SMARTPOWER
Smart integration of GaN & SiC high power electronics for industrial and RF applications
| Coordinatore | THALES SA
Organization address
address: Campus Polytechnique 1, avenue Augustin Fresnel 45 contact info |
| Nazionalità Coordinatore | France [FR] |
| Totale costo | 7˙370˙222 € |
| EC contributo | 5˙075˙000 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2011-7 |
| Funding Scheme | CP |
| Anno di inizio | 2011 |
| Periodo (anno-mese-giorno) | 2011-09-01 - 2015-07-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
THALES SA
Organization address
address: Campus Polytechnique 1, avenue Augustin Fresnel 45 contact info |
FR (Palaiseau Cedex) | coordinator | 0.00 |
| 2 |
BERLINER NANOTEST UND DESIGN GMBH
Organization address
address: VOLMERSTRASSE 7 B contact info |
DE (BERLIN) | participant | 0.00 |
| 3 |
BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM
Organization address
address: MUEGYETEM RAKPART 3 contact info |
HU (BUDAPEST) | participant | 0.00 |
| 4 |
CHALMERS TEKNISKA HOEGSKOLA AB
Organization address
address: - contact info |
SE (GOETEBORG) | participant | 0.00 |
| 5 |
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: RUE LEBLANC 25 contact info |
FR (PARIS 15) | participant | 0.00 |
| 6 |
FOUNDATION FOR RESEARCH AND TECHNOLOGY HELLAS
Organization address
address: N PLASTIRA STR 100 contact info |
EL (HERAKLION) | participant | 0.00 |
| 7 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: HANSASTRASSE 27C contact info |
DE (MUNCHEN) | participant | 0.00 |
| 8 |
INFINEON TECHNOLOGIES AG
Organization address
address: AM CAMPEON 1-12 contact info |
DE (NEUBIBERG) | participant | 0.00 |
| 9 |
INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE
Organization address
address: Erou iancu Nicolae Street 32B contact info |
RO (VOLUNTARI, BUCHAREST) | participant | 0.00 |
| 10 |
MICROPELT GMBH
Organization address
address: EMMY-NOETHER-STRASSE 2 contact info |
DE (FREIBURG) | participant | 0.00 |
| 11 |
SCHNEIDER ELECTRIC INDUSTRIES SAS
Organization address
address: RUE JOSEPH MONIER 35 contact info |
FR (RUEIL MALMAISON) | participant | 0.00 |
| 12 |
SHT SMART HIGH-TECH AB
Organization address
address: FYSIKGRAND 3 contact info |
SE (GOTEBORG) | participant | 0.00 |
| 13 |
TAIPRO ENGINEERING SA
Organization address
address: RUE DES CHASSEURS ARDENNAIS 4 contact info |
BE (LIEGE (ANGLEUR)) | participant | 0.00 |
| 14 |
TECHNISCHE UNIVERSITAET CHEMNITZ
Organization address
address: STRASSE DER NATIONEN 62 contact info |
DE (CHEMNITZ) | participant | 0.00 |
| 15 |
THALES SYSTEMES AEROPORTES SAS
Organization address
address: AV GAY LUSSAC LA CLEF DE SAINT PIERRE 2 contact info |
FR (ELANCOURT) | participant | 0.00 |
Mappa
Word cloud
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
Obiettivo del progetto (Objective)
For industrial motor-drive, UPS and solar inverters applications and aerospace or telecom RF applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their higher performances than the actual technologies (Si and GaAs) in terms of reduction of losses, increase of efficiency and power handling. But to increase the efficiency of the power modules and in the same time reduce their size and make them more cost effective, these SiC and GaN technologies still have to be associated with new efficient cooling and packaging solutions. The goal of SMARTPOWER is to carry out the packaging and thermal management developments required to achieve the efficient and cost-effective implementation of SiC- and GaN-based power modules respectively into industrial power inverters and RF transmitters systems. This main objective is supported in the project by two routes of research:n- The developments of key enabling technologies required to the integration of the power modules into viable systems: efficient and reliable thermal interface materials and electrical interconnect, highly efficient thermoelectric modules andintegrated temperature sensor.n- The development of new 3D packaging techniques and the associated thermal architectures that will allow to integrate the core chips, together with the enabling technologies, in a viable and cost effective manner.nThe RTD developments will be demonstrated into the realisation of two high power modules: (i) SiC-based inverter for UPS, solar and motor-drive applications (ii) GaN-based RF transmitter for aerospace and telecom applications. The SMARTPOWER consortium (15 partners from 7 European States) gathers all the competences required to achieve these objectives. It is well balanced and involves all the supply chain partners in order to anticipate the cost-effective introduction of these new technologies and future products on the market.