Coordinatore | HUMBOLDT-UNIVERSITAT ZU BERLIN
Organization address
address: UNTER DEN LINDEN 6 contact info |
Nazionalità Coordinatore | Germany [DE] |
Sito del progetto | http://hymec2.physik.hu-berlin.de/ |
Totale costo | 4˙164˙187 € |
EC contributo | 3˙132˙475 € |
Programma | FP7-NMP
Specific Programme "Cooperation": Nanosciences, Nanotechnologies, Materials and new Production Technologies |
Code Call | FP7-NMP-2010-SMALL-4 |
Funding Scheme | CP-FP |
Anno di inizio | 2011 |
Periodo (anno-mese-giorno) | 2011-10-01 - 2014-09-30 |
# | ||||
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1 |
HUMBOLDT-UNIVERSITAT ZU BERLIN
Organization address
address: UNTER DEN LINDEN 6 contact info |
DE (BERLIN) | coordinator | 667˙524.00 |
2 |
NANOTECCENTER WEIZ FORSCHUNGSGESELLSCHAFT MBH
Organization address
address: FRANZ PICHLERSTRASSE 32 contact info |
AT (Weiz) | participant | 662˙867.00 |
3 |
UNIVERSITE DE NAMUR ASBL
Organization address
address: Rue de Bruxelles 61 contact info |
BE (NAMUR) | participant | 400˙984.00 |
4 |
UNIVERSITA DEGLI STUDI DI CAGLIARI
Organization address
address: VIA UNIVERSITA 40 contact info |
IT (CAGLIARI) | participant | 303˙300.00 |
5 |
EBERHARD KARLS UNIVERSITAET TUEBINGEN
Organization address
address: GESCHWISTER-SCHOLL-PLATZ contact info |
DE (TUEBINGEN) | participant | 280˙680.00 |
6 |
UNIVERSITA DEGLI STUDI DI ROMA TOR VERGATA
Organization address
address: VIA ORAZIO RAIMONDO 18 contact info |
IT (ROMA) | participant | 271˙632.00 |
7 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Organization address
address: Rue Michel -Ange 3 contact info |
FR (PARIS) | participant | 259˙716.00 |
8 |
UNIWERSYTET LODZKI
Organization address
address: Ul. Narutowicza 65 contact info |
PL (LODZ) | participant | 170˙172.00 |
9 |
TechOnYou Srl
Organization address
address: Via la Guardia 9/A contact info |
IT (Villasor) | participant | 115˙600.00 |
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'The objectives of the project 'Hybrid organic/inorganic memory elements for integration of electronic and photonic circuitry' (HYMEC) are to resolve fundamental issues of materials science and to realize new hybrid inorganic/organic devices with functionality far beyond current state-of-the-art. This is of direct relevance to the objectives of the FP7-NMP Work Programme, as it calls for 'design novel knowledge-based smart materials with tailored properties, releasing their potential for enhanced and innovative applications'. Specifically, we will perform research towards understanding and controlling all relevant properties of systems comprising inorganic metal nanoparticles embedded in matrices of conjugated organic materials (organic semiconductors), and we will demonstrate the function of such material hybrids as non-volatile memory elements that can be addressed electrically and optically, which thus represent potential interconnects of future hybrid electronic and photonic circuitry. Moreover, we target implementing cost-efficient production routes, such as printing, as well as exploring the ultimate miniaturization of such memory elements by novel sublimation- and imprinting-based nanostructuring processes. Electronic, optical, dielectric, structural, and morphological properties of our systems will be determined using state-of-the-art experimental techniques and modelling to establish a reliable specific knowledge base, which we will exploit for device fabrication and integration. Through our cooperative efforts, we expect to make use of new knowledge for the realization of reliable non-volatile memory elements (NV-ME) employing resistance switching, with a substantial extension of existing NV-ME functionality, i.e., optical addressing of devices in addition to purely electric.'
Non-volatile memory (NVM), in contrast to random access memory, retains information even with no power input. NVM elements that can be addressed optically as well as electrically extend functionality and open new markets.
Despite its huge savings in energy consumption and the potential for much faster data transfer, NVM is currently used as secondary or long-term storage. Enhancements in materials and device capabilities are an important area of research and development. EU-funding of the http://hymec2.physik.hu-berlin.de/ (HYMEC) (Hybrid organic/inorganic memory elements for integration of electronic and photonic circuitry) project supported investigations into the fundamental information storage mechanisms of nano-structured hybrid materials.
New knowledge led to the realisation of NVM elements based on resistance switching and an extension of functionality to enable optical and electrical addressing of devices. Resistance switching refers to a change in resistance of a dielectric when exposed to an electric field or current. Typical systems employ a transition metal oxide dielectric and an ordinary metal electrode. The change in resistance is non-volatile and reversible.
HYMEC identified the resistance switching mechanisms of a system consisting of inorganic metal nanoparticles embedded in matrices of conjugated organic materials (organic semiconductors). It is based on filament formation rather than charge storage on the metal nanoparticles, as has been assumed to date.
This discovery meant that direct manipulation of the resistance by light was not possible. The team turned its attention to the device's diode in series with the memory that was used to implement the single memory elements into a device network. By using the diode instead of the memory resistor for the optical addressing, HYMEC successfully extended the functionality of the NVM element without compromising overall system performance.
The team used a combination of state-of-the-art experimental and theoretical techniques to extensively characterise system properties. Enhanced understanding supported establishment of reliable design rules for such devices in technologically relevant applications and was instrumental in establishing cost-efficient production routes. Researchers also explored miniaturisation of NVM elements by novel nano-structuring processes.
HYMEC NVM technology that is both electrically and optically accessible is expected to have major impact on a new generation of devices integrating photonics and electronics. Low-cost production and miniaturisation will further enhance the attractiveness of the functionality for a leading European role in a growing market sector.