#	Pagina
attuale pagina	/open-h2020/projects/219123/index.html
-1	/open-h2020/projects/199978/index.html
-2	/open-h2020/projects/196073/index.html
-3	/open-h2020/projects/221985/index.html
-4	/open-h2020/projects/227089/index.html

Opendata, web and dolomites

Caladan SIGNED

Micro assembled Terabit/s capable optical transceivers for Datacom applications

Total Cost €

EC-Contrib. €

Partnership

Views

Caladan project word cloud

Explore the words cloud of the Caladan project. It provides you a very rough idea of what is the project "Caladan" about.

links gb wafers 6tb circuits manufacturer electronics onto reduces starting bicmos 130nm bottleneck printing fab sequentially demonstrated pic ing pics 1euro techniques dot fiber center sequential piece foundry gaas chips attachment fast packaged despite foresees reduce transceiver ficontec microprince data units british innolume 800gb technique 56gbaud sige telecom pixapp electronic xilinx pilot printed engine receiver quantum semiconductor driver wafer institutes multinational capacity line centers integration coupled consists photonic imec underpin volumes encompasses le eliminating silicon setting basis assembled 000 300mm manufacturing optical transceivers adva least cloud magnitude start mellanox industry 2025 evgroup micro epic ihp pressure proven array time lasers hard celeprint transfer caladan smes servers tyndall

Project "Caladan" data sheet

The following table provides information about the project.

Coordinator	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Belgium [BE]
Total cost	6˙624˙737 €
EC max contribution	5˙846˙728 € (88%)
Programme	1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
Code Call	H2020-ICT-2018-2
Funding Scheme	IA
Starting year	2019
Duration (year-month-day)	from 2019-01-01 to 2022-12-31

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	coordinator	2˙547˙368.00
2	IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK Organization address address: IM TECHNOLOGIEPARK 25 city: FRANKFURT ODER postcode: 15236 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (FRANKFURT ODER)	participant	1˙012˙500.00
3	X-CELEPRINT LIMITED X-CELEPRINT LIMITED Organization address address: 6th Floor, 2 Grand Canal Square city: DUBLIN postcode: 2 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (DUBLIN)	participant	485˙625.00
4	UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK Organization address address: WESTERN ROAD city: Cork postcode: T12 YN60 website: www.ucc.ie contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (Cork)	participant	471˙506.00
5	INNOLUME GMBH INNOLUME GMBH Organization address address: KONRAD-ADENAUER-ALLEE 11 city: DORTMUND postcode: 44263 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (DORTMUND)	participant	355˙162.00
6	FICONTEC SERVICE GMBH FICONTEC SERVICE GMBH Organization address address: REHLAND 8 city: ACHIM postcode: 28832 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (ACHIM)	participant	323˙925.00
7	MELLANOX TECHNOLOGIES LTD - MLNX MELLANOX TECHNOLOGIES LTD - MLNX Organization address address: YOKNEAM ILIT INDUSTRIAL ZONE - HERMON BUILDING city: YOKNEAM postcode: 20692 website: www.mellanox.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IL (YOKNEAM)	participant	322˙953.00
8	EV GROUP E. THALLNER GMBH EV GROUP E. THALLNER GMBH Organization address address: DI ERICH THALLNER STRASSE 1 city: ST FLORIAN AM INN postcode: 4782 website: www.evgroup.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	AT (ST FLORIAN AM INN)	participant	256˙375.00
9	XILINX IRELAND UNLIMITED COMPANY XILINX IRELAND UNLIMITED COMPANY Organization address address: LOGIC DRIVE CITYWEST BUSINESS CAMPU city: DUBLIN postcode: D24T683 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (DUBLIN)	participant	71˙312.00

Map

Project objective

Data centers which underpin the Cloud are under pressure. As the capacity of data center servers is growing, so must the capacity of the links between those servers. Industry foresees a need for high volumes of 800Gb/s and 1.6Tb/s transceivers by 2025. Today, despite the use of complex Photonic Integrated Circuits (PICs), manufacturing an optical transceiver still requires a large number of sequential steps. This is because lasers and electronic chips need to be assembled on a piece-by-piece basis onto the PIC. The resulting optical engine then needs to be coupled to a fiber array and packaged. These steps are done sequentially, creating a bottleneck in the manufacturing line which makes it hard to scale up production and reduce cost. CALADAN will demonstrate how integration of lasers and electronics onto a PIC can be done fully at the wafer-level using the established micro transfer printing technique, thus eliminating this bottleneck. GaAs quantum dot lasers and 130nm SiGe BiCMOS 56Gbaud capable driver and receiver electronics will be transfer printed onto Silicon Photonic 300mm wafers. Starting from proven concepts in PIXAPP, a novel fast fiber attachment process will be demonstrated that reduces the time required for fiber attachment by an order of magnitude. Using these techniques, transceiver cost will be 0.1Euro/Gb/s for volumes of at least 1,000,000 units. The consortium, which consists of three SMEs (X-Celeprint, Innolume and ficonTEC), an LE (EVGroup), three research institutes (IMEC, Tyndall and IHP), a transceiver manufacturer (Mellanox) and a multinational (Xilinx) encompasses all the partners to start production of the targeted optical transceivers after the end of the project. Exploitation of the technology will be supported by an end-user (British Telecom), a semiconductor foundry setting up a micro transfer printing Pilot Line (MICROPRINCE, X-FAB), an optical equipment manufacturer (ADVA) and the European Photonic Industry Consortium (EPIC).

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "CALADAN" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "CALADAN" are provided by the European Opendata Portal: CORDIS opendata.