Coordinatore | UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Organization address
address: Dyke Parade contact info |
Nazionalità Coordinatore | Ireland [IE] |
Totale costo | 5˙123˙890 € |
EC contributo | 3˙295˙000 € |
Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
Code Call | FP7-ICT-2011-8 |
Funding Scheme | CP |
Anno di inizio | 2012 |
Periodo (anno-mese-giorno) | 2012-10-01 - 2015-09-30 |
# | ||||
---|---|---|---|---|
1 |
UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Organization address
address: Dyke Parade contact info |
IE (Cork) | coordinator | 0.00 |
2 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Organization address
address: RUE MICHEL -ANGE contact info |
FR (PARIS) | participant | 0.00 |
3 |
INFINEON TECHNOLOGIES AG
Organization address
address: Am Campeon 1-12 contact info |
DE (Neubiberg) | participant | 0.00 |
4 |
INFINEON TECHNOLOGIES AUSTRIA AG
Organization address
address: SIEMENSSTRASSE 2 contact info |
AT (VILLACH) | participant | 0.00 |
5 |
INSTITUT NATIONAL DES SCIENCES APPLIQUEES DE LYON
Organization address
address: Avenue Albert Einstein contact info |
FR (VILLEURBANNE) | participant | 0.00 |
6 |
IPDIA SA
Organization address
address: RUE DE LA GIRAFE contact info |
FR (CAEN) | participant | 0.00 |
7 |
ROBERT BOSCH GMBH
Organization address
address: Robert-Bosch Platz contact info |
DE (GERLINGEN-SCHILLERHOEHE) | participant | 0.00 |
8 |
UNIVERSIDAD POLITECNICA DE MADRID
Organization address
address: AVENIDA RAMIRO DE MAEZTU contact info |
ES (MADRID) | participant | 0.00 |
9 |
UNIVERSITE LYON 1 CLAUDE BERNARD
Organization address
address: BOULEVARD DU 11 NOVEMBRE 1918 NUM43 contact info |
FR (VILLEURBANNE CEDEX) | participant | 0.00 |
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Europe is a world leader in innovative automotive systems with competencies covering the full supply chain from the main OEMs (Audi, BMW, Daimler, Fiat, PSA, RSA, VW) to Tier1 suppliers (Bosch, Continental, Magneti Marelli) to leading semiconductor companies (Infineon, ST). The vision for electronic automotive control units in 2020 is that the battery will supply multi-core µControllers via multiple power supplies using an on-chip, granular power management system architecture, known as PowerSoC (Power Supply on Chip). The PowerSwipe proposal will address a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology with novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, in a 3D heterogeneous stack, using eWLB technology, with the µController chip. To achieve this miniaturisation of the power passives, the switching frequency of the switched mode dc-dc converter needs to be increased from the traditional 1 to 5 MHz space (with 90% converter efficiency) into the 20MHz to 100MHz range, at which point the footprint of the power passives is comparable to the footprint of the individual on-chip DC-DC converter blocks (i.e. 1 to 2mm2). PowerSwipe will deliver a European supply chain for PowerSoC by addressing the challenges of system design, engineering, technology and manufacturability of integrated power management systems or PowerSoC (Power Supply on Chip) for nanoCMOS System on Chip (SOC).
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