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HIOS SIGNED

Highly Integrated Optoelectronic Sensor

Total Cost €

EC-Contrib. €

Partnership

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Outcomes and
results

HIOS project word cloud

Explore the words cloud of the HIOS project. It provides you a very rough idea of what is the project "HIOS" about.

enabler environment outcomes tsl2584tsv wearable optical light pass tool patented market width overlay world lense deposition volume lighting apertures lenses enabled brings molding specifications stacks color ams filters sensors offers hios adding 3d performance optically time tolerances cellular keep phones smart derivatives full tightest alignment leadership derivate smallest stack multiple first prior move sensor lowest uv optoelectronic industry markets size innovations modified band wafer wants integrate stress launch mold competitiveness filter wlm ambient tsv single

Project "HIOS" data sheet

The following table provides information about the project.

Coordinator	AMS AG Organization address address: TOBELBADERSTRASSE 30 city: UNTERPREMSTAETTEN postcode: 8141 website: www.ams.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Austria [AT]
Project website	http://www.fti-hios.eu
Total cost	4˙282˙541 €
EC max contribution	2˙997˙778 € (70%)
Programme	1. H2020-EU.3. (PRIORITY 'Societal challenges) 2. H2020-EU.2. (PRIORITY 'Industrial leadership')
Code Call	H2020-FTIPilot-2015-1
Funding Scheme	IA
Starting year	2016
Duration (year-month-day)	from 2016-08-01 to 2019-07-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	AMS AG AMS AG Organization address address: TOBELBADERSTRASSE 30 city: UNTERPREMSTAETTEN postcode: 8141 website: www.ams.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	AT (UNTERPREMSTAETTEN)	coordinator	1˙471˙341.00
2	BUHLER ALZENAU GMBH BUHLER ALZENAU GMBH Organization address address: SIEMENSSTRASSE 88 city: ALZENAU postcode: 63755 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (ALZENAU)	participant	770˙000.00
3	BOSCHMAN TECHNOLOGIES BV BOSCHMAN TECHNOLOGIES BV Organization address address: STENOGRAAF 3 city: DUIVEN postcode: 6921 EX website: www.boschman.nl contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (DUIVEN)	participant	489˙825.00
4	ADVANCED PACKAGING CENTER BV ADVANCED PACKAGING CENTER BV Organization address address: STENOGRAAF 3 city: DUIVEN postcode: 6921 EX website: www.apcenter.nl contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	NL (DUIVEN)	participant	266˙612.00

Map

Project objective

HIOS (“Highly Integrated Optoelectronic Sensor”) aims to develop and to launch world’s first light sensor with fully integrated optical stack. The fully integrated optically stack technology which will be developed in HIOS project will be the technology enabler which brings the highly integrated optoelectronic sensor to the market. The sensors which will be enabled in the first step are single band and multi band light sensors, namely Ambient Light Sensor and derivate such as UV Sensor & Color Sensor. Three main markets which will be addressed are the Wearable, Low Cost Consumer (smart phones, cellular) & Smart Lighting Market.

ams already offers prior art TSL2584TSV which is industry’s first ambient light sensor with 3D/TSV and single filter integrated at wafer level. In HIOS project the consortium wants to move one step further to ensure also the future competitiveness and keep the market leadership in Europe. HIOS project wants to integrate the full optical stacks including multiple filters, lenses and apertures for the first time and wants to provide a high volume production environment for 3D/TSV Filters Wafer Level Package. The main technical innovations will be Filter tool and processes developed to achieve industry’s tightest filter specifications, Wafer Level Molding tool modified by adding new alignment system to achieve, novel patented lense design and wafer level mold process, filters, lenses and apertures integrated at Wafer Level for the first time and industry’s lowest alignment tolerances as required by the applications. The expected outcomes are a Single band and multi-band light sensors – smallest size and lowest system cost at best optical performance (ambient light sensor and derivatives such as color sensor and UV sensor) and an Equipment which enabling this new application and many other applications; WLM- tightest overlay control; Filter – tightest pass band width control; low stress filter deposition to enable multiple filters.

Deliverables

List of deliverables.
D5.4 Report on final dissemination and communication results	Documents, reports	2020-04-14 15:32:46
D5.2 Report on first 24 month dissemination and communication results	Documents, reports	2020-04-14 15:32:46
D1.5 Final Publishable Activity Report	Documents, reports	2020-04-14 15:32:46

Take a look to the deliverables list in detail: detailed list of HIOS deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2017	Jens-Peter Biethan, Detlef Arhilger, JÃ¼rgen Pistner, Holger Reus, Martin Stapp, Harro Hagedorn High precision optical filter based on magnetron sputtering published pages: 26-31, ISSN: 0947-076X, DOI: 10.1002/vipr.201700654	Vakuum in Forschung und Praxis 29/4	2020-04-14

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The information about "HIOS" are provided by the European Opendata Portal: CORDIS opendata.