BIANCHO

BIsmide And Nitride Components for High temperature Operation

 Coordinatore UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK 

 Organization address address: Lee Maltings
city: Cork

contact info
Titolo: Mr.
Nome: Conor
Cognome: Delaney
Email: send email
Telefono: +353 21 4904263
Fax: +353 21 4904058

 Nazionalità Coordinatore Ireland [IE]
 Totale costo 2˙876˙450 €
 EC contributo 2˙189˙999 €
 Programma FP7-ICT
Specific Programme "Cooperation": Information and communication technologies
 Code Call FP7-ICT-2009-5
 Funding Scheme CP
 Anno di inizio 2010
 Periodo (anno-mese-giorno) 2010-07-01   -   2014-07-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK

 Organization address address: Lee Maltings
city: Cork

contact info
Titolo: Mr.
Nome: Conor
Cognome: Delaney
Email: send email
Telefono: +353 21 4904263
Fax: +353 21 4904058

IE (Cork) coordinator 0.00
2    PHILIPPS UNIVERSITAET MARBURG

 Organization address address: Biegenstrasse
city: MARBURG

contact info
Titolo: Dr.
Nome: Christian
Cognome: Veldman
Email: send email
Telefono: +49 6421 2826022
Fax: +49 6421 2826382

DE (MARBURG) participant 0.00
3    THE CENTRE FOR INTEGRATED PHOTONICS LIMITED

 Organization address address: B55 ADASTRAL PARK, MARTLESHAM HEATH
city: IPSWICH, SUFFOLK

contact info
Titolo: Ms.
Nome: Leigh
Cognome: Hepplethwaite
Email: send email
Telefono: +44 1473663111
Fax: +44 1473663295

UK (IPSWICH, SUFFOLK) participant 0.00
4    UNIVERSITY OF SURREY

 Organization address address: Stag Hill
city: GUILDFORD

contact info
Titolo: Ms.
Nome: SUE
Cognome: ANGULATTA
Email: send email
Telefono: +44 1483 682687
Fax: +44 1483 689567

UK (GUILDFORD) participant 0.00
5    VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECHNOLOGIJOS MOKSLU CENTRAS

 Organization address address: Savanoriu
city: VILNIUS

contact info
Titolo: Prof.
Nome: Jolanta
Cognome: Juodiene
Email: send email
Telefono: +370 5 2661 640
Fax: +370 5 2627123

LT (VILNIUS) participant 0.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

structure    temperature    photonic    reduce    dilute    losses    energy    recombination    auger    gap    optical    uncooled    dependence    eams    soas    band    biancho    lasers    power    components   

 Obiettivo del progetto (Objective)

BIANCHO will develop photonic components designed to significantly reduce power consumption at the component and system level in advanced communication systems, thereby saving significant electricity, and enabling unlimited bandwidth through integration, more optical processing and very high spectral-density photonic transmission.

Current telecomm components suffer severely from intrinsic losses. Around 80% of electrical power is wasted in a 1.55?m laser chip as heat. Most systems require thermo-electric coolers and an air-conditioned environment, further increasing the energy budget by over an order of magnitude. The losses are due to Auger recombination in semiconductor lasers and optical amplifiers (SOAs), and due to the temperature dependence of the energy gap in electro-absorption modulators (EAMs). Incremental approaches to overcome these problems have reached their limits. We propose a radical change, to manipulate the electronic band structure of novel dilute bismide and dilute nitride alloys of GaAs and InP to eliminate Auger recombination and dramatically reduce the temperature dependence of the energy gap. This allows us to research, develop, test and demonstrate uncooled EAMs, highly efficient uncooled lasers and SOAs. These properties are also highly beneficial for high speed photodiodes as required in transceivers, as will be demonstrated.

BIANCHO brings together leading European groups with complementary expertise in epitaxy, device physics, band structure modelling and advanced design and fabrication, in a well focused consortium of exceptionally high quality. The project will strongly emphasise the protection of intellectual property and aggressive dissemination of results to maximize their impact. The team includes a key European component manufacturer (CIP), well connected to European and international network and system operators, providing a clear route to successful exploitation and commercialization of the technology.

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