Coordinatore | COOLTECH SRL
Organization address
address: Via Mattei 30 contact info |
Nazionalità Coordinatore | Italy [IT] |
Totale costo | 1˙336˙368 € |
EC contributo | 1˙029˙000 € |
Programma | FP7-SME
Specific Programme "Capacities": Research for the benefit of SMEs |
Code Call | FP7-SME-2013 |
Funding Scheme | BSG-SME |
Anno di inizio | 2013 |
Periodo (anno-mese-giorno) | 2013-09-01 - 2015-08-31 |
# | ||||
---|---|---|---|---|
1 |
COOLTECH SRL
Organization address
address: Via Mattei 30 contact info |
IT (FIORANO) | coordinator | 275˙187.00 |
2 |
AQUASIUM TECHNOLOGY LTD
Organization address
address: PEMBROKE AVENUE 43 DENNY INDUSTRIAL contact info |
UK (CAMBRIDGE) | participant | 259˙350.10 |
3 |
DTK ELECTRONICS OOD
Organization address
address: TZARIGRADSKO SHOSSE BLVD 133 ET 2 of 205 contact info |
BG (SOFIA) | participant | 224˙328.20 |
4 |
WLB LIMITED
Organization address
address: ZINONOS SOZOU (OFFICE 103) 11 contact info |
CY (LEFKOSIA) | participant | 163˙608.70 |
5 |
TWI LIMITED
Organization address
address: Granta Park, Great Abington contact info |
UK (CAMBRIDGE) | participant | 62˙551.00 |
6 |
CENTRE DE RECHERCHE EN AERONAUTIQUE ASBL - CENAERO
Organization address
city: GOSSELIES contact info |
BE (GOSSELIES) | participant | 43˙975.00 |
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
'By combining a new surface engineering process with state-of-the-art thermal modelling, significant design and performance improvements to heat exchangers for electronic and electrical systems can be made. The surface designs created will not only provide an increase in surface area (allowing for smaller size heat exchanger packaging), but also enable ‘designed’ flow over a surface (which will enhance its heat transfer potential). These benefits will place a consortium of SMEs in a position to compete against competition from countries with cheaper labour overheads and the potential for charging a price premium for specialised systems, increasing their profitability and generating value in the EU economy.
There is a drive towards miniaturisation of electronic devices as well as requirements for higher power applications. The size of the heat exchangers necessary is the limiting factor for package size. By combining a European surface processing technology with complex computational fluid dynamics (CFD) modelling, heat exchange surfaces will be customised and optimised. The result will be optimised, efficient heat exchangers for the next generation of electronic devices.
Conventional heat exchanger manufacturing processes are extensively developed and only small future efficiency improvements are likely to arise. The Heat-Sculptor project will generate an enabling technology that will increase the performance of heat exchangers by >23%. Until now, designs have been constrained by production technologies e.g. machining or chemical etching. The new electron beam surface engineering process, Surfi-Sculpt®, has the capability to rapidly create complex ‘Heat-Sculptor’ surface geometries that are not possible with existing techniques.'
Production of heat is a natural consequence of electron flow through a conductor with resistance. As current heat exchanger capabilities near their limits, a simple modification to the structure of the heat-exchanging surface will have major impact.
"Establishing the scientific bases and technical procedures and standards to recover the European flat oyster production through strategies to tackle the main constraint, bonamiosis."
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