TDK4PE
Technology & Design Kits for Printed-Electronics
| Coordinatore | UNIVERSITAT AUTONOMA DE BARCELONA
Organization address
address: Edifici Q - Campus UAB s/n contact info |
| Nazionalità Coordinatore | Spain [ES] |
| Totale costo | 4˙415˙812 € |
| EC contributo | 3˙400˙000 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2011-7 |
| Funding Scheme | CP |
| Anno di inizio | 2011 |
| Periodo (anno-mese-giorno) | 2011-10-01 - 2014-09-30 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 | UNIVERSITAT AUTONOMA DE BARCELONA | ES | coordinator | 0.00 |
| 2 |
3D-Micromac AG
Organization address
address: Technologie-Campus contact info |
DE (Chemnitz) | participant | 0.00 |
| 3 |
AGENCIA ESTATAL CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS
Organization address
address: CALLE SERRANO contact info |
ES (MADRID) | participant | 0.00 |
| 4 |
AGENZIA NAZIONALE PER LE NUOVE TECNOLOGIE, L'ENERGIA E LO SVILUPPO ECONOMICO SOSTENIBILE
Organization address
address: Lungotevere Grande Ammiraglio Thaon di Revel 76 contact info |
IT (ROMA) | participant | 0.00 |
| 5 |
FLEXINK
Organization address
address: Millbrook Road East contact info |
UK (Southampton) | participant | 0.00 |
| 6 |
INFINISCALE SA
Organization address
address: CHEMIN DE L'ETOILE contact info |
FR (MONTBONNOT ST MARTIN) | participant | 0.00 |
| 7 |
PHOENIX BV
Organization address
address: HENGELOSESTRAAT contact info |
NL (ENSCHEDE) | participant | 0.00 |
| 8 |
SENSING TEX S.L.
Organization address
address: Passeig Fabra i Puig contact info |
ES (Barcelona) | participant | 0.00 |
| 9 |
TECHNISCHE UNIVERSITAET CHEMNITZ
Organization address
address: STRASSE DER NATIONEN contact info |
DE (CHEMNITZ) | participant | 0.00 |
| 10 |
UNIVERSIDADE DO ALGARVE
Organization address
address: CAMPUS DE PENHA contact info |
PT (FARO) | participant | 0.00 |
Mappa
Word cloud
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Obiettivo del progetto (Objective)
The goal of Technology & Design Kit for Printed Electronics (TDK4PE) is to set a fundamental change in the way printed electronics (PE) are designed and manufactured in Europe, with the aim of reducing costs and time-to-market by more than an order of magnitude for more complex designs than ever before by addressing thousands of transistors on a substrate.The key is to develop a methodology to enable application-specific PE circuit implementation. This will be achieved by adopting a methodology similar to the silicon microelectronics one: using a Technology and Design Kit to abstract physics to a point where engineers could address physical design with sufficient certainty and great freedom for creativity. This TDK will support circuit design at physical, full-custom, and cell-based levels.TDK4PE addresses the whole product and value chain from concept application to material, through design to manufacturing using both S2S and R2R processes. It will establish cell-based design methodologies coupled with technology process flows and supported by Electronic Design Automation (EDA) tools towards mass production. EDA needs building cell libraries based on characterized devices made of functional inks and will enable automatic synthesis of circuits with predictable properties, high yield and improved circuit reliability.Establishing such a methodology is an ambitious task that can only be approached from a consortium possessing a wide range of complementary skills. TDK4PE has brought together such a collaboration of European key players in the fields of materials, inks, printing technologies, manufacturing, modelling, component and system design, microelectronics, EDA tools and applications.Two key points are at the technological opposite poles of this project -FOLAE technology and applications- that shall come together on a seamless way by means of a TDK and its related methodology, which will be the enablers for PE design activities between both of them. This convergence between PE technology and its potential applications will contribute to create a sustainable business sector with potential for significant future growth.