MERMIG

Modular CMOS Photonic Integrated Micro-Gyroscope

 Coordinatore UNIVERSITAT POLITECNICA DE VALENCIA 

 Organization address address: CAMINO DE VERA SN EDIFICIO 3A
city: VALENCIA
postcode: 46022

contact info
Titolo: Mr.
Nome: José Antonio
Cognome: Pérez García
Email: send email
Telefono: 34963877409
Fax: 34963877949

 Nazionalità Coordinatore Spain [ES]
 Totale costo 1˙951˙103 €
 EC contributo 1˙495˙364 €
 Programma FP7-SPACE
Specific Programme "Cooperation": Space
 Code Call FP7-SPACE-2012-1
 Funding Scheme CP-FP
 Anno di inizio 2012
 Periodo (anno-mese-giorno) 2012-11-01   -   2015-10-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    UNIVERSITAT POLITECNICA DE VALENCIA

 Organization address address: CAMINO DE VERA SN EDIFICIO 3A
city: VALENCIA
postcode: 46022

contact info
Titolo: Mr.
Nome: José Antonio
Cognome: Pérez García
Email: send email
Telefono: 34963877409
Fax: 34963877949

ES (VALENCIA) coordinator 212˙038.50
2    DAS PHOTONICS SL

 Organization address address: "CALLE ISLAS CANARIAS, 6 - 8"
city: VALENCIA
postcode: 46023

contact info
Titolo: Dr.
Nome: Andreas
Cognome: Hakansson
Email: send email
Telefono: 34963556150

ES (VALENCIA) participant 416˙264.73
3    IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK

 Organization address address: IM TECHNOLOGIEPARK 25
city: FRANKFURT (ODER)
postcode: 15236

contact info
Titolo: Mr.
Nome: Uwe
Cognome: George
Email: send email
Telefono: 493356000000
Fax: 493356000000

DE (FRANKFURT (ODER)) participant 309˙999.50
4    MODULIGHT OY

 Organization address address: HERMIANKATU 22
city: TAMPERE
postcode: 33720

contact info
Titolo: Mrs.
Nome: Guina
Cognome: Anca
Email: send email
Telefono: 358207000000

FI (TAMPERE) participant 198˙032.00
5    POLITECNICO DI BARI

 Organization address address: VIA E ORABONA 4
city: BARI
postcode: 70125

contact info
Titolo: Prof.
Nome: Pietro
Cognome: Camarda
Email: send email
Telefono: 390806000000
Fax: 390806000000

IT (BARI) participant 140˙800.00
6    CONSTELEX TECHNOLOGY ENABLERS LTD

 Organization address address: Ikoniou 17
city: Athens
postcode: 13675

contact info
Titolo: Dr.
Nome: Leontios
Cognome: Stampoulidis
Email: send email
Telefono: 302118000000
Fax: 302118000000

EL (Athens) participant 133˙435.27
7    AIRBUS DEFENCE AND SPACE SAS

 Organization address address: 51-61 Route de Verneuil
city: LES MUREAUX
postcode: 78130

contact info
Titolo: Mr.
Nome: Xavier
Cognome: Calmet
Email: send email
Telefono: +33 5 62 19 74 57

FR (LES MUREAUX) participant 84˙794.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

lithography    modular    astrium    suitable    couple    fabricated    opto    electronic    fabrication    power    satellites    nano    amplifier    weigh    payload    satellite    scientific    lt    packaging    heavy    lasing    cmos    kg    nm    nil    gyroscopes    cavity    imprint    technologies    telecommunications    gyroscope    mw    axis    fibre    fiber    mm    photonic    bulky    mermig    first    period    orbit    optic    micro    reporting    sensing    sensor    optical    size    space    cm    replacing    laser    silicon    chip    generation   

 Obiettivo del progetto (Objective)

'Space system vendors seek for solutions to deliver small size and cost-effective sensor systems to “de-congest” satellite payloads, drastically reduce the equipment cost and open the possibility for new generation of micro-payload systems. MERMIG aims to provide this technology replacing current expensive, bulky, heavy and power-consuming fiber optic gyroscopes (FOGs). To address these key challenges, MERMIG invests in the right mix of silicon photonic CMOS-compatible component fabrication and nano-imprint lithography laser fabrication. Both technologies are being adopted by the terrestrial telecom market and MERMIG will develop them for bringing their unique advantages into space sensor systems. MERMIG will squeeze the bulky FOG into a couple of cm2, integrating a racetrack cavity, pin junctions and a phase decoder into compact sub-micron waveguides. The MERMIG “smart” packaging technique will allow power-efficient optical pumping and hermetic packaging of the gyro-photonic chip. MERMIG will develop the first 1550nm high-power laser with a fiber-coupled power of 150mW using an integrated laser MOPA, fabricated with advanced nano-imprint lithography (NIL). The 150mW delivered will enable a modular architecture, with pump sharing among 3 integrated silicon lasing cavities, for 3-axis sensing. The single-step NIL process enables fast wafer scale patterning and ensures low-cost and high-volume laser production. Finally, MERMIG will bring together photonics and electronics on a fully-functional opto-electronic gyroscope system prototype characterized according to ASTRIUM testplan procedures. MERMIG will deliver to ASTRIUM a new generation gyroscope that will weigh <1kg, consume <5W electrical power in a few cm3 footprint. The angle random walk range that will be feasible within MERMIG is 0.1 – 0.01 deg/sqrt(hr) suitable for telecommunications and scientific satellites. The technology full potential can allow for future opto-electronic integration of photonic “gyroscopes-on-a-chip”.'

Introduzione (Teaser)

As every gramme and centimetre matters when launching satellites into orbit, an EU-funded project is working on minimising the size and weight of their attitude control systems.

Descrizione progetto (Article)

The EU-funded project 'Modular CMOS photonic integrated micro-gyroscope' (http://www.mermig-space.eu/ (MERMIG)) aims to make way for extra satellite payload by replacing the bulky and heavy fibre optic gyroscope. The six academic and industrial MERMIG partners are building a micro-gyroscope that will weigh less than 1 kg and be smaller than a couple centimetres cubed to take its place.

For this new generation of micro-gyroscopes capable of withstanding the harsh environment of satellites placed in geostationary orbit, they are exploiting the latest advances in silicon nanophotonics. Specifically, complementary metal-oxide semiconductor (CMOS) technology used to integrate electronic and optical elements on the same chip is being combined with nano-imprint lithography.

MERMIG partners are adapting both technologies for space sensor systems. During the first reporting period, they squeezed the heavy and large fibre-based opticalcavity to a couple millimetres squared. All the key functionalities of an optical cavity-based sensor were integrated into a silicon photonic chip of 4.84 mm x 1 mm. In the next reporting period, the chip will be further developed to demonstrate Raman lasing.

Furthermore, MERMIG project members built a 1 550 nm laser that can deliver optical power up to 150 mW with a driving current of about 1 A. Fabricated by means of nano-imprint lithography, it is complemented by an optical fibre-based amplifier improving the output power. In a master oscillator power amplifier configuration, the laser together with the amplifier is suitable for three-axis sensing and diverse space applications.

The high-frequency noise added to the signal is so low that the new micro-gyroscope will be suitable for telecommunications as well as scientific satellites. On the other hand, it will also meet the stringent mass constraints of rovers used in planetary exploration missions. The photonic gyroscope circuits can be fabricated in high volumes at low cost with exciting prospects for the European space industry.

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