UNIPACK

Universal Failsafe IGBT Package for robust power transmission

Coordinatore	APPLIED MATERIALS TECHNOLOGY LIMITED    more  Organization address address: FARRIER ROAD LYDON BUSINESS PARK Units 6-7 city: LINCOLN postcode: LN6 3RU contact info Titolo: Mr. Nome: Iain Cognome: Glass Email: send email Telefono: +44 1522500050
Nazionalità Coordinatore	United Kingdom [UK]
Totale costo	1˙499˙786 €
EC contributo	1˙087˙003 €
Programma	FP7-SME Specific Programme "Capacities": Research for the benefit of SMEs
Code Call	FP7-SME-2011
Funding Scheme	BSG-SME
Anno di inizio	2011
Periodo (anno-mese-giorno)	2011-12-01   -   2013-11-30

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	APPLIED MATERIALS TECHNOLOGY LIMITED  Organization address address: FARRIER ROAD LYDON BUSINESS PARK Units 6-7 city: LINCOLN postcode: LN6 3RU contact info Titolo: Mr. Nome: Iain Cognome: Glass Email: send email Telefono: +44 1522500050	UK (LINCOLN)	coordinator	476˙274.25
2	NIMESIS TECHNOLOGY  Organization address address: RUE DES ARTISANS - FRONTIGNY 4 city: MECLEUVES postcode: 57245 contact info Titolo: Mr. Nome: Alain Cognome: Hautcoeur Email: send email Telefono: +33 387742687 Fax: +33 3 87 35 62 10	FR (MECLEUVES)	participant	308˙676.70
3	DYNEX SEMICONDUCTOR LIMITED  Organization address address: DODDINGTON ROAD city: LINCOLN postcode: LN6 3LF contact info Titolo: Mr. Nome: Philip Cognome: Arnold Email: send email Telefono: +44 1522 502908 Fax: +44 1522 500020	UK (LINCOLN)	participant	137˙576.00
4	H V WOODING LIMITED  Organization address address: "RANGE ROAD INDUSTRIAL ESTATE, RANGE ROAD" city: HYTHE postcode: CT21 6HG contact info Titolo: Mr. Nome: Paul Cognome: Allen Email: send email Telefono: +44 1303264471	UK (HYTHE)	participant	84˙749.75
5	MICROPLAST AS  Organization address address: WESSELS VEG 2 city: STJORDAL postcode: 7500 contact info Titolo: Ms. Nome: Gunnhild Cognome: Granmo Email: send email Telefono: +47 74 83 98 05 Fax: +47 74 83 98 01	NO (STJORDAL)	participant	79˙726.75
6	FUNDACION TECNALIA RESEARCH & INNOVATION  Organization address address: PARQUE TECNOLOGICO DE MIRAMON PASEO MIKELETEGI 2 city: DONOSTIA-SAN SEBASTIAN postcode: 20009 contact info Titolo: Ms. Nome: Cristina Cognome: Jimenez Email: send email Telefono: +34 946 430 850 Fax: +34 946 460 900	ES (DONOSTIA-SAN SEBASTIAN)	participant	0.00
7	NOVAMINA CENTAR INOVATIVNIH TEHNOLOGIJA DOO  Organization address address: JACKOVINSLI KLANEC 17 city: Zagreb postcode: 10000 contact info Titolo: Ms. Nome: Jasmina Cognome: Petrinovic Email: send email Telefono: +385 1 6504 391 Fax: +385 1 6504 408	HR (Zagreb)	participant	0.00
8	THE UK MATERIALS TECHNOLOGY RESEARCH INSTITUTE LIMITED  Organization address address: MIDDLE ASTON HOUSE city: MIDDLE ASTON OXFORDSHIRE postcode: OX25 5PT contact info Titolo: Mr. Nome: Stuart Cognome: Martin Email: send email Telefono: +4 1664501452	UK (MIDDLE ASTON OXFORDSHIRE)	participant	0.00

Mappa

 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

 Obiettivo del progetto (Objective)

'Through a mixture of applied research and development, the Uni-Pack project will deliver technologies to reduce the manufacturing costs and improve the performance of plastic packaged IGBT (Insulated gate bipolar transistor) modules, in particular those for use in Voltage Source Converters (VSC) for High Voltage Direct Current (HVDC) power transmission. VSC technology enables efficient access to renewable energy sources and economic connection to the electric utilities grid. Trade studies have identified target IGBT module performance parameters for the HVDC market sector and the need to address the influence of gate drive strategies on converter cell/ module performance. Tailoring of IGBT structures for on-state/ switching loss trade-off across each market sector will be demonstrated and applied to develop 4.5KV enhanced DMOS and /or trench IGBT die exhibiting optimum performance for HVDC transmission. Applied research into a high thermal performance low profile package, designed for low inductance and having fully bonded interconnects will deliver step improvements in performance / reliability and reduced manufacturing cost. An important characteristic of the package will be its capability to fail to short circuit, a feature which is highly beneficial in reducing the system costs. A VSC system is currently in the design stage using standard IGBT modules and this will be used as a benchmark to demonstrate and quantify the degree of success.'

Introduzione (Teaser)

Failing stacked switches in voltage source converters (VSCs) can lead to loss of power, causing disruption to processes. New technology provides an innovative route to avoid power losses in the plurality of power transmission and distribution applications.