fps) short-range (10-50m) 3D monitoring in automotive pre-crash safety systems. Instead of (slow and noisy) CCDs and CMOS active pixels (with poor sensitivity and noisy electronics), MiSPIA will exploit the ultimate performances of truly-single photon detectors: the Single-Photon Avalanche Diodes (SPAD).nMiSPIA imagers will be based on four different SPAD smart-pixels: 'photon-counting' pixels for 2D imaging; LIDAR pixels for 3D direct 'time-of-flight' (dTOF); two different phase-sensitive pixels for 3D indirect time-of-flight (iTOF) depth acquisitions. Full-size imager chips will be manufactured, characterized and eventually integrated into two 3D ranging cameras deployed into the two end-users applications for validation.nMiSPIA technologies will be both highly-advanced and cost-effective: a high-voltage 0.35µm CMOS processing for front-side illuminated imagers; and a new flipped-chip Silicon-on-Insulator (SOI) CMOS technology for back-side illuminated imagers. Both will prove beyond state-of-the art co-integration of photonic SPAD detectors and CMOS microelectronics for intelligent and dense 2D imaging and 3D ranging high-performance cameras. Such cameras will provide imaging at the quantum limit and on-chip pre-processing at the most effective speed at a drastic reduction of manufacturing costs, down to 5€ per imager chip.nThe developments of the MiSPIA Project will be published on the official website www.mispia.eu.