PASTA
Integrating Platform for Advanced Smart Textile Applications
| Coordinatore | INTERUNIVERSITAIR MICRO-ELECTRONICACENTRUM IMEC VZW
Organization address
address: Kapeldreef 75 contact info |
| Nazionalità Coordinatore | Belgium [BE] |
| Totale costo | 8˙752˙206 € |
| EC contributo | 6˙500˙000 € |
| Programma | FP7-ICT
Specific Programme "Cooperation": Information and communication technologies |
| Code Call | FP7-ICT-2009-5 |
| Funding Scheme | CP |
| Anno di inizio | 2010 |
| Periodo (anno-mese-giorno) | 2010-10-01 - 2015-03-31 |
Partecipanti
| # | ||||
|---|---|---|---|---|
| 1 |
INTERUNIVERSITAIR MICRO-ELECTRONICACENTRUM IMEC VZW
Organization address
address: Kapeldreef 75 contact info |
BE (LEUVEN) | coordinator | 0.00 |
| 2 |
ASSOCIATION POLE EUROPEEN DE PLASTURGIE
Organization address
address: RUE PIERRE ET MARIE CURIE 2 contact info |
FR (BELLIGNAT) | participant | 0.00 |
| 3 |
ASYRIL SA
Organization address
address: Z.I. LE VIVIER 16 contact info |
CH (VILLAZ-ST-PIERRE) | participant | 0.00 |
| 4 |
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Organization address
address: RUE LEBLANC 25 contact info |
FR (PARIS 15) | participant | 0.00 |
| 5 |
CP AUTOMATION SA
Organization address
address: ZONE INDUSTRIELLE LE VIVIER 16 contact info |
CH (VILLAZ SAINT PIERRE) | participant | 0.00 |
| 6 |
CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT
Organization address
address: RUE JAQUET DROZ 1 contact info |
CH (NEUCHATEL) | participant | 0.00 |
| 7 |
ETTLIN SPINNEREI UND WEBEREI PRODUKTIONS GMBH & CO KG
Organization address
address: PFORZHEIMER STRASSE 202 contact info |
DE (ETTLINGEN) | participant | 0.00 |
| 8 |
FOV FABRICS AB
Organization address
address: NORRBY LANGGATA 45 contact info |
SE (BORAS) | participant | 0.00 |
| 9 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V
Organization address
address: HANSASTRASSE 27C contact info |
DE (MUNCHEN) | participant | 0.00 |
| 10 |
FUNDICO BVBA
Organization address
address: GRUUTHUSELAAN 19 contact info |
BE (OOSTKAMP) | participant | 0.00 |
| 11 |
HOLDING TEXTILE HERMES SAS
Organization address
address: CHEMIN DES MURIERS 16 contact info |
FR (PIERRE BENITE) | participant | 0.00 |
| 12 |
NIKE TECH MARIESTAD AB
Organization address
address: MILSTENSGATAN 7 contact info |
SE (MARIESTAD) | participant | 0.00 |
| 13 |
PRIMO1D
Organization address
address: 7 PARVIS LOUIS NEEL contact info |
FR (GRENOBLE) | participant | 0.00 |
| 14 |
SAECHSISCHES TEXTILFORSCHUNGSINSTITUT E .V.
Organization address
address: Annabergerstrasse 240 contact info |
DE (CHEMNITZ) | participant | 0.00 |
Mappa
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Obiettivo del progetto (Objective)
The PASTA project will combine electronic packaging research and textile research to realize an innovative approach of smart textile. By introducing new concepts for electronic packaging and module interconnect, a seamless, more comfortable and more robust integration of electronics in textile will be possible. The main technological developments concentrate on a new concept for bare die integration into a yarn (by means of micromachining), a new interconnect technology based on mechanical crimping and the development of a stretchable interposer serving as a stress relief interface between the rigid component and the elastic fabric. Integration into the yarn will be used for small components and modules (< 1 mm), so that they can be fully integrated and encapsulated and further used in weaving. Larger modules for crimp contacts and with stretchable interposers are mounted on top of fabric substrates. Mechanical simulations will support these technological developments. A dedicated work package on fabric technologies will focus on fabric modifications for accommodating the new electronic packages : conductive yarns and textile-based sensors will be integrated into the basic fabric. And finally, dedicated equipment and manufacturing platforms will be developed for smart textile fabrication with the PASTA technologies. The technologies will be assessed in a functional evaluation and reliability testing program.The proposed solutions for integration of electronics in textile cover a whole range of components, from ultra small LEDs to complex multichip modules. A system design task will tackle the power distribution and system partitioning aspects. This assures that a complete solution is available for integration of a distributed sensor/actuator system in fabric. The concept for the new electronics integration technology will be shown in 4 different demonstrators in the area of technical textiles, sports and leisure wear, home textiles and bed linen.