MEMSPACK

Zero- and First-level Packaging of RF-MEMS

Coordinatore	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW    more  Organization address address: Kapeldreef 75 city: Leuven postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: 3216281613 Fax: 3216281812
Nazionalità Coordinatore	Belgium [BE]
Totale costo	4˙468˙387 €
EC contributo	3˙400˙000 €
Programma	FP7-ICT Specific Programme "Cooperation": Information and communication technologies
Code Call	FP7-ICT-2007-2
Funding Scheme	CP
Anno di inizio	2008
Periodo (anno-mese-giorno)	2008-06-01   -   2012-02-29

 Partecipanti

#	participant	country	role	EC contrib. [€]
1	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW  Organization address address: Kapeldreef 75 city: Leuven postcode: 3001 contact info Titolo: Ms. Nome: Christine Cognome: Van Houtven Email: send email Telefono: 3216281613 Fax: 3216281812	BE (Leuven)	coordinator	0.00
2	CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE  Organization address address: Rue Michel -Ange city: PARIS postcode: 75794 contact info Titolo: Mr. Nome: Gilles Cognome: Pulvermuller Email: send email Telefono: +33320125 80 Fax: +33320630 04	FR (PARIS)	participant	0.00
3	FONDAZIONE BRUNO KESSLER  Organization address address: VIA SANTA CROCE city: TRENTO postcode: 38122 contact info Titolo: Mr. Nome: Umberto Cognome: Silvestri Email: send email Telefono: +390461314 37 Fax: +390461314 58	IT (TRENTO)	participant	0.00
4	FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V  Organization address address: Hansastrasse city: MUENCHEN postcode: 80686 contact info Titolo: Ms. Nome: Andrea Cognome: Zeumann Email: send email Telefono: +49891205 272 Fax: +49891205 753	DE (MUENCHEN)	participant	0.00
5	MEMS TECHNICAL CONSULTANCY  Organization address address: IDENSLAAN city: SCHOORL postcode: 1871 CS contact info Titolo: Dr. Nome: Siebe Cognome: Bouwstra Email: send email Telefono: 31725095017 Fax: 31847183609	NL (SCHOORL)	participant	0.00
6	TEKNOLOGIAN TUTKIMUSKESKUS VTT  Organization address address: Vuorimiehentie city: ESPOO postcode: 02044 VTT contact info Titolo: Ms. Nome: Eija Cognome: Hyvönen Email: send email Telefono: +35820722 240 Fax: +35820722 232	FI (ESPOO)	participant	0.00
7	UNIVERSITA DEGLI STUDI DI PERUGIA  Organization address address: PIAZZA DELL' UNIVERSITA 1 city: PERUGIA postcode: 6123 contact info Titolo: Mr. Nome: Giovanni Cognome: Magara Email: send email Telefono: +39075585 365 Fax: +39075585 36	IT (PERUGIA)	participant	0.00
8	UNIVERSITE DES SCIENCES ET TECHNOLOGIES DE LILLE - LILLE I  Organization address address: BATIMENT A3 CITE SCIENTIFIQUE city: VILLENEUVE D'ASCQ postcode: 59655 contact info Titolo: Ms. Nome: Noémie Cognome: Lansiaux Email: send email Telefono: 33320434319	FR (VILLENEUVE D'ASCQ)	participant	0.00

Mappa

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 Obiettivo del progetto (Objective)

Future personal and ground RF communications systems and communications satellites necessitate the use of highly integrated RF front-ends, featuring small size, low weight, high performance and low cost. Off-chip, bulky passive RF components, like discrete PIN diode switches and ceramic filters, are limiting further chip scaling. MEMS technology is now rapidly emerging as an enabling technology to yield a new generation of high-performance RF-MEMS passives, like switches, high-Q resonators and tunable filters.nToday, the commercialization of RF-MEMS, is greatly hampered by two critical success factors, namely, the development of an appropriate packaging technology and solving the reliability issues. There has not been sufficient effort towards solving these issues in Europe. The proposed MEMPACK project tackles the packaging issue. The project's objective is to (further) develop and to characterize generic wafer-level (or 0-level) and 1-level packaging solutions for housing a large variety of RF-MEMS. The project will address all relevant issues of the development chain, i.e., the design of the package (including RF design, thermomechanical design, design for reliability), the packaging technology (e.g., 0-level 'chip capping' technology, 0-level 'thin film capping', 1-level packaging technology), the package characterization (RF, temperature stability, hermeticity) and the package evaluation (impact of the package on the device performance, towards meeting industrial specifications). As the potential and future for RF-MEMS is likely to be situated in the monolithic (SoC) and/or module (SiP) integration of RF-MEMS components, the impact, the constraints and the potential of the RF-MEMS packaging on the system integration will be studied as well. One of the expected outcomes of the project will be an 'RF-MEMS packaging design guideline', that can effectively be used by industry for the development of RF-MEMS.