CHIPCHECK

Development of Novel X-ray Inspection System for Fast Automated Detection of Counterfeit PCB Components

Coordinatore	TWI LIMITED    more  Organization address address: Granta Park, Great Abington city: CAMBRIDGE postcode: CB21 6AL contact info Titolo: Ms. Nome: Kerry Cognome: Peddar Email: send email Telefono: 441640000000 Fax: 441224000000
Nazionalità Coordinatore	United Kingdom [UK]
Totale costo	1˙499˙852 €
EC contributo	1˙171˙500 €
Programma	FP7-SME Specific Programme "Capacities": Research for the benefit of SMEs
Code Call	FP7-SME-2010-1
Funding Scheme	BSG-SME
Anno di inizio	2010
Periodo (anno-mese-giorno)	2010-10-01   -   2012-12-31

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	TWI LIMITED  Organization address address: Granta Park, Great Abington city: CAMBRIDGE postcode: CB21 6AL contact info Titolo: Ms. Nome: Kerry Cognome: Peddar Email: send email Telefono: 441640000000 Fax: 441224000000	UK (CAMBRIDGE)	coordinator	106˙096.00
2	INNOSPEXION APS  Organization address address: Horseager 14 city: HVALSO postcode: 4330 contact info Titolo: Dr. Nome: Joergen Cognome: Rheinlaender Email: send email Telefono: +45 46409070 Fax: +45 46409044	DK (HVALSO)	participant	370˙738.00
3	ACCENT PRO 2000 s.r.l.  Organization address address: "Nerva Traian 1, K6, Sc. 1, Ap. 26, Sector 3" city: Bucharest postcode: 31041 contact info Titolo: Dr. Nome: Mihai Cognome: Iovea Email: send email Telefono: 40745182660 Fax: 40213204759	RO (Bucharest)	participant	298˙862.50
4	COMPUTERISED INFORMATION TECHNOLOGY LTD  Organization address address: CENTURION COURT 4- 5 BRICK CLOSE KILN FARM city: MILTON KEYNES postcode: MK11 3JB contact info Titolo: Mr. Nome: Subash Chander Cognome: Sood Email: send email Telefono: 441908000000 Fax: 1908260084	UK (MILTON KEYNES)	participant	288˙703.50
5	KENTRO EREVNAS TECHNOLOGIAS KAI ANAPTYXIS THESSALIAS  Organization address address: TECHNOLOGIKO PARKO A VIPE city: VOLOS postcode: 38500 contact info Titolo: Ms. Nome: Georgia Cognome: Pahlitzanakis Email: send email Telefono: 302421000000 Fax: +30 2421096750	EL (VOLOS)	participant	45˙000.00
6	SURFACE MOUNT AND RELATED TECHNOLOGIES LIMITED LBG - SMART GROUP  Organization address address: Easton Street 85 city: High Wycombe postcode: HP11 1LT contact info Titolo: Mr. Nome: Anthony Cognome: Gordon Email: send email Telefono: 441794000000 Fax: 441494000000	UK (High Wycombe)	participant	26˙500.00
7	ELEKTRONIKAS UN DATORZINATNU INSTITUTS  Organization address address: DZERBENES IELA 14 city: RIGA postcode: 1006 contact info Titolo: Ms. Nome: Vanda Cognome: Cekita Email: send email Telefono: 37167558257 Fax: 37167555337	LV (RIGA)	participant	18˙100.00
8	Semicon Sp. z.o.o.  Organization address address: ZWOLENSKA 43/43A city: Warsaw postcode: 04-761 contact info Titolo: Dr. Nome: Jacek Cognome: Tomaszewski Email: send email Telefono: 48226157371 Fax: 48226157375	PL (Warsaw)	participant	17˙500.00

Mappa

 Word cloud

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 Obiettivo del progetto (Objective)

'Currently, electronics manufacturers do not check all PCB components at goods inwards. Some manufacturers make random checks on single components from batches of component lots. However, components especially the surface mount type are typically supplied on tape reels to assist with component feed for automatic component placement. The manufacturer cannot check all the components. Typically, a check includes visual inspection and in circuit testing. However, performing these checks is disadvantageous for two main reasons. Firstly, the tests can be time consuming and secondly it requires the component to be removed from the packaging or reel invalidating any guarantee to a claim should a counterfeit component be found. Currently, no automatic methods exist to speedily check each single component. In addition the cost of modern X-ray inspection systems prohibits their use for smaller manufacturing concerns. ChipCheck proposal is for the development of a novel X-ray inspection system for fast automated detection of counterfeit PCB components. The aim of such a development is to address the above issues. The system will be developed so that is capable of inspecting PCB components on tape reels and other component feeding mechanisms. In addition separate PCB components will also be examinable with the developed system. Through the selected combination of SME partners involved in the consortium, a new design uniquely combining lower cost off-the-shelf components used from different industries (Industrial NDT, Medical and dentistry) will be developed to enable production of a prototype of particular suitability for goods inward inspection.'